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21. 发明授权

US07338884B2 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device 有权
标题翻译：用于承载半导体器件的互连衬底，其制造方法和半导体器件的封装
公开(公告)号：US07338884B2
公开(公告)日：2008-03-04
申请号：US10997986
申请日：2004-11-29
申请人： Tadanori Shimoto , Katsumi Kikuchi , Koji Matsui , Kazuhiro Baba
发明人： Tadanori Shimoto , Katsumi Kikuchi , Koji Matsui , Kazuhiro Baba
IPC分类号： H01L21/00 , H01L21/76 , H01L21/30 , H01L21/4763 , H01L21/44 , H01L29/40
CPC分类号： H05K3/20 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L2221/68345 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K1/112 , H05K3/4644
摘要： An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a way that, at least, a lateral face of an obverse end of the electrode is all round brought into contact with the insulating layer, while, at least, a reverse surface of the electrode is not in contact with said insulating layer; a via conductor which is disposed on an obverse surface of the electrode and formed in the insulating layer so as to connect this electrode with the interconnection; and a supporting structure on the surface of the insulating layer.
摘要翻译：一种用于承载半导体器件的互连衬底，包括：绝缘层; 在所述绝缘层的正面上设置的布线; 设置在绝缘层的背面侧的电极，其形成方式至少使电极的正面的侧面全部与绝缘层接触，同时至少电极的反面不与所述绝缘层接触; 通孔导体，其设置在所述电极的正面上并形成在所述绝缘层中，以将所述电极与所述互连件连接; 以及在绝缘层的表面上的支撑结构。

22. 发明授权

US06861757B2 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device 有权
公开(公告)号：US06861757B2
公开(公告)日：2005-03-01
申请号：US10097843
申请日：2002-03-15
申请人： Tadanori Shimoto , Katsumi Kikuchi , Koji Matsui , Kazuhiro Baba
发明人： Tadanori Shimoto , Katsumi Kikuchi , Koji Matsui , Kazuhiro Baba
IPC分类号： H01L21/48 , H01L23/498 , H05K1/11 , H05K3/20 , H05K3/46 , H01L23/48 , H01L29/40
CPC分类号： H05K3/20 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L2221/68345 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H05K1/112 , H05K3/4644
摘要： An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a way that, at least, a lateral face of an obverse end of the electrode is all round brought into contact with the insulating layer, while, at least, a reverse surface of the electrode is not in contact with said insulating layer; a via conductor which is disposed on an obverse surface of the electrode and formed in the insulating layer so as to connect this electrode with the interconnection; and a supporting structure on the surface of the insulating layer.

23. 发明申请

US20060192287A1 Interconnecting substrate and semiconductor device 有权
标题翻译：互连基板和半导体器件
公开(公告)号：US20060192287A1
公开(公告)日：2006-08-31
申请号：US11341445
申请日：2006-01-30
申请人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
发明人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
IPC分类号： H01L23/52
CPC分类号： H05K3/205 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L25/0657 , H01L2221/68345 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511 , H05K1/113 , H05K3/107 , H05K3/4682 , H05K2201/09472 , H05K2201/096 , H05K2203/0384 , H01L2924/00 , H01L2224/0401
摘要： An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate comprises a first interconnection pattern formed of the first interconnection which comprises at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.
摘要翻译：互连基板设置有在底面具有下沉部分的基底绝缘膜，设置在凹陷部分中的第一互连，形成在基底绝缘膜中的通孔，以及连接到第一互连件的第二互连通过所述通孔内的导体，并形成在所述基底绝缘膜的顶表面上，其中所述互连衬底包括由所述第一互连形成的第一互连图案，所述第一互连图案至少包括沿着与第一互连正交的第二方向延伸的线状图案第一方向和翘曲控制图案，其设置在基底绝缘膜的底面的下沉部分中，并且形成为抑制互连基板朝向底部绝缘膜两侧的底侧的翘曲第一个方向

24. 发明授权

US07745736B2 Interconnecting substrate and semiconductor device 有权
标题翻译：互连基板和半导体器件
公开(公告)号：US07745736B2
公开(公告)日：2010-06-29
申请号：US11341445
申请日：2006-01-30
申请人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
发明人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K3/205 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L25/0657 , H01L2221/68345 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511 , H05K1/113 , H05K3/107 , H05K3/4682 , H05K2201/09472 , H05K2201/096 , H05K2203/0384 , H01L2924/00 , H01L2224/0401
摘要： An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate includes a first interconnection pattern formed of the first interconnection which includes at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.
摘要翻译：互连基板设置有在底面具有下沉部分的基底绝缘膜，设置在凹陷部分中的第一互连，形成在基底绝缘膜中的通孔，以及连接到第一互连件的第二互连通过所述通孔内的导体，并形成在所述基底绝缘膜的顶表面上，其中所述互连衬底包括由所述第一互连形成的第一互连图案，所述第一互连图案至少包括沿着与第一互连正交的第二方向延伸的线状图案第一方向和翘曲控制图案，其设置在基底绝缘膜的底面的下沉部分中，并且形成为抑制互连基板朝向底部绝缘膜两侧的底侧的翘曲第一个方向

25. 发明授权

US07832941B2 Bearing apparatus for a wheel of vehicle 有权
标题翻译：用于车轮的轴承装置
公开(公告)号：US07832941B2
公开(公告)日：2010-11-16
申请号：US12107144
申请日：2008-04-22
申请人： Kazuo Komori , Kazuhiro Baba
发明人： Kazuo Komori , Kazuhiro Baba
IPC分类号： F16C13/04 , F16C19/04
CPC分类号： F16C19/186 , B60B27/0005 , B60B27/0084 , B60B27/0094 , F16C19/185 , F16C33/581 , F16C33/64 , F16C43/06 , F16C2240/80 , F16C2326/02 , Y02T10/86
摘要： A vehicle wheel bearing apparatus has a pitch circle diameter of an outer side ball group that is larger than a pitch circle diameter of an inner side ball group. Each corner portion of the outer circumferential surfaces of the inner member is rounded as a smooth circular arc.
摘要翻译：车轮轴承装置具有比内侧球组的节圆直径大的外侧球轴组的节圆直径。内部构件的外圆周表面的每个角部分被圆形为平滑的圆弧。

26. 发明授权

US06364819B1 Fastening device for joining two plates together 失效
标题翻译：用于将两个板连接在一起的紧固装置
公开(公告)号：US06364819B1
公开(公告)日：2002-04-02
申请号：US09390689
申请日：1999-09-07
申请人： Yoshiaki Shinno , Toshikazu Sanda , Minoru Isayama , Kazuhiro Baba , Yuko Ogawa
发明人： Yoshiaki Shinno , Toshikazu Sanda , Minoru Isayama , Kazuhiro Baba , Yuko Ogawa
IPC分类号： B31B160
CPC分类号： B65D5/643
摘要： A fastening device includes a cylindrical shell with an opening extending over the entire length of the cylindrical shell, a gripping member formed on the periphery of the cylindrical shell by extending outward and a pair of hooks linked with the tip end of the cylindrical shell via hinges. A fastening method using the foregoing fastening device includes the steps of passing the pair of hooks through a hole for fastening of a packing box formed of an upper box and a lower box, having the pair of hooks opened outward to bring the holding members thereof into contact with the back side surface of the packing box and at the same time having the pair of hooks engaged with each other firmly. At this time, the gripping member is in contact with the front side surface of the packing box. Accordingly, both surfaces located at each respective rim of the hole for fastening are sandwiched between the pair of hooks and the gripping member. Furthermore, the fastening device is structured to make the position of engagement between the pair of hooks changeable, thereby allowing the angle of each respective hook against the cylindrical shell to change and allowing consequently the sandwiching distance between the gripping member and the pair of hooks to change.
摘要翻译：紧固装置包括：圆柱形壳体，其具有在圆柱形壳体的整个长度上延伸的开口;夹持构件，其通过向外延伸形成在圆柱形壳体的周边上，并且一对钩件通过铰链与圆柱形壳体的顶端连接。使用上述紧固装置的紧固方法包括以下步骤：使一对钩通过用于紧固由上部箱体和下部箱体形成的包装盒的孔，其具有向外敞开的一对钩将其保持部件进入与包装箱的背面接触，并且同时具有一对钩牢固地接合。此时，夹持构件与包装箱的前侧面接触。因此，位于用于紧固的孔的每个相应边缘处的两个表面夹在该对钩和夹持构件之间。此外，紧固装置被构造成使得一对钩之间的接合位置可变，从而允许每个相应的钩抵靠圆柱形壳体的角度改变并且因此允许夹持构件和一对钩子之间的夹持距离更改。

27. 发明授权

US07641394B2 Bearing apparatus for a wheel of vehicle 有权
标题翻译：用于车轮的轴承装置
公开(公告)号：US07641394B2
公开(公告)日：2010-01-05
申请号：US12277427
申请日：2008-11-25
申请人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota
发明人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota
IPC分类号： F16C19/38
CPC分类号： F16C19/386 , B60B27/00 , B60B27/001 , F16C19/497 , F16C19/505 , F16C33/64 , F16C43/04 , F16C2240/40 , F16C2240/80 , F16C2326/02
摘要： A vehicle wheel bearing apparatus has an outer member and inner member. The inner member includes a wheel hub and inner ring. The outer member and inner member include respective raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces, respectively, of the outer member and the inner member. At least the inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side rolling elements is set smaller than a pitch circle diameter of the outer side rolling elements. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends near to a shaft shaped portion beyond the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range. The outer side wall of the wheel hub is formed to have a substantially constant thickness along the inner surface of the recess.
摘要翻译：车轮轴承装置具有外部构件和内部构件。内部构件包括轮毂和内圈。外部构件和内部构件包括相应的滚道表面。双列滚动元件可自由地滚动地容纳在外部构件和内部构件的外部和内部滚道表面之间。至少双列滚动元件的内侧滚动元件是圆锥滚子。内侧滚动体的节圆直径设定为小于外侧滚动体的节圆直径。在轮毂的外侧端部形成大致圆锥形的凹部。所述凹部的深度靠近所述轮毂的所述内滚道表面的底部之外的轴形部分延伸。形成内滚道表面的轮毂的一部分的厚度设定在预定范围内。轮毂的外侧壁沿着凹部的内表面形成为具有基本恒定的厚度。

28. 发明授权

US5975534A Sealing device 失效
标题翻译：密封装置
公开(公告)号：US5975534A
公开(公告)日：1999-11-02
申请号：US839314
申请日：1997-04-17
申请人： Eiji Tajima , Kazuhiro Baba , Shinji Nishio
发明人： Eiji Tajima , Kazuhiro Baba , Shinji Nishio
IPC分类号： F16J15/32 , F16J15/16
CPC分类号： F16J15/3264
摘要： A sealing device designed to minimize accumulation of a fluid medium trapped therein to thereby increase a sealing performance and adapted to seal a space between inner and outer peripheral members rotatable relative to each other. The sealing device includes a generally L-sectioned annular sealing plate fitted to one of the inner and outer peripheral members and a generally L-sectioned annular sealing element fitted to the other of the inner and outer peripheral members so as to confront the sealing plate. The sealing plate has a radial wall and a tilted wall extending from the radial wall so as to incline inwardly thereof, and the sealing element includes a generally L-sectioned base plate provided with an elastic member. The elastic member has a side lip slidably engageable with the radial wall of the sealing plate and a radial lip slidingly engageable with a cylindrical sleeve of the sealing plate.
摘要翻译：一种密封装置，其设计成使被捕获的流体介质的积聚最小化，从而增加密封性能并且适于密封可相对于彼此旋转的内外周构件之间的空间。该密封装置包括一个大体为L形的环形密封板，该密封板安装在内外周件之一和大体上L形的环形密封元件，该密封件安装在内周和外周件中的另一个上，以便面对密封板。密封板具有径向壁和从径向壁延伸以向内倾斜的倾斜壁，并且密封元件包括设置有弹性构件的大致L形截面的底板。弹性构件具有可与密封板的径向壁可滑动地接合的侧唇和与密封板的圆柱形套筒滑动接合的径向唇缘。

29. 发明授权

US08840313B2 Bearing apparatus for a wheel of vehicle 有权
标题翻译：用于车轮的轴承装置
公开(公告)号：US08840313B2
公开(公告)日：2014-09-23
申请号：US12057531
申请日：2008-03-28
申请人： Kazuo Komori , Masahiro Kiuchi , Kazuhiro Baba
发明人： Kazuo Komori , Masahiro Kiuchi , Kazuhiro Baba
IPC分类号： F16C13/00 , F16C33/58 , F16C33/64 , B60B27/00 , F16C19/18
CPC分类号： B60B27/0005 , B60B27/0084 , B60B27/0094 , F16C19/185 , F16C19/186 , F16C33/581 , F16C33/585 , F16C33/64 , F16C2240/40 , F16C2240/80 , F16C2326/02 , Y02T10/86
摘要： A vehicle wheel bearing apparatus has an outer member (2, 30) formed with double row outer raceway surfaces (2a, 2b) on its inner circumferential surface. Inner members (1, 20, 29, 35, 38) are each formed with double row inner raceway surfaces (4a, 5a, 31a) on its outer circumferential surface arranged opposite to the double row outer raceway surfaces (2a, 2b). Double row ball groups (3) are freely rollably contained between the outer raceway surfaces (2a, 2b) and inner raceway surfaces (4a, 5a, 31a) of the inner members (1, 20, 29, 35, 38) and the outer member (2, 30). A pitch circle diameter (PCDo) of a ball group (3) near a wheel mounting flange (6) is larger than a pitch circle diameter (PCDi) of a ball group (3) away from the wheel mounting flange (6). Each corner of the shoulders of the outer and inner raceway surfaces (2a, 2b, 4a, 5a, 31a) is rounded as a smooth circular arc.
摘要翻译：车轮轴承装置具有在其内周面上形成有双列外滚道表面（2a，2b）的外部构件（2,30）。内部构件（1,20,29,35,38）在与双列外滚道表面（2a，2b）相对布置的外圆周表面上分别形成有双列内滚道表面（4a，5a，31a）。双列球组（3）可自由地滚动地容纳在内部构件（1,20,20,35,38）的外滚道表面（2a，2b）和内滚道表面（4a，5a，31a）之间，会员（2,30）。靠近车轮安装法兰（6）的球组（3）的节圆直径（PCDo）大于远离车轮安装法兰（6）的球组（3）的节圆直径（PCDi）。外滚道表面和内滚道表面（2a，2b，4a，5a，31a）的肩部的每个角部都是平滑的圆弧圆形。

30. 发明申请

US20100046871A1 SENSOR-EQUIPPED BEARING FOR WHEEL 有权
标题翻译：传感器轴承轴承
公开(公告)号：US20100046871A1
公开(公告)日：2010-02-25
申请号：US12450442
申请日：2008-03-25
申请人： Takayuki Norimatsu , Toru Takahashi , Kazuo Komori , Kazuhiro Baba , Kentarou Nishikawa
发明人： Takayuki Norimatsu , Toru Takahashi , Kazuo Komori , Kazuhiro Baba , Kentarou Nishikawa
IPC分类号： F16C41/00
CPC分类号： F16C33/58 , B60B27/0005 , B60B27/0068 , B60B27/0094 , F16C19/186 , F16C19/522 , F16C41/00 , F16C2326/02 , G01L5/0019
摘要： To provide a sensor equipped wheel support bearing assembly, in which a load sensor can be installed compactly in an automotive vehicle, maintaining a high sensitivity while damage and/or malfunction caused by the external environments and/or the electromagnetic noises are avoided, with low manufacturing cost. This bearing assembly includes outer and inner members having respective rolling surfaces and a plurality of rows of rolling elements interposed between those rolling surfaces. A strain sensor unit including a sensor element is fitted to one of the outer and inner members, which is a stationary member, for example, the outer member. A sensor mounting surface of the strain sensor unit fitted with the sensor element has a covering member made of a resin, which is over-molded, or an elastomer bonded by vulcanization, so as to cover the sensor element sealingly.
摘要翻译：为了提供一种传感器配备的车轮支撑轴承组件，其中负载传感器可以紧凑地安装在机动车辆中，在避免由外部环境和/或电磁噪声引起的损坏和/或故障的情况下保持高灵敏度，具有低制造成本。该轴承组件包括具有各自的滚动表面的外部和内部构件以及插入在这些滚动表面之间的多排滚动元件。包括传感器元件的应变传感器单元被安装到作为固定构件的外部构件和内部构件中的一个，例如外部构件。安装有传感器元件的应变传感器单元的传感器安装表面具有由树脂制成的覆盖构件，或者通过硫化粘合的弹性体，以便密封地覆盖传感器元件。

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