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    • 23. 发明授权
    • Thermal inkjet printhead processing with silicon etching
    • 热喷墨打印头处理与硅蚀刻
    • US07521267B2
    • 2009-04-21
    • US11564782
    • 2006-11-29
    • Simon Dodd
    • Simon Dodd
    • H01L21/00
    • B41J2/1628B41J2/1601B41J2/1629B41J2/1642Y10T29/49401Y10T29/53
    • A method of etching the trench portions of a thermal inkjet printhead using a robust mask that precisely defines the area of the substrate surface to be etched and that protects the adjacent drop generator components from damaging exposure to the silicon etchant. The process in accordance with the present invention uses as a mask some of the material that is also used in patterned layers for producing the drop generator components on the substrate. The placement of the mask components on the substrate occurs simultaneously with the production of the drop generator components, thereby minimizing the time and expense of creating the silicon-etchant mask.
    • 一种使用精确限定要蚀刻的衬底表面的区域并且保护相邻的液滴发生器部件免受损坏暴露于硅蚀刻剂的鲁棒掩模蚀刻热喷墨打印头的沟槽部分的方法。 根据本发明的方法使用也用于图案化层中的一些材料作为掩模,用于在基板上产生液滴发生器部件。 掩模组分在衬底上的放置与液滴发生器组件的产生同时发生,从而最小化产生硅蚀刻掩模的时间和费用。