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    • 21. 发明专利
    • Bonded structure and method of manufacturing the same
    • 粘结结构及其制造方法
    • JP2005210135A
    • 2005-08-04
    • JP2005036806
    • 2005-02-14
    • Tdk CorpTdk株式会社
    • HATTA MASAATSUUCHIYAMA RYOTA
    • H01F7/02H01F41/02
    • PROBLEM TO BE SOLVED: To provide a bonded structure using a magnet adapted to enable the effective elimination of the defective solidification of an adhesive material that is chemically inactive with respect to a nickel plated coating, reduce variations in adhesion strength but obtain large adhesive strength and also obtain high efficiency in adhesion-bonding work.
      SOLUTION: The magnet 2 has an R-TM-B-based rare earth magnet body 4 that contains R, TM and B wherein the R denotes at least one of rare earth elements including Y and TM denotes transition elements, containing Fe as a base component; a protective film 6 made of a nickel coat film formed on the surface of the magnet body; and a phosphate coated film 8 thinner than 0.1 μm in thickness formed on the surface of the protective film subjected to phosphate treatment using a processing liquid that does not contain fluoride. The adhesively bonded structure is constructed by bonding an iron member to the side of the phosphate coated film 8 of the magnet 2 with an adhesive.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供一种使用适于能够有效消除相对于镀镍涂层化学惰性的粘合剂材料的不良凝固的磁体的粘合结构,减少粘合强度的变化,但是获得大的 粘合强度,并且在粘合作业中获得高效率。 解决方案:磁体2具有包含R,TM和B的R-TM-B基稀土磁体4,其中R表示包括Y和TM的稀土元素中的至少一种表示过渡元素,其含有Fe 作为基础组件; 由形成在磁体表面上的镍涂膜形成的保护膜6; 以及使用不含氟化物的处理液进行磷酸盐处理的保护膜的表面上形成的厚度小于0.1μm的磷酸盐被膜8。 粘合结合体是用粘合剂将铁构件粘合到磁体2的磷酸酯涂敷膜8的一侧构成的。 版权所有(C)2005,JPO&NCIPI
    • 25. 发明专利
    • Composite material for magnetic core
    • 磁芯复合材料
    • JP2009105330A
    • 2009-05-14
    • JP2007277931
    • 2007-10-25
    • Tdk CorpTdk株式会社
    • UCHIYAMA RYOTAMORO EIJI
    • H01F1/22H01F27/255
    • PROBLEM TO BE SOLVED: To provide a composite material for magnetic core capable of forming a magnetic core whose insulating characteristics can be stably maintained over a long period of time.
      SOLUTION: The composite material for magnetic core in a suitable embodiment contains: ferromagnetic powder; epoxy resin having a thermosetting property; a curing agent of epoxy resin whose molecular weight is 2,000 or more and/or a curing agent of epoxy resin which has at least one kind of structure selected from a group comprising a polyamidimide structure, a polyvinylphenol structure, a bismaleimide structure and a silicone structure.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 解决的问题:提供一种能够长时间稳定地保持其绝缘特性的可形成磁芯的磁芯用复合材料。 解决方案:在合适的实施例中,用于磁芯的复合材料包含:铁磁粉末; 具有热固性的环氧树脂; 分子量为2,000以上的环氧树脂固化剂和/或具有选自包含聚酰胺酰亚胺结构,聚乙烯基苯酚结构,双马来酰亚胺结构和硅酮结构的组中的至少一种结构的环氧树脂固化剂 。 版权所有(C)2009,JPO&INPIT
    • 26. 发明专利
    • Method of manufacturing complex circuit board
    • 制造复合电路板的方法
    • JP2007128968A
    • 2007-05-24
    • JP2005318494
    • 2005-11-01
    • Tdk CorpTdk株式会社
    • KOSARA HISASHIUEMATSU HIROYUKIUCHIYAMA RYOTAHATANAKA KIYOSHI
    • H05K3/46
    • PROBLEM TO BE SOLVED: To prevent damage of a ceramic substrate in forming a resin layer on a surface of the ceramic substrate, to reduce dispersion of thickness of a compound wiring board, and to ensure sufficient surface smoothness.
      SOLUTION: The ceramic substrate and a resin sheet are overlapped and arranged. They are stuck by vacuum lamination. The ceramic substrate and the resin sheet are arranged between a heating plane and a film, a space formed by the heating plane and the film is pressure-reduced, and the film expanded to a direction of the heating plane is pressed to the ceramic substrate and the resin sheet with heating gas so as to laminate them as vacuum lamination. It is desirable to perform resin curing with heating atmosphere as a medium after lamination.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了防止在陶瓷基板的表面上形成树脂层时的陶瓷基板的损坏,减少复合布线板的厚度分散,并且确保足够的表面光滑度。 <解决方案>陶瓷基板和树脂片重叠配置。 它们被真空层压粘住。 陶瓷基板和树脂片布置在加热平面和膜之间,由加热平面形成的空间和膜被减压,并且向加热平面方向膨胀的膜被压到陶瓷基板上, 该树脂片具有加热气体,以将它们层压成真空层压。 优选在层压后以加热气氛作为介质进行树脂固化。 版权所有(C)2007,JPO&INPIT
    • 28. 发明专利
    • Thermosetting resin composition, and prepreg, metal foil and substrate using the same
    • 热固性树脂组合物和PREPREG,金属箔和使用其的底物
    • JP2006063230A
    • 2006-03-09
    • JP2004249098
    • 2004-08-27
    • Showa Highpolymer Co LtdTdk CorpTdk株式会社昭和高分子株式会社
    • UCHIYAMA RYOTANISHIGUCHI SHOJI
    • C08L25/00B32B15/08C08F12/34C08J5/24C08L71/12C08L101/00H05K1/03
    • PROBLEM TO BE SOLVED: To provide a high-performance thermosetting resin composition excellent in low-cost nature, processability and reliability, wherein the thermosetting resin composition has dielectric properties such as a low dielectric constant and a low dielectric loss suitable for high-frequency applications; when the resin composition is applied to a prepreg or metal foil, the amount of the resin composition can easily be controlled; and dimensional stability can be improved by making it possible to control flow during pressing, and to provide a prepreg, metal foil and a substrate using the same.
      SOLUTION: The thermosetting resin composition comprises a thermosetting resin composition containing a vinylbenzyl compound as an essential ingredient and 1-30 wt% based on the total resin volume of a thermoplastic resin having a dielectric constant (ε') of 3.0 or less and a dielectric loss tangent (tan δ) of 0.002 or less in the 5 GHz frequency band. There are also provided a prepreg, metal foil and a substrate using the thermosetting resin composition.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 解决问题:为了提供低成本,加工性和可靠性优异的高性能热固性树脂组合物,其中热固性树脂组合物具有介电性能如低介电常数和适合高的介电损耗 频率应用; 当将树脂组合物施加到预浸料或金属箔时,可以容易地控制树脂组合物的量; 通过使挤压时的流动控制成为可能,能够提高尺寸稳定性,能够提供预浸料,金属箔和使用其的基板。 解决方案:热固性树脂组合物包含含有乙烯基苄基化合物作为必需成分的热固性树脂组合物,并且基于介电常数(ε')为3.0以下的热塑性树脂的总树脂体积为1-30重量% 在5GHz频带中的介电损耗角正切(tanδ)为0.002以下。 还提供了使用该热固性树脂组合物的预浸料,金属箔和基材。 版权所有(C)2006,JPO&NCIPI
    • 29. 发明专利
    • Resin or resin composition for molded product
    • 模制产品的树脂或树脂组合物
    • JP2005248102A
    • 2005-09-15
    • JP2004063626
    • 2004-03-08
    • Showa Highpolymer Co LtdTdk CorpTdk株式会社昭和高分子株式会社
    • YOSHIDA HARUONISHIGUCHI SHOJIKOBUNE HIROTAKAUCHIYAMA RYOTA
    • C08L101/00C08K5/06C08K5/17C08K5/3477C08K5/46
    • PROBLEM TO BE SOLVED: To provide a resin or a resin composition which gives a molded product having good initial dielectric properties and hardly undergoes changes in dielectric properties, particularly a dielectric dissipation factor in a high frequency zone of at least 1 MHz, particularly at least 1 GHz when left at a high temperature.
      SOLUTION: The resin or the resin composition comprises a vinylbenzyl compound represented by general formula (1) (wherein R
      1 is a methyl or ethyl group; R
      2 is a hydrogen atom or a 1-10C hydrocarbon group; and n is an integer of 2-6) and, incorporated therewith, triethylenediamine and/or hexamethylenetetramine, where phenothiazine is added at the time of the manufacture or after the manufacture of the vinylbenzyl compound.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供一种树脂或树脂组合物,其给出具有良好的初始介电性能的成型产品,并且几乎不会发生介电性能的变化,特别是至少1MHz的高频区域的介电损耗因子, 特别是在高温下保持至少1GHz。 解决方案:树脂或树脂组合物包含由通式(1)表示的乙烯基苄基化合物(其中R 1 是甲基或乙基; R 2 SP 2是 氢原子或1-10C烃基; n为2-6的整数),并且与其组合,可制备或制造乙烯基苄基化合物时加入吩噻嗪的三亚乙基二胺和/或六亚甲基四胺 。 版权所有(C)2005,JPO&NCIPI