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    • 27. 发明申请
    • Substrate treating apparatus and method for manufacturing semiconductor device
    • 基板处理装置及半导体装置的制造方法
    • US20060205213A1
    • 2006-09-14
    • US10517765
    • 2003-06-26
    • Takashi OzakiKenichi Suzaki
    • Takashi OzakiKenichi Suzaki
    • H01L21/44C23C16/00
    • H01L21/67309C23C16/4401C23C16/4583C23C16/4584H01L21/67098H01L21/67253Y10S269/903Y10T29/49126
    • A support section (28) for supporting a wafer (1) is convexly formed in the center of a receiving section (26) of a support groove (25) of a boat 21. At the time of boat loading of the boat (21), in which wafers (1) respectively received by the supporting sections (28) are aligned, from a standby chamber (33) to a processing chamber (14), the pressure in the standby chamber (33) and processing chamber (14) is set to 200 pascals or more, and 3000 pascals or less. By supporting the wafer upwards from the receiving section with use of the support section, even if peeling of the film on the wafer occurs from a large frictional force between the supported surface of the wafer and the support section under a reduced pressure, the particles from the peeling are caught by the receiving section and therefore particles are prevented from adhering to the IC fabrication surface of the wafer directly below the receiving section.
    • 用于支撑晶片(1)的支撑部分(28)凸形地形成在船21的支撑槽(25)的接收部分(26)的中心。在船(21)的船装载时, ,其中分别由所述支撑部分(28)接收的晶片(1)从待机室(33)到处理室(14)对准,所述备用室(33)和处理室(14)中的压力为 设定为200帕斯卡以上,3000帕斯卡以下。 通过使用支撑部分从接收部分向上支撑晶片,即使在晶片的支撑表面和支撑部分之间的减小的压力下,晶片上的膜的剥离发生在晶片上, 剥离被接收部分捕获,因此防止颗粒直接在接收部分的正下方粘附到晶片的IC制造表面。
    • 29. 发明授权
    • Tabular member swinging device
    • 板状摆动装置
    • US09075234B2
    • 2015-07-07
    • US13394699
    • 2010-12-14
    • Takashi OzakiRyo Kodama
    • Takashi OzakiRyo Kodama
    • G09G3/34G02B26/08
    • G02B26/0841G09G3/34
    • A plurality of movable units is arranged in a matrix. First and second electrodes are used in common in the movable units arranged in a column. A plurality of third electrodes, which commonly connects tabular members of the movable units arranged in a row, is formed for each row. The drive circuit selects, in order and one by one, the third electrodes. Subsequently, the drive circuit swings the tabular member by applying a bias voltage to the selected third electrode and applying an approach voltage or a separating voltage to a plurality of the first electrodes and second electrodes. During a predetermined period of maintaining a swinging posture, the voltage applied to the third electrodes is maintained as the bias voltage. The tabular member is returned to a non-swinging state by changing the voltage applied to the third electrodes to a reset voltage after the lapse of the predetermined period.
    • 多个可移动单元被布置成矩阵。 第一和第二电极在布置成列的可移动单元中共同使用。 为每排形成多个第三电极,其通常连接布置成一排的可动单元的板状构件。 驱动电路按顺序依次选择第三电极。 随后,驱动电路通过向所选择的第三电极施加偏置电压并向多个第一电极和第二电极施加接近电压或分离电压来摆动板状构件。 在保持摆动姿态的预定时段期间,施加到第三电极的电压被保持为偏置电压。 通过将施加到第三电极的电压改变为经过预定周期之后的复位电压,板状构件返回到非摆动状态。