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    • 28. 发明授权
    • Failure analysis methods and systems
    • 故障分析方法和系统
    • US07271012B2
    • 2007-09-18
    • US10891828
    • 2004-07-14
    • Gregory B. Anderson
    • Gregory B. Anderson
    • G01R31/26
    • B23K26/0665B23K26/03B23K26/032B23K26/082B23K26/0853B23K2101/40B23K2103/42B23K2103/50G01R31/2898G01R31/308
    • A method and system for exposing the delicate structures of a device encapsulated in a mold compound such as an integrated circuit (IC). A laser is used to ablate the mold compound and thus remove it, exposing the underlying structure. The laser beam can be steered in a desired raster pattern onto the surface of the device or the device can be moved in the desired pattern relative to the laser beam. Spectral analysis can be performed on the laser plume emitted by the ablation process in order to determine the composition of the ablated material. Thus, in addition to exposing defects in the underlying structure, the system can also be used to analyze the encapsulating material in order to determine whether it contained any defects or anomalies. A system for precisely cutting a circuit board or an IC in a user-selected pattern is also described. The system directs a laser along a path that a user can specify using a graphical interface.
    • 用于暴露封装在诸如集成电路(IC)的模具化合物中的器件的精细结构的方法和系统。 激光用于烧蚀模具化合物,从而将其去除,暴露下面的结构。 可以将激光束以期望的光栅图案转向装置的表面上,或者可以相对于激光束以期望的图案移动该装置。 可以对由消融过程发射的激光羽流进行光谱分析,以便确定烧蚀材料的组成。 因此,除了暴露底层结构中的缺陷之外,系统还可以用于分析封装材料,以便确定其是否包含任何缺陷或异常。 还描述了以用户选择的图案精确地切割电路板或IC的系统。 系统沿着用户可以使用图形界面指定的路径引导激光。