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    • 21. 发明申请
    • Solid electrolytic capacitor
    • 固体电解电容器
    • US20080259526A1
    • 2008-10-23
    • US12148250
    • 2008-04-17
    • Yuji YoshidaKatsuhiro YoshidaTakeo KasugaMasanori TakahashiTakeshi SaitoKoji Sakata
    • Yuji YoshidaKatsuhiro YoshidaTakeo KasugaMasanori TakahashiTakeshi SaitoKoji Sakata
    • H01G9/15
    • H01G9/15H01G9/012H01G9/028H01G9/14
    • Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.
    • 在铝基的两面形成阳极氧化膜,在铝基的两侧的中央部分,依次层叠导电性聚合物,石墨层和金属层的固体电解质层,由此形成 矩形阴极部分。 在阴极部分的四边的周边形成有绝缘体层,并且在上绝缘体层的四边的周边设置有阳极引线框,由此形成阳极部。 开口形成在绝缘体层或阳极部分的四个角处,从而在铝基底的两侧的阴极部分之间建立电连接。 通过将阴极部分占据的总区域的比例设定为25%以下,即使设置开口部,也能够抑制电容器的ESL低。
    • 23. 发明申请
    • SOLID ELECTROLYTIC CAPACITOR, STACKED CAPACITOR USING THE SAME, AND FABRICATION METHOD THEREOF
    • 固体电解电容器,使用该固体电解电容器的堆叠电容器及其制造方法
    • US20070159771A1
    • 2007-07-12
    • US11686764
    • 2007-03-15
    • Takeshi SAITOSadamu ToitaKatsuhiro Yoshida
    • Takeshi SAITOSadamu ToitaKatsuhiro Yoshida
    • H01G9/04H01G9/145
    • H01G9/012H01G4/30H01G9/0425H01G9/045H01G9/15H01G9/26H01G11/48Y02E60/13Y10T29/417
    • On a surface-roughened aluminum foil, an aluminum oxide film as an anodic oxide film is formed. Then, a conductive polymer layer as a solid electrolyte is formed thereon and thereafter a first metal plating layer is directly formed on the conductive polymer layer, thereby forming a cathode portion. On the other hand, a second metal plating layer is formed on another portion of the surface-roughened aluminum foil, which is not subjected to anodic oxidation or which is subjected to anodic oxidation followed by polishing or formation of an anode deposition film, to thereby form an anode portion. Third metal plating layers are formed at the anode and the cathode portions to obtain a capacitor element. A plurality of capacitor elements are stacked and bonded together fusion after formation of the third metal plating layers. Alternatively the capacitor elements may be bonded together by conductive paste without the third metal layers.
    • 在表面粗糙化的铝箔上形成作为阳极氧化膜的氧化铝膜。 然后,在其上形成作为固体电解质的导电性聚合物层,然后在导电性聚合物层上直接形成第一金属镀层,形成阴极部。 另一方面,在不进行阳极氧化或进行阳极氧化,然后研磨或形成阳极沉积膜的表面粗糙化的铝箔的另一部分上形成第二金属镀层,由此 形成阳极部分。 在阳极和阴极部分形成第三金属镀层以获得电容器元件。 在形成第三金属镀层之后,多个电容器元件堆叠并结合在一起熔化。 或者,电容器元件可以通过导电膏而不具有第三金属层而结合在一起。