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    • 21. 发明授权
    • Solar cell and method for manufacturing the same
    • 太阳能电池及其制造方法
    • US6023020A
    • 2000-02-08
    • US950204
    • 1997-10-14
    • Mikihiko NishitaniTakayuki NegamiNaoki KoharaTakahiro WadaYasuhiro Hashimoto
    • Mikihiko NishitaniTakayuki NegamiNaoki KoharaTakahiro WadaYasuhiro Hashimoto
    • H01L31/032H01L31/0336
    • H01L31/0749H01L31/0322Y02E10/541
    • A solar cell utilizing a chalcopyrite semiconductor and reducing the density of defects on the junction interface of pn junctions is provided. This solar cell includes a substrate, a back electrode formed on the substrate, a p-type chalcopyrite semiconductor thin film formed on the back electrode, an n-type semiconductor thin film formed so as to constitute a pn junction with the p-type chalcopyrite semiconductor thin film, and a transparent electrode formed on the n-type semiconductor thin film. A material having a higher resistivity than the p-type chalcopyrite semiconductor is formed between the p-type chalcopyrite semiconductor thin film and the n-type semiconductor thin film. A thin film made of this material may be formed by deposition from a solution. For example, CuInS.sub.2 is formed on the surface of a p-type chalcopyrite based semiconductor such as CuInSe.sub.2 by contacting the surface of the semiconductor with a solution in which a salt containing group IIIb elements, an organic substance containing group VIb elements and acid are mixed.
    • 提供了利用黄铜矿半导体并降低pn结的结界面上的缺陷密度的太阳能电池。 该太阳能电池包括基板,形成在基板上的背面电极,形成在背面电极上的p型黄铜矿半导体薄膜,形成为与p型黄铜矿形成pn结的n型半导体薄膜 半导体薄膜和形成在n型半导体薄膜上的透明电极。 在p型黄铜矿半导体薄膜和n型半导体薄膜之间形成具有比p型黄铜矿半导体更高的电阻率的材料。 由该材料制成的薄膜可以通过从溶液中沉积而形成。 例如,通过使半导体的表面与含有IIIb族元素的盐,含有VIb族元素的有机物质和酸混合的溶液与CuInSe 2的p型黄铜矿类半导体的表面形成CuInS 2, 。
    • 22. 发明授权
    • Precursor for semiconductor thin films and method for producing
semiconductor thin films
    • 用于半导体薄膜的前体及半导体薄膜的制造方法
    • US5728231A
    • 1998-03-17
    • US648497
    • 1996-05-15
    • Takayuki NegamiMasaharu TerauchiMikihiko NishitaniTakahiro Wada
    • Takayuki NegamiMasaharu TerauchiMikihiko NishitaniTakahiro Wada
    • C23C14/06C23C14/08C23C14/58H01L31/032H01L31/0336H01L31/18
    • C23C14/5866C23C14/0623C23C14/08H01L31/0322H01L31/0323H01L31/0749Y02E10/541Y02P70/521Y10S438/93Y10T428/12528Y10T428/12611Y10T428/12681Y10T428/12903
    • A precursor for manufacturing a semiconductor thin film in which an oxide thin film comprising at least one element as a dopant, selected from a group which consists of Groups IA, IIA, IIB, VA, and VB elements, and Groups IB and IIIA elements which are main components of the semiconductor thin film are deposited on a substrate, or a precursor for manufacturing a semiconductor thin film which is formed by depositing a thin film of oxide comprising the Groups IB and IIIA elements on the substrate wherein the content of at least one of the Groups IB and IIIA elements is varied in the direction of film thickness, and a method for manufacturing a semiconductor thin film comprising the step of heat treating the precursor for manufacturing the semiconductor thin film in an atmosphere containing a Group VIA element. The present invention provides a precursor for manufacturing a semiconductor thin film and a method for manufacturing the semiconductor thin film using the precursor which are suitable for manufacturing a semiconductor thin film having a chalcopyrite structure that has a high and uniform energy conversion efficiency when the semiconductor thin film is used as a photoabsorptive layer of a solar cell.
    • 用于制造半导体薄膜的前体,其中包含至少一种元素作为掺杂剂的氧化物薄膜,其选自由IA,IIA,IIB,VA和VB族元素组成的组以及IB和IIIA族元素, 半导体薄膜的主要成分沉积在基板上,或用于制造半导体薄膜的前体,该半导体薄膜是通过在衬底上沉积包含IB和IIIA族元素的氧化物的薄膜而形成的,其中至少一个 IB和IIIA族元素在膜厚方向上是不同的,以及一种制造半导体薄膜的方法,包括在含有VIA元素的气氛中对用于制造半导体薄膜的前体进行热处理的步骤。 本发明提供一种用于制造半导体薄膜的前体和使用该前体制造半导体薄膜的方法,该半导体薄膜适用于制造具有高半导体薄片的具有高且均匀的能量转换效率的黄铜矿结构的半导体薄膜 膜被用作太阳能电池的光吸收层。
    • 23. 发明授权
    • Waveform display apparatus for easily realizing high-definition waveform
observation
    • 波形显示装置,用于轻松实现高清晰度波形观察
    • US5519820A
    • 1996-05-21
    • US385555
    • 1995-02-08
    • Takehiko KawauchiYoshifumi ImazuKatsuhiko KamiyamaMitsuyoshi TakanoKatsuhisa IiyoshiTakahiro WadaAiichi Katayama
    • Takehiko KawauchiYoshifumi ImazuKatsuhiko KamiyamaMitsuyoshi TakanoKatsuhisa IiyoshiTakahiro WadaAiichi Katayama
    • G01R13/34G01R23/16G01R23/163G01R23/173G01R27/32G06T3/00
    • G01R23/163G01R13/345G01R23/16G01R23/173G01R27/32Y10S715/97
    • A measurement unit U100 measures an input signal to be measured by sweeping frequencies in a measurement range having a predetermined frequency band so as to obtain waveform data to be developed on the frequency axis such as spectrum data in, e.g., a spectrum analyzer. The waveform data obtained by the measurement of the measurement unit U100 is displayed by a display device 500 via a display data processor U20 included in a control unit U200 to be described later to be developed on the frequency axis of the display device, i.e., in correspondence with the measurement frequencies. The control unit U200 includes a measurement controller U30 for controlling the measurement unit U100 so as to display waveform data obtained by enlarging or reducing waveform data, before a measurement frequency condition is changed, at a predetermined magnification to have a predetermined point on the frequency axis as the center on the basis of a change in measurement frequency condition set by a condition setting unit U900, and an enlargement display/stable display processor U40 for controlling the display data processor U20. The enlargement display/stable display processor U40 realizes high-definition waveform observation as the gist of this invention, and substantially has a function of controlling the display device U500 as the control unit U200.
    • 测量单元U100通过在具有预定频带的测量范围内的频率扫描来测量要测量的输入信号,以获得在频率轴上显影的波形数据,例如频谱分析仪中的频谱数据。 通过测量单元U100的测量获得的波形数据由显示装置500经由包括在稍后描述的控制单元U200中的显示数据处理器U20显示在显示装置的频率轴上,即在 与测量频率的对应关系。 控制单元U200包括用于控制测量单元U100的测量控制器U30,以便以预定的倍率显示在测量频率条件改变之前通过放大或缩小波形数据而获得的波形数据,以在频率轴上具有预定点 作为基于由条件设置单元U900设置的测量频率条件的改变的中心,以及用于控制显示数据处理器U20的放大显示/稳定显示处理器U40。 放大显示/稳定显示处理器U40实现高清晰度波形观察作为本发明的要点,并且基本上具有控制显示装置U500作为控制单元U200的功能。