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    • 22. 发明申请
    • Photonic three-dimensional structure and method for production thereof
    • 光子三维结构及其制备方法
    • US20050285115A1
    • 2005-12-29
    • US10525379
    • 2004-06-04
    • Takuji NakagawaKikuo Wakino
    • Takuji NakagawaKikuo Wakino
    • B29C67/00G02B1/02H01L29/15H01L31/0256
    • B29C64/135B33Y10/00B33Y30/00B33Y70/00B33Y80/00
    • A three-dimensional component having cavities containing a photocurable resin material and having a structure in which a plurality of cured resin layers composed of the photo-cured resin material are stacked, is manufactured by stereolithography. Inorganic members are inserted into concave portions when the concave portions are formed before covering the cavities, each of the concave portions being at least portion of the corresponding cavity, and the photocurable resin material remaining. When the three-dimensional component is completed, the photocurable resin material remaining in the cavity is thermally cured, thus being brought into contact with the inorganic members. In this manner, a three-dimensional photonic structure having the plurality of inorganic members precisely disposed at desired periodic positions within the resin matrix is efficiently manufactured.
    • 通过立体光刻法制造具有包含光固化树脂材料并具有多个由光固化树脂材料构成的多个固化树脂层的结构的具有空腔的三维部件。 当在覆盖空腔之前形成凹部时,将无机构件插入到凹部中,每个凹部为相应空腔的至少一部分,并且光固化树脂材料残留。 当三维成分完成时,留在空腔中的光固化树脂材料被热固化,从而与无机部件接触。 以这种方式,有效地制造了具有精确设置在树脂基体内的期望周期位置的多个无机部件的三维光子结构。
    • 23. 发明申请
    • Coaxial probe
    • 同轴探头
    • US20050027335A1
    • 2005-02-03
    • US10862464
    • 2004-06-08
    • Kikuo WakinoToshihide Kitazawa
    • Kikuo WakinoToshihide Kitazawa
    • A61B18/18A61N5/04A61F7/00
    • A61B18/18A61B18/1815
    • A coaxial probe includes an inner conductor, an outer conductor, and a dielectric interposed between the inner and outer conductors, the top-end portion of the coaxial probe having a substantially circular cone shape between the top-end of the inner conductor and the end of the outer conductor so that a portion of the inner conductor and a portion of the dielectric are exposed, and the height of the substantially circular cone portion being set at a value at which a reflection coefficient exhibits substantially a minimum value. The dielectric constant of the dielectric is preferably within the range of about 0.132 times to about 0.6 times as large as the dielectric constant of a surrounding substance (living tissue, i.e., an object to which an electromagnetic wave is irradiated).
    • 同轴探头包括内部导体,外部导体和插入在内部和外部导体之间的电介质,同轴探头的顶端部分在内部导体的顶端与端部之间具有大致圆锥形 使得内部导体的一部分和电介质的一部分露出,并且基本圆形的锥形部分的高度被设定为反射系数基本上呈现最小值的值。 电介质的介电常数优选在周围物质(活体组织即照射电磁波的物体)的介电常数的约0.13倍至约0.6倍的范围内。
    • 25. 发明授权
    • Capacitor-containing wiring board and method of manufacturing the same
    • 含电容器的接线板及其制造方法
    • US5172304A
    • 1992-12-15
    • US795713
    • 1991-11-21
    • Jyuichiro OzawaKikuo Wakino
    • Jyuichiro OzawaKikuo Wakino
    • H05K1/03H05K1/16H05K3/46
    • H05K1/162H05K1/0373H05K1/167H05K2201/0209H05K2201/0317H05K2201/0355H05K2201/09309H05K2201/09672H05K3/4611
    • A flat capacitor-containing wiring board, which can be arranged optionally in the interior of a multilayer substrate. This capacitor-containing wiring board has a dielectric substrate which is made of a mixture of dielectric powder and resin, and conductors which are provided on both major surfaces of the dielectric substrate. The conductors can be etched and shaped so as to form capacitors which use the interior of the wiring board as their dielectric layers. With this wiring board, it is possible to etch the conductors so that the values of the capacitors can be freely selected over a wide range, the wiring board is flexible to some extent, and no pinholes or defects are defined over a wide area. Preferably, the board has a greater relative resin content near its surfaces than in its interior, which improves the dielectric characteristics of the board. The increased resin content may be provided by resin adhesive layers on the surfaces which permeate the board to some extent.
    • 一种扁平的含电容器的布线板,其可选地布置在多层基板的内部。 该含电容器的布线基板具有由电介质粉末和树脂的混合物构成的电介质基板和设置在电介质基板的两个主表面上的导体。 可以对导体进行蚀刻和成形,以形成使用布线板的内部作为其电介质层的电容器。 利用该布线板,可以蚀刻导体,使得可以在宽范围内自由选择电容器的值,布线板在一定程度上是柔性的,并且在广泛的区域上没有限定针孔或缺陷。 优选地,板在其表面附近具有比在其内部更大的相对树脂含量,这改善了板的介电特性。 增加的树脂含量可以通过在一定程度上渗透到板的表面上的树脂粘合剂层来提供。