会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 25. 发明申请
    • Contact formation method and semiconductor device
    • 触点形成方法和半导体器件
    • US20050189651A1
    • 2005-09-01
    • US10625546
    • 2003-07-24
    • Yutaka HiroseYoshito IkedaKaoru Inoue
    • Yutaka HiroseYoshito IkedaKaoru Inoue
    • H01L21/285H01L23/48H01L33/00H01L33/32H01L33/40H01S5/042H01S5/323
    • H01L21/28575H01L33/0095H01L33/32H01L33/40H01S5/0425H01S5/32341
    • An object of the present invention is to reduce the resistance of an electrode of a Group III nitride semiconductor. A thin Si film and a thin Ti film are formed selectively in a contact formation region on a surface of an AlGaN layer as a Group III nitride semiconductor layer formed on a substrate, and the resulting substrate is heat-treated at a high temperature. By the heat treatment, Si is diffused into the AlGaN layer in the ohmic contact formation region at a concentration of about 1020 cm3. Further, an electron density sufficiently high to provide an ohmic characteristic through a reaction between Si and Ti is provided. Thus, a low resistance TiSi2 portion resulting from the reaction between Si and Ti, a TiN portion resulting from a reaction between Ti and AlGaN and a Group III metal portion of Ga and Al devoid of nitrogen are formed in the contact formation region thereby to provide a low resistance electrode film mainly comprising TiSi2.
    • 本发明的目的是降低III族氮化物半导体的电极的电阻。 在AlGaN层的表面上的接触形成区域中选择性地形成薄的Si膜和薄的Ti膜,作为形成在衬底上的III族氮化物半导体层,并将所得到的衬底在高温下进行热处理。 通过热处理,Si在欧姆接触形成区域中扩散到约10 20 cm 3的浓度的AlGaN层中。 此外,提供足够高的电子密度以通过Si和Ti之间的反应提供欧姆特性。 因此,形成由Si和Ti之间的反应产生的低电阻TiSi 2 H 2部分,由Ti和AlGaN之间的反应导致的TiN部分和缺少氮的Ga和Al的III族金属部分 在接触形成区域中,由此提供主要包含TiSi 2 N的低电阻电极膜。