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    • 23. 发明授权
    • Process of forming a curved profile on a semiconductor substrate
    • 在半导体衬底上形成弯曲轮廓的工艺
    • US07749868B2
    • 2010-07-06
    • US11920544
    • 2006-05-16
    • Yoshiaki HondaTakayuki Nishikawa
    • Yoshiaki HondaTakayuki Nishikawa
    • H01L21/479
    • G02B3/00H01L21/306
    • A semiconductor substrate shaped to have a curved surface profile by anodization. Prior to being anodized, the substrate is finished with an anode pattern on its bottom surface so as to be consolidated into a unitary structure in which the anode pattern is precisely reproduced on the substrate. The anodization utilizes an electrolytic solution which etches out an oxidized portion as soon as it is formed as a result of the anodization, to thereby develop a porous layer in a pattern in match with the anode pattern. The anode pattern brings about an in-plane distribution of varying electric field intensity by which the porous layer develops into a shape complementary to a desired surface profile. Upon completion of the anodization, the curves surface is revealed on the surface of the substrate by etching out the porous layer and the anode pattern from the substrate.
    • 通过阳极氧化成型为具有弯曲表面轮廓的半导体衬底。 在阳极氧化之前,在其底表面上用阳极图案完成衬底,以便固结成其中在衬底上精确再现阳极图案的单一结构。 阳极氧化利用电解溶液,其随着阳极氧化而形成氧化部分,从而形成与阳极图案匹配的图案的多孔层。 阳极图案产生变化的电场强度的面内分布,通过该平面分布,多孔层发展成与期望的表面轮廓互补的形状。 在阳极氧化完成后,通过从衬底上蚀刻多孔层和阳极图案,在衬底的表面上露出曲面。
    • 24. 发明授权
    • Optical displacement measuring system using a triangulation including a
processing of position signals in a time sharing manner
    • 光学位移测量系统采用三角测量,包括以时间分配方式处理位置信号
    • US5814808A
    • 1998-09-29
    • US703787
    • 1996-08-27
    • Yuji TakadaHiroshi MatsudaTakayuki Nishikawa
    • Yuji TakadaHiroshi MatsudaTakayuki Nishikawa
    • G01C3/08G01S17/46G01C3/06
    • G01S17/48G01C3/085
    • An optical displacement measuring system using a triangulation comprises a light projecting unit for emitting to an object a light beam which is amplitude-modulated by a reference signal having a predetermined period, a light receiving unit for receiving light reflected back from the object and providing a pair of position signals, and a control signal generator for providing first and second control signals in synchronism with the reference signal. The position signals are processed by a switching unit in a time sharing manner according to the first control signal to obtain a first composite signal, in which the position signals occur alternately every integral number of the period of the reference signal. The first composite signal is amplified by a single amplifier at a desired amplification rate, and then sent to a distance determining unit, in which the polarity of the first composite signal is periodically reversed according to the second control signal to obtain a second composite signal, and a distance signal indicative of a distance between the light projecting unit and the object is determined from the second composite signal.
    • 使用三角测量的光学位移测量系统包括:光投射单元,用于向物体发射由具有预定周期的参考信号进行幅度调制的光束;光接收单元,用于接收从物体反射回来的光,并提供一个 一对位置信号,以及用于与参考信号同步地提供第一和第二控制信号的控制信号发生器。 位置信号根据第一控制信号以时间共享的方式由切换单元处理,以获得第一复合信号,其中位置信号交替产生参考信号周期的每个整数。 第一复合信号以期望的放大率由单个放大器放大,然后发送到距离确定单元,其中第一复合信号的极性根据第二控制信号周期性地反转以获得第二复合信号, 并且根据第二复合信号确定指示光投射单元和物体之间的距离的距离信号。
    • 26. 发明授权
    • Process of making an optical lens
    • 制作光学透镜的过程
    • US08313632B2
    • 2012-11-20
    • US11920545
    • 2006-05-16
    • Yoshiaki HondaTakayuki Nishikawa
    • Yoshiaki HondaTakayuki Nishikawa
    • C25D5/02
    • B29D11/00019B29D11/00298G02B3/0006G02B3/0031G02B3/0056G02B3/02
    • A semiconductor substrate is anodized to be shaped into an optical lens. Prior to being anodized, the substrate is finished with an anode pattern on its bottom surface so as to be consolidated into a unitary structure in which the anode pattern is precisely reproduced on the substrate. The anodization utilizes an electrolytic solution which etches out oxidized portion as soon as it is formed as a result of the anodization, to thereby develop a porous layer in a pattern in match with the anode pattern. The anode pattern brings about an in-plane distribution of varying electric field intensity by which the porous layer develops into a shape complementary to a desired lens profile. Upon completion of the anodization, the semiconductor substrate is shaped into the lens by etching out the porous layer and the anode pattern from the substrate.
    • 阳极氧化半导体衬底以成形为光学透镜。 在阳极氧化之前,在其底表面上用阳极图案完成衬底,以便固结成其中在衬底上精确再现阳极图案的单一结构。 阳极氧化利用电解溶液,其在阳极氧化后形成氧化部分,从而开发与阳极图案相匹配的图案中的多孔层。 阳极图案产生变化的电场强度的面内分布,通过该平面分布,多孔层发展成与期望的透镜轮廓互补的形状。 在阳极氧化完成后,通过从衬底上蚀刻多孔层和阳极图案将半导体衬底成形为透镜。
    • 28. 发明授权
    • Infrared detector and process for fabricating the same
    • 红外探测器及其制造方法
    • US07671335B2
    • 2010-03-02
    • US11883361
    • 2006-11-08
    • Takayuki NishikawaSadayuki SumiTomohiro KamitsuRyo TaniguchiMasaya HirataShin Sato
    • Takayuki NishikawaSadayuki SumiTomohiro KamitsuRyo TaniguchiMasaya HirataShin Sato
    • G01J5/20
    • H01L31/0203G01J1/02G01J1/0204G01J2001/0276H05K1/0218H05K1/185
    • An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.
    • 红外线检测器包括一个载有红外传感器元件和电子部件的电路块。 电路块由介电树脂层和形成有电路图案的第一基板和安装电子部件组成。 电介质树脂层在其顶部形成有凹部,凹部围绕其周边限定有用于支撑红外传感器的相对端的肩部。 将第一衬底集成到电介质树脂层的下端,其中至少一个电子部件被模制到电介质树脂层中,以使电路块具有统一的模具结构。 因此,将一部分或全部电子部件模制到电介质层中以实现简单和低轮廓结构的电路块,同时保持将红外传感器元件充分远离电子部件和相关电子电路的优点 从而确保得到结构简单,成本经济,红外检测可靠的红外检测器。
    • 30. 发明申请
    • Infrared Detector and Process for Fabricating the Same
    • 红外探测器及其制造方法
    • US20080111087A1
    • 2008-05-15
    • US11883361
    • 2006-11-08
    • Takayuki NishikawaSadayuki SumiTomohiro KamitsuRyo TaniguchiMasaya HirataShin Sato
    • Takayuki NishikawaSadayuki SumiTomohiro KamitsuRyo TaniguchiMasaya HirataShin Sato
    • G21G5/00
    • H01L31/0203G01J1/02G01J1/0204G01J2001/0276H05K1/0218H05K1/185
    • An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.
    • 红外线检测器包括一个载有红外传感器元件和电子部件的电路块。 电路块由介电树脂层和形成有电路图案的第一基板和安装电子部件组成。 电介质树脂层在其顶部形成有凹部,凹部围绕其周边限定有用于支撑红外传感器的相对端的肩部。 将第一衬底集成到电介质树脂层的下端,其中至少一个电子部件被模制到电介质树脂层中,以使电路块具有统一的模具结构。 因此,将一部分或全部电子部件模制到电介质层中以实现简单和低轮廓结构的电路块,同时保持将红外传感器元件充分远离电子部件和相关电子电路的优点 从而确保得到结构简单,成本经济,红外检测可靠的红外检测器。