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21. 发明申请

US20110067910A1 COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD 审中-公开
标题翻译：组件安全系统及相关方法
公开(公告)号：US20110067910A1
公开(公告)日：2011-03-24
申请号：US12562499
申请日：2009-09-18
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/3421 , H05K3/3452 , H05K2201/10189 , H05K2203/0191 , H05K2203/167 , Y02P70/613 , Y10T29/4913
摘要： A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil.
摘要翻译：将组件固定到电路板的系统可以包括印刷电路板，表面安装部件和由表面安装部件承载的引线。该系统还可以包括粘附在印刷电路板和表面安装部件中的至少一个之间的模板以及与模板相邻的引线。

22. 发明授权

US07651890B2 Method and apparatus for prevention of solder corrosion 失效
标题翻译：防止焊料腐蚀的方法和装置
公开(公告)号：US07651890B2
公开(公告)日：2010-01-26
申请号：US11532329
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L23/26
CPC分类号： H01L23/26 , H01L23/3672 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15311 , H01L2224/0401
摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
摘要翻译：公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

23. 发明授权

US07440281B2 Thermal interface apparatus 有权
标题翻译：热接口设备
公开(公告)号：US07440281B2
公开(公告)日：2008-10-21
申请号：US11344657
申请日：2006-02-01
申请人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
发明人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
摘要翻译：一种用于将热量从计算机部件传导到散热器的装置。本发明可以包括热界面材料（TIM）。本发明还可以包括至少部分地包围TIM的密封件或垫圈。垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。插入件可以放置在垫圈内并且限定孔。芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

24. 发明授权

US06794571B1 EMC sealing system and method for an electrical enclosure 失效
标题翻译： EMC密封系统和电气外壳的方法
公开(公告)号：US06794571B1
公开(公告)日：2004-09-21
申请号：US10701578
申请日：2003-11-05
申请人： Dennis R. Barringer , Daniel J. Kearney , Steven C. McIntosh , Edward J. Seminaro , Prabjit Singh , Harold M. Toffler
发明人： Dennis R. Barringer , Daniel J. Kearney , Steven C. McIntosh , Edward J. Seminaro , Prabjit Singh , Harold M. Toffler
IPC分类号： H05K900
CPC分类号： G06F1/182 , H01R13/6584 , H01R13/6594 , Y10S277/919 , Y10S277/92
摘要： A method and apparatus for providing an electromagnetic conduction seal in a device disposed within an electrical enclosure includes a metal EMC gasket defined by a first end an and opposite second end. The first end is operably secured to the device and at least the second end is allowed to float while remaining in electrical contact with the device. A lock strip is fixed to the device and is configured to provide limits of deflection of an intermediate portion of the gasket intermediate the first and second ends and captivate at least one floating end of the gasket. The intermediate portion provides an electromagnetic conduction seal between the device and with at least one of another device and/or the electrical enclosure.
摘要翻译：在设置在电气外壳内的装置中提供电磁传导密封的方法和装置包括由第一端和相对的第二端限定的金属EMC垫圈。第一端可操作地固定到装置上，并且至少允许第二端浮动，同时保持与装置的电接触。锁定条被固定到该装置上，并被配置成提供垫片中间部分在第一和第二端部之间的偏转限制，并且吸引垫圈的至少一个浮动端部。中间部分在该装置与另一装置和/或电气外壳中的至少一个之间提供电磁传导密封。

25. 发明授权

US06636065B2 System and method for a device reliability and test circuit 失效
公开(公告)号：US06636065B2
公开(公告)日：2003-10-21
申请号：US09896590
申请日：2001-06-29
申请人： George T. Galyon , King M. Chu , Jeffrey A. Newcomer , Prabjit Singh
发明人： George T. Galyon , King M. Chu , Jeffrey A. Newcomer , Prabjit Singh
IPC分类号： G01R3126
CPC分类号： G01R31/2841
摘要： An exemplary embodiment is a system and method for a device reliability test circuit. The method includes applying a DC voltage across the device for a period, wherein the DC voltage is less than the rated voltage of said device, and determining a failure point of the device based on applying the DC voltage.

26. 发明授权

US06570389B2 Prevention of arcing in power supplies 有权
标题翻译：防止电力电弧
公开(公告)号：US06570389B2
公开(公告)日：2003-05-27
申请号：US09881996
申请日：2001-06-15
申请人： Prabjit Singh , George T. Galyon , Lenas J. Hedlund , Steven Mazzuca , Victor A. Ronken , Yiping Yao
发明人： Prabjit Singh , George T. Galyon , Lenas J. Hedlund , Steven Mazzuca , Victor A. Ronken , Yiping Yao
IPC分类号： G01N2762
CPC分类号： G01N27/92 , G01R31/1227 , G01R31/40
摘要： A power supply to be tested is placed in a vacuum chamber; the power supply is turned on and gas pressure in the chamber is reduced. As the gas pressure is reduced below 1 atmosphere, the breakdown voltage decreases; when the breakdown voltage decreases to the value of the applied voltage, arcing occurs as long as the applied voltage is greater than a minima. When a site arcs, the site is noted; the power supply is removed from the vacuum chamber; the arc site is conformally coated and the coated cured. Thereafter, the power supply is returned to the vacuum chamber and the test process repeated until the power supply no longer arcs. Thus the partial pressure test can identify the sites that have a possibility of arcing in the field and the design of the power supply modified by use of one or more conformal coatings or by otherwise changing the configuration of the power supply.
摘要翻译：要测试的电源放置在真空室中; 电源打开，腔室内的气体压力降低。当气体压力降低到1个大气压以下时，击穿电压降低; 当击穿电压降低到施加电压的值时，只要施加的电压大于最小值，就会发生放电。当站点弧时，站点被注意到; 电源从真空室中取出; 电弧部位被保形涂覆并涂覆固化。此后，电源返回到真空室，重复测试过程，直到电源不再弧。因此，分压测试可以识别在现场具有电弧可能性的场所，以及通过使用一个或多个保形涂层修改的电源的设计，或通过另外改变电源的配置。

27. 发明授权

US5167513A Load limited pin for an electrical connector 失效
标题翻译：用于电连接器的限位销
公开(公告)号：US5167513A
公开(公告)日：1992-12-01
申请号：US744761
申请日：1991-08-14
申请人： Richard A. Johnson , Howell B. Schwartz , Prabjit Singh , Basil D. Washo
发明人： Richard A. Johnson , Howell B. Schwartz , Prabjit Singh , Basil D. Washo
IPC分类号： H01G4/228 , H01R4/02 , H01R12/58 , H05K3/34
CPC分类号： H05K3/3426 , H01R12/58 , H01R4/02 , Y02P70/613
摘要： A connector pin that has one or more regions along its length modified in cross-section so the region deforms plastically as a result of stress induced by displacement of connected members. As used herein, plastic definition means that the structure approaches a condition where it will continue to yield without increase in load. Each region therefore provides a deformable or "plastic" hinge, limiting a moment applied to the solder joint as a result of lateral displacement of the connector relative to the circuit board.
摘要翻译：连接器销，其沿着其长度具有一个或多个沿横截面改变的区域，使得该区域由于连接构件的位移引起的应力而塑性变形。如本文所用，塑性定义意味着结构接近其将在不增加负载的情况下继续屈服的状态。因此，每个区域提供可变形或“塑性”铰链，限制由于连接器相对于电路板的横向位移而施加到焊点上的力矩。

28. 发明授权

US08672688B2 Land grid array interposer with compressible conductors 有权
标题翻译：具有可压缩导体的土地栅格阵列插入器
公开(公告)号：US08672688B2
公开(公告)日：2014-03-18
申请号：US13351731
申请日：2012-01-17
申请人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Prabjit Singh
发明人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H01R12/714
摘要： An electrical interconnect is provided for use within, for example, a land grid array (LGA) interposer such as a module-to-board connector. The electrical interconnect includes an electrically-conductive, compressible conductor which has a first conductor end portion and a second conductor end portion. The first and second conductor end portions physically contact in slidable relation each other with compression of the compressible conductor to facilitate inhibiting rotation of the compressible conductor. In one embodiment, the first end portion includes at least one first leg and the second end portion includes at least two second legs, and the at least one first leg and at least two second legs are interdigitated. Further, in one embodiment, the first end portion and the second end portion are each in slidable contact with an inner-facing surface of the compressible conductor.
摘要翻译：提供电互连以用于例如诸如模块到板连接器的平面栅格阵列（LGA）插入器。电互连包括导电的可压缩导体，其具有第一导体端部和第二导体端部。第一和第二导体端部通过压缩可压缩导体的压缩而以可滑动的关系彼此物理接触，以便于抑制可压缩导体的旋转。在一个实施例中，第一端部包括至少一个第一腿部，并且第二端部部分包括至少两个第二腿部，并且所述至少一个第一腿部和至少两个第二腿部交叉。此外，在一个实施例中，第一端部和第二端部各自与可压缩导体的内表面滑动接触。

29. 发明申请

US20110070775A1 DELAYED CONTACT ACTION CONNECTOR 失效
标题翻译：延迟接触动作连接器
公开(公告)号：US20110070775A1
公开(公告)日：2011-03-24
申请号：US12563351
申请日：2009-09-21
申请人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
发明人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R4/48 , H01R24/00
CPC分类号： H01R12/87 , H01R12/714 , H01R12/721 , H01R12/88 , H01R13/11 , H01R13/7036
摘要： A connector having a plurality of terminals for connecting to a circuit card and a method therefore are disclosed. The connector includes a socket having a casing with an aperture for receiving the circuit card therein and a plurality of terminals made of electrically conductive material. At least one of the plurality of terminals includes an elongated portion and a substantially L-shaped portion joined together by a U-shaped portion. The elongated portion has a proximal end and a distal end, and includes a support section and a bending section between the proximal end and the distal end. The terminal is secured to the casing by the support section at or near the proximal end of the elongated portion. The U-shaped portion is disposed at the distal end of the elongated portion. The terminal continues from the U-shaped portion to a region approximately halfway towards the proximal end of the elongated portion and turns away from the elongated portion thereby forming the substantially L-shaped portion. The L-shaped portion ends in a lip section curving towards the proximal end of the elongated portion.
摘要翻译：公开了一种具有用于连接到电路卡的多个端子的连接器及其方法。连接器包括具有壳体的插座，其具有用于在其中接收电路卡的孔，以及由导电材料制成的多个端子。多个端子中的至少一个端子包括由U形部分连接在一起的细长部分和大致L形部分。细长部分具有近端和远端，并且包括支撑部分和在近端和远端之间的弯曲部分。端子通过支撑部分在细长部分的近端处或附近固定到壳体。 U形部分设置在细长部分的远端处。端子从U形部分延伸到近似于长形部分的近端的一半的区域，并且远离细长部分，从而形成大致L形的部分。 L形部分在朝向细长部分的近端弯曲的唇部中终止。

30. 发明申请

US20070177367A1 Thermal interface apparatus 有权
标题翻译：热接口设备
公开(公告)号：US20070177367A1
公开(公告)日：2007-08-02
申请号：US11344657
申请日：2006-02-01
申请人： Sean Bailey , Richard Blanco , David Edwards , Supratik Guha , Michael Hillman , Yves Martin , Phillip Mort , Roger Schmidt , Prabjit Singh , Ronald Smith , Gregory Tice , Theodore van Kessel
发明人： Sean Bailey , Richard Blanco , David Edwards , Supratik Guha , Michael Hillman , Yves Martin , Phillip Mort , Roger Schmidt , Prabjit Singh , Ronald Smith , Gregory Tice , Theodore van Kessel
IPC分类号： H05K7/12
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
摘要翻译：一种用于将热量从计算机部件传导到散热器的装置。本发明可以包括热界面材料（TIM）。本发明还可以包括至少部分地包围TIM的密封件或垫圈。垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。插入件可以放置在垫圈内并且限定孔。芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

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