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21. 发明申请

US20120183040A1 Dynamic Video Switching 审中-公开
标题翻译：动态视频切换
公开(公告)号：US20120183040A1
公开(公告)日：2012-07-19
申请号：US13009083
申请日：2011-01-19
申请人： Xin Fang , Wei Shi , Gerald Paul Michalak
发明人： Xin Fang , Wei Shi , Gerald Paul Michalak
IPC分类号： H04N7/26
CPC分类号： H04N21/4424 , H04N21/42607
摘要： In an example, a dynamic codec allocation method is provided. The method includes receiving a plurality of datastreams and determining a respective codec loading factor for each of the datastreams. The datastreams are assigned to codecs, in order by respective codec loading factor, starting with the highest respective codec loading factor. Initially, the datastreams are assigned to a hardware codec, until the hardware codec is loaded to substantially maximum capacity. If the hardware codec is loaded to substantially maximum capacity, the remaining datastreams are assigned to a software codec. As new datastreams are received, the method repeats, and previously-assigned datastreams can be reassigned from a hardware codec to a software codec, and vice versa, based on their relative codec loading factors.
摘要翻译：在一个示例中，提供了动态编解码器分配方法。该方法包括接收多个数据流并确定每个数据流的相应的编解码器加载因子。数据流被分配到编解码器，按照相应的编解码器加载因子顺序，从最高的各自的编解码器加载因子开始。最初，数据流被分配到硬件编解码器，直到硬件编解码器被加载到基本上最大的容量。如果硬件编解码器被加载到基本上最大的容量，剩余的数据流被分配给软件编解码器。当接收到新的数据流时，该方法重复，并且可以基于它们的相对编解码器加载因子将先前分配的数据流从硬件编解码器重新分配到软件编解码器，反之亦然。

22. 发明授权

US08189361B2 Multi-chip assembly with optically coupled die 有权
标题翻译：具有光耦合模的多芯片组装
公开(公告)号：US08189361B2
公开(公告)日：2012-05-29
申请号：US12938608
申请日：2010-11-03
申请人： Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
发明人： Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
IPC分类号： H01L31/147
CPC分类号： H01L23/48 , H01L25/0652 , H01L2924/00014 , H01L2224/48
摘要： Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.
摘要翻译：公开了包括光耦合管芯的多芯片组件的实施例。多芯片组件可以包括两个相对的基板，并且在每个基板上安装多个管芯。一个基板上的至少一个管芯与另一个基板上的至少一个相对的管芯光学连通。描述和要求保护其他实施例。

23. 发明授权

US08148805B2 Forming compliant contact pads for semiconductor packages 有权
标题翻译：形成用于半导体封装的兼容接触焊盘
公开(公告)号：US08148805B2
公开(公告)日：2012-04-03
申请号：US13075345
申请日：2011-03-30
申请人： Qing Zhou , Wei Shi , Daoqiang Lu , Jiangqi He
发明人： Qing Zhou , Wei Shi , Daoqiang Lu , Jiangqi He
IPC分类号： H01L23/02 , H01L21/44 , H01L21/31
CPC分类号： H01L23/49811 , H01L2224/1319 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/15311 , H01L2924/15313 , H01L2924/16152 , H05K3/4007 , H05K2201/0133 , H05K2201/0367
摘要： In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, improved connection between the semiconductor package and a socket is provided. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，本发明包括具有第一表面以支撑半导体管芯的衬底的半导体封装。衬底的第二表面包括柔性导电焊盘以提供到半导体管芯的电连接。以这种方式，提供了半导体封装和插座之间的改进的连接。描述和要求保护其他实施例。

24. 发明授权

US08080827B2 Top contact LED thermal management 有权
标题翻译：热门联系LED热管理
公开(公告)号：US08080827B2
公开(公告)日：2011-12-20
申请号：US12183772
申请日：2008-07-31
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L33/48 , H01L31/12 , H01L27/15
CPC分类号： H01L33/642 , H01L25/0753 , H01L33/20 , H01L33/38 , H01L33/483 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.
摘要翻译：公开了一种具有增强散热的LED。例如，LED管芯可以具有延伸的接合焊盘，其被配置为增强从LED的有源区域到引线框架的热流。透光基板可进一步增强远离LED管芯的热流。通过增强散热，可以使用更多的电流来驱动LED。使用更多的电流有助于生产更亮的LED。

25. 发明授权

US08058664B2 Transparent solder mask LED assembly 有权
标题翻译：透明焊接面罩LED组件
公开(公告)号：US08058664B2
公开(公告)日：2011-11-15
申请号：US12239516
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch
发明人： Wei Shi , Alex Shaikevitch
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2224/49175 , H05K1/0274 , H05K3/28 , H05K2201/0108 , H05K2201/10106 , H05K2201/2054 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

26. 发明申请

US20110239454A1 Substrate With Raised Edge Pads 审中-公开
标题翻译：基板带凸边垫
公开(公告)号：US20110239454A1
公开(公告)日：2011-10-06
申请号：US13159642
申请日：2011-06-14
申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
发明人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
IPC分类号： H01R43/00 , H01R43/02
CPC分类号： H05K7/1061 , Y10T29/49117
摘要： A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.
摘要翻译：可分离的电连接可以在待连接的两个电气部件之一上设置有陆侧焊盘。侧面垫可以由两部分组成，包括平坦部分和形成在平坦部分上的凸起边缘。在一些实施例中，凸起边缘可以具有闭合的几何形状。然后，通过凸起边缘防止接合平坦部分和凸起边缘之间的连接处的插座触点从边缘垫片滑出。此外，可以在陆侧衬垫的平坦部分和凸起边缘以及插座上的相应形状的一对部分之间建立双重电连接区域。这增加了连接的电效率及其安全性。

27. 发明授权

US08012808B2 Integrated micro-channels for 3D through silicon architectures 有权
标题翻译：用于3D通过硅架构的集成微通道
公开(公告)号：US08012808B2
公开(公告)日：2011-09-06
申请号：US12028090
申请日：2008-02-08
申请人： Wei Shi , Daoqiang Lu , Yiqun Bai , Qing A. Zhou , Jianqqi He
发明人： Wei Shi , Daoqiang Lu , Yiqun Bai , Qing A. Zhou , Jianqqi He
IPC分类号： H01L21/00
CPC分类号： H01L23/473 , H01L25/0657 , H01L25/18 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.
摘要翻译：本发明的一些实施例包括与通过硅架构从3D去除热量的集成微通道相关的装置和方法。

28. 发明授权

US07851809B2 Multi-chip assembly with optically coupled die 有权
标题翻译：具有光耦合模的多芯片组装
公开(公告)号：US07851809B2
公开(公告)日：2010-12-14
申请号：US12456224
申请日：2009-06-12
申请人： Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
发明人： Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
IPC分类号： H01L31/147
CPC分类号： H01L23/48 , H01L25/0652 , H01L2924/00014 , H01L2224/48
摘要： Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.
摘要翻译：公开了包括光耦合管芯的多芯片组件的实施例。多芯片组件可以包括两个相对的基板，并且在每个基板上安装多个管芯。其中一个基板上的至少一个管芯与另一基板上的至少一个相对的管芯光学连通。描述和要求保护其他实施例。

29. 发明授权

US07821712B2 Thin film tunable optical filter 有权
标题翻译：薄膜可调滤光片
公开(公告)号：US07821712B2
公开(公告)日：2010-10-26
申请号：US11819530
申请日：2007-06-28
申请人： Wen Liu , Kan Yu , Jin Chang , Shuihua Liu , Weilin Guan , Dexiu Huang , Wei Shi , Wei Li
发明人： Wen Liu , Kan Yu , Jin Chang , Shuihua Liu , Weilin Guan , Dexiu Huang , Wei Shi , Wei Li
IPC分类号： G02B27/10
CPC分类号： G02B26/007 , G02B27/283 , G02F2203/585
摘要： The tunable optical filter is provided, comprising an optical means for separating an input optical signal into a tunable drop optical signal and an output optical signal, wherein the output optical signal is directed back along the same path as the input optical signal. One embodiment of the invention comprises an optical circulator, a pair of polarization beam splitters, a pair of half-wave plates, an optical thin-film filter, a rotatable mirror, a spatially fixed mirror. Optical wavelengths are selected by making angular adjustments to the optical thin-film filter and the rotatable mirror, which are rotated by the same angle. A corresponding method for spectrally splitting and spatially separating an input optical signal into an output optical signal and a drop optical signal is also provided.
摘要翻译：提供了可调谐滤光器，其包括用于将输入光信号分离成可调分光信号和输出光信号的光学装置，其中输出光信号沿与输入光信号相同的路径被引导回。本发明的一个实施例包括光环行器，一对偏振分束器，一对半波片，光学薄膜滤光器，可旋转镜，空间固定镜。通过对旋转了相同角度的光学薄膜滤光器和可旋转镜进行角度调整来选择光学波长。还提供了用于频谱分割并将输入光信号空间分离成输出光信号和降落光信号的相应方法。

30. 发明申请

US20100078662A1 NON-GLOBAL SOLDER MASK LED ASSEMBLY 有权
标题翻译：非全球焊接面罩LED组件
公开(公告)号：US20100078662A1
公开(公告)日：2010-04-01
申请号：US12239494
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch
发明人： Wei Shi , Alex Shaikevitch
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H05K1/0274 , H05K3/28 , H05K2201/0989 , H05K2201/10106 , H05K2201/2054 , H01L2924/00 , H01L2924/00014
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

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