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21. 发明申请

US20100110590A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20100110590A1
公开(公告)日：2010-05-06
申请号：US12588797
申请日：2009-10-28
申请人： Tetsuya Ohsawa , Hayato Abe , Yoshinari Yoshida , Toshiki Naito
发明人： Tetsuya Ohsawa , Hayato Abe , Yoshinari Yoshida , Toshiki Naito
IPC分类号： G11B5/60
CPC分类号： G11B13/04 , G11B5/4833 , G11B5/484 , G11B5/4853 , G11B2005/0021 , H05K1/056 , H05K1/182 , H05K3/06 , H05K3/445 , H05K2201/0394 , H05K2201/09509 , H05K2201/096 , H05K2201/0969 , H05K2201/10106 , H05K2201/10537 , H05K2201/10545 , H05K2201/10727 , H05K2203/0323 , H05K2203/0361
摘要： A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
摘要翻译：具有电路的悬挂板包括导电图案，包括布置在具有电路的悬挂板的表面侧上的滑块，并安装有磁头，磁头与导电图案电连接; 以及发光装置，其配置在具有电路的电路的背面侧并与导电图形电连接，其中导电图案包括设置在具有电路的悬挂板的表面上的第一端子，并与磁性电连接头; 以及设置在所述悬挂板的后表面上并具有电路并与所述发光装置电连接的第二端子。

22. 发明申请

US20090283314A1 Wired circuit board and producing method thereof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US20090283314A1
公开(公告)日：2009-11-19
申请号：US12453473
申请日：2009-05-12
申请人： Tetsuya Ohsawa , Yasunari Ooyabu , Jun Ishii
发明人： Tetsuya Ohsawa , Yasunari Ooyabu , Jun Ishii
IPC分类号： H05K1/11 , H05K3/02
CPC分类号： H05K3/242 , G11B5/484 , H05K1/056 , H05K1/117 , H05K3/06 , H05K2201/09263 , H05K2201/09727 , H05K2203/175
摘要： A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern.
摘要翻译：布线电路板的制造方法包括以下步骤：一体地形成导电图案，与导电图案电连接的镀层引线，以及设置在电镀引线中的调节部分，以调节蚀刻剂穿入导电图案; 并用蚀刻剂蚀刻镀层，同时调节部分调节蚀刻剂穿入导电图案。

23. 发明申请

US20090151994A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20090151994A1
公开(公告)日：2009-06-18
申请号：US12289437
申请日：2008-10-28
申请人： Tetsuya Ohsawa , Katsutoshi Kamei
发明人： Tetsuya Ohsawa , Katsutoshi Kamei
IPC分类号： H05K1/11
CPC分类号： H05K1/112 , G11B5/484 , G11B5/486 , H05K1/0245 , H05K1/025 , H05K1/056 , H05K2201/0394 , H05K2201/09672 , H05K2201/0969
摘要： A wired circuit board includes a wiring formation portion, a terminal formation portion, and a middle portion formed therebetween. The wiring formation portion includes a first conductive layer formed on a first insulating layer, and a second conductive layer formed on a second insulating layer so as to overlap the first conductive layer in a thickness direction. The terminal formation portion includes the first and second conductive layers formed in parallel in the same plane. The middle portion includes the first conductive layer formed on the first insulating layer, and the second conductive layer formed on a portion of the second insulating layer extending from the wiring formation portion to a mid-point between the wiring formation portion and the terminal formation portion, and formed on a portion of the first insulating layer extending from the mid-point to the terminal formation portion.
摘要翻译：布线电路板包括布线形成部分，端子形成部分和形成在其间的中间部分。布线形成部分包括形成在第一绝缘层上的第一导电层和形成在第二绝缘层上以在厚度方向上与第一导电层重叠的第二导电层。端子形成部分包括在同一平面内平行形成的第一和第二导电层。中间部分包括形成在第一绝缘层上的第一导电层，以及形成在第二绝缘层的从布线形成部分延伸到布线形成部分和端子形成部分之间的中点的第二导电层并且形成在从中点延伸到端子形成部分的第一绝缘层的一部分上。

24. 发明授权

US07471519B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07471519B2
公开(公告)日：2008-12-30
申请号：US11187865
申请日：2005-07-25
申请人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： H05K1/181 , H05K1/056 , H05K3/28 , H05K2201/09972 , Y02P70/611
摘要： A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board is constructed so that a suspension board portion for supporting the magnetic head and a control board portion for controlling the magnetic head are formed to be continuous and integral with each other. To be more specific, a first conductor layer connected to the magnetic head in the suspension board portion and a second conductor layer connected to a preamplifier IC in the control board portion are formed from the same material and formed on a common insulating base layer simultaneously. Further, a common insulating cover layer to cover the first conductor layer and the second conductor layer is formed on the common insulating base layer.
摘要翻译：一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。布线电路板被构造成使得用于支撑磁头的悬架板部分和用于控制磁头的控制板部分彼此连续并且一体地形成。更具体地说，连接到悬架板部分中的磁头的第一导体层和连接到控制板部分中的前置放大器IC的第二导体层由相同的材料形成并同时形成在公共绝缘基底层上。此外，在公共绝缘基底层上形成覆盖第一导体层和第二导体层的公共绝缘覆盖层。

25. 发明申请

US20080277142A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20080277142A1
公开(公告)日：2008-11-13
申请号：US12081835
申请日：2008-04-22
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H05K1/00
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.
摘要翻译：一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。

26. 外观设计

USD567774S1 Groove formed around a semiconductor device on a circuit board 有权
标题翻译：槽形成在电路板上的半导体器件周围
公开(公告)号：USD567774S1
公开(公告)日：2008-04-29
申请号：US29268261
申请日：2006-11-01
申请人： Emiko Tani , Tetsuya Ohsawa
设计人： Emiko Tani , Tetsuya Ohsawa

27. 外观设计

USD566060S1 Grooves formed around a semiconductor device on a circuit board 有权
公开(公告)号：USD566060S1
公开(公告)日：2008-04-08
申请号：US29240188
申请日：2005-10-11
申请人： Tetsuya Ohsawa , Emiko Tani
设计人： Tetsuya Ohsawa , Emiko Tani

28. 发明申请

US20050248885A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20050248885A1
公开(公告)日：2005-11-10
申请号：US11123181
申请日：2005-05-06
申请人： Yasuhito Funada , Tetsuya Ohsawa
发明人： Yasuhito Funada , Tetsuya Ohsawa
IPC分类号： G11B5/60 , G11B5/48 , G11B21/21 , H05K1/00 , H05K1/05 , H05K3/28
CPC分类号： H05K1/028 , G11B5/484 , H05K1/056 , H05K3/28 , H05K2201/0969 , H05K2201/0989
摘要： A suspension board with circuit that can allow precise adjustment of floatation (floatation angle) of even a small-sized slider to a magnetic disc even when the outrigger portions are reduced in rigidity. A gimbal portion 6 of the suspension board with circuit 1 is formed by a tongue portion 10 for mounting a magnetic head thereon, and outrigger portions 11 provided at both sides of the tongue portion 10, and an opening 12 is formed in the insulating cover layer 5 so that the conductor layer 4 can be exposed therefrom in the outrigger portions 11. This can allow reduction in rigidity of the outrigger portions 11, and as such can allow precise adjustment of floatation (floatation angle) of the slider to the magnetic disc even when a small-sized slider is mounted on the gimbal portion.
摘要翻译：具有电路的悬挂板，即使当外伸支架部分的刚度降低时，也能够将即使小尺寸滑块的浮动（浮动角）精确地调整到磁盘。具有电路1的悬挂板的万向节部6由用于在其上安装磁头的舌部10形成，并且设置在舌部10的两侧的外伸支架部分11和开口12形成在绝缘覆盖层 5，使得导体层4可以在外伸支架部分11中暴露出来。这可以允许外伸支架部分11的刚性降低，并且因此可以允许精确地调节滑块对磁盘的浮动（浮动角度）当小型滑块安装在万向节部分上时。

29. 发明授权

US08227705B2 Wired circuit board and producing method thereof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US08227705B2
公开(公告)日：2012-07-24
申请号：US12453473
申请日：2009-05-12
申请人： Tetsuya Ohsawa , Yasunari Ooyabu , Jun Ishii
发明人： Tetsuya Ohsawa , Yasunari Ooyabu , Jun Ishii
IPC分类号： H05K1/11 , G11B21/16
CPC分类号： H05K3/242 , G11B5/484 , H05K1/056 , H05K1/117 , H05K3/06 , H05K2201/09263 , H05K2201/09727 , H05K2203/175
摘要： A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern.
摘要翻译：布线电路板的制造方法包括以下步骤：一体地形成导电图案，与导电图案电连接的镀层引线，以及设置在电镀引线中的调节部分，以调节蚀刻剂穿入导电图案; 并用蚀刻剂蚀刻镀层，同时调节部分调节蚀刻剂穿入导电图案。

30. 发明授权

US08184404B2 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US08184404B2
公开(公告)日：2012-05-22
申请号：US12656053
申请日：2010-01-14
申请人： Tetsuya Ohsawa , Toshiki Naito
发明人： Tetsuya Ohsawa , Toshiki Naito
IPC分类号： G11B5/02 , G11B11/10 , G11B11/105 , G11B5/60
CPC分类号： G11B5/4853 , G11B5/486
摘要： A suspension board with circuit includes a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed close to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed close to the auxiliary portion. The conductive pattern includes a first conductive pattern including a first terminal, and a second terminal connected to the magnetic head, and a second conductive pattern including a third terminal and a fourth terminal connected to the light emitting element. The first, second and third terminals are disposed on the board main body portion. The fourth terminal is disposed on the auxiliary portion. The back surface of the board main body portion is formed with a main-body-side interfitting portion. A back surface of the auxiliary portion is formed with an auxiliary-portion-side interfitting portion.
摘要翻译：具有电路的悬挂板包括板主体部分，相对于板主体部分折回的辅助部分，靠近板主体部分设置的滑块以及安装在其上的磁头和发光元件，靠近辅助部分。导电图案包括包括第一端子和连接到磁头的第二端子的第一导电图案，以及包括连接到发光元件的第三端子和第四端子的第二导电图案。第一，第二和第三端子设置在板主体部分上。第四端子设置在辅助部分上。板主体部分的背面形成有主体侧配合部分。辅助部分的后表面形成有辅助部分侧配合部分。

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