专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07782616B1 Heat-dissipating component having stair-stepped coolant channels 有权
标题翻译：具有阶梯式冷却剂通道的散热部件
公开(公告)号：US07782616B1
公开(公告)日：2010-08-24
申请号：US12428846
申请日：2009-04-23
申请人： Bruce A. Myers , Suresh K. Chengalva , Darrell E. Peugh
发明人： Bruce A. Myers , Suresh K. Chengalva , Darrell E. Peugh
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/048 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating component including a heat-generating device such as a power semiconductor chip and a mounting structure is provided with coolant channels having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels, and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels. The stair-stepped channels are formed in the heat generating device and/or the mounting structure, and the stepped sidewalls may extend toward or away from the center of the channel.
摘要翻译：包括诸如功率半导体芯片和安装结构的发热装置的散热部件设置有具有阶梯式内部几何形状的冷却剂通道，其具有单相和两相冷却模式的冷却性能，而不会不适当地限制冷却剂流动或显着增加制造成本。台阶几何通过增加通道的表面积来增强单相和两相冷却模式，并且通过在通道的长度上提供许多高质量的气泡成核位点，进一步增强了两相冷却模式。台阶状通道形成在发热装置和/或安装结构中，并且台阶侧壁可以朝向或远离通道的中心延伸。

22. 发明授权

US07352585B2 Flip chip heat sink package and method 有权
标题翻译：倒装芯片散热片封装及方法
公开(公告)号：US07352585B2
公开(公告)日：2008-04-01
申请号：US11583316
申请日：2006-10-19
申请人： Larry M Mandel , Kevin M. Gertiser , Suresh K. Chengalva , Dwadasi H. Sarma , David W. Zimmerman
发明人： Larry M Mandel , Kevin M. Gertiser , Suresh K. Chengalva , Dwadasi H. Sarma , David W. Zimmerman
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L21/4878 , H01L21/4882 , H01L21/563 , H01L23/3675 , H01L23/3677 , H01L23/42 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , Y10T29/49144
摘要： An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.
摘要翻译：提供具有增强的散热的电子封装，其呈现出相反方向上的双重传导热路径。封装包括其上具有电导体的基板和安装到基板的倒装芯片。倒装芯片具有第一表面，第一表面上的焊料凸块和与第一表面相对设置的第二表面。倒装芯片安装到基板上，使得焊料凸块与基板上的导体对准。该封装还包括与倒装芯片的第二表面传热关系的冲压金属散热器。散热器包括与包含导热材料的倒装芯片相邻形成的空腔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式