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    • 29. 发明授权
    • Paper materials sorting apparatus
    • 纸料分选设备
    • US07708275B2
    • 2010-05-04
    • US11476734
    • 2006-06-29
    • Takeshi Aoki
    • Takeshi Aoki
    • B65H35/10
    • G07D11/0084G07D11/006
    • A paper materials sorting apparatus that includes note denomination discriminating mechanism for discriminating the paper materials based on note denominations of the paper materials, cassette assignment mechanism for assigning each of a plurality of wrapping devices and/or storage devices a note denomination, and a sorting mechanism for sorting the paper materials in accordance with their note denomination and for directing the sorted paper materials to the corresponding assigned wrapping devices and/or storage devices. The sorting mechanism further contains counting mechanism for counting throughput of the sorted paper materials into each of the assigned wrapping devices and/or storage devices, comparison mechanism for comparing the throughput of each of the assigned wrapping devices and/or storage devices, and an operation display for displaying a recommended operation to reassign the note denominations of the wrapping devices and/or storage devices in order to balance the sorting load among the wrapping devices and/or storage devices.
    • 一种纸材分类装置,其包括:纸币种类识别机构,用于基于纸材的纸币面值来辨别纸张材料,用于分配多个包装装置和/或存储装置中的每一个纸币分类的纸币分配机构和纸币分类机构 用于根据其纸币面额对纸张材料进行分类,以及将分类的纸张材料引导到相应的分配的包装装置和/或存储装置。 分拣机构还包括计数机构,用于将分拣的纸张材料的生产量计数到分配的包装装置和/或存储装置中的每一个中,用于比较每个分配的包装装置和/或存储装置的生产量的比较机构和操作 用于显示推荐操作以重新分配包装装置和/或存储装置的纸币面额,以平衡包装装置和/或存储装置之间的分类负载。
    • 30. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MAKING THE SAME
    • 光电转换装置及其制造方法
    • US20100079636A1
    • 2010-04-01
    • US12566241
    • 2009-09-24
    • Takeshi AokiTadashi Sawayama
    • Takeshi AokiTadashi Sawayama
    • H04N5/335H01L31/18H01L31/14
    • H01L27/14689H01L27/14609H01L27/14636H01L27/14687
    • A photoelectric conversion device includes a semiconductor substrate, a first insulating film on the semiconductor substrate, a second insulating film on the first insulating film, a third insulating film on the second insulating film, and a wiring disposed in the third insulating film, the wiring being a wiring layer closest to the semiconductor substrate. A first plug of a shared contact structure and a second plug are disposed in the first insulating film. A third plug and a first wiring that constitute a dual damascene structure are disposed in the second and third insulating films. The first insulating film is used as an etching stopper film during etching of the second insulating film and the second insulating film is used as an etching stopper film during etching of the third insulating film.
    • 光电转换装置包括半导体衬底,半导体衬底上的第一绝缘膜,第一绝缘膜上的第二绝缘膜,第二绝缘膜上的第三绝缘膜和布置在第三绝缘膜中的布线,布线 是最靠近半导体衬底的布线层。 共享接触结构的第一插头和第二插头设置在第一绝缘膜中。 构成双镶嵌结构的第三插头和第一布线设置在第二和第三绝缘膜中。 在蚀刻第二绝缘膜期间,将第一绝缘膜用作蚀刻停止膜,并且在蚀刻第三绝缘膜期间将第二绝缘膜用作蚀刻停止膜。