会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 21. 发明授权
    • Epoxy resin curing agent of aliphatic diamine/styrene addition product
    • 脂肪族二胺/苯乙烯加成产物的环氧树脂固化剂
    • US07396902B2
    • 2008-07-08
    • US10773277
    • 2004-02-09
    • Hisayuki KuwaharaMasatoshi EchigoTakeshi Koyama
    • Hisayuki KuwaharaMasatoshi EchigoTakeshi Koyama
    • C08G59/50C08L63/02C09K3/00
    • C08G59/5026C08G59/5033C08G59/681
    • The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl group and at least one hydroxyl group within the molecule, which can achieve a low viscosity without containing environmental harmful substances such as phenol and solvents. In addition, the epoxy resin composition using said epoxy resin curing agent shows an excellent curability at low temperature and it provides a cured coating film having excellent appearance H2N—H2C-A-CH2—NH2  (1) wherein A is a phenylene group or a cyclohexylene group.
    • 本发明的环氧树脂固化剂包含通过由式(1)表示的脂族二胺和苯乙烯的加成反应获得的聚氨基化合物和包含至少一个羧基和至少一个羟基的有机化合物的固化促进剂, 该分子可以实现低粘度而不含环境有害物质如苯酚和溶剂。 此外,使用所述环氧树脂固化剂的环氧树脂组合物在低温下显示出优异的固化性,并且提供具有优异外观的固化涂膜<?在线配方描述=“在线配方”末端=“铅” (1)&lt;&lt; 2&lt; 2&gt; 2&lt; 2&gt; 式描述=“In-line Formulas”end =“tail”?>其中A是亚苯基或亚环己基。
    • 29. 发明授权
    • Polyamide resins and processes for molding them
    • 聚酰胺树脂及其成型方法
    • US08841407B2
    • 2014-09-23
    • US13824695
    • 2011-11-08
    • Hatsuki OguroJun MitaderaHisayuki Kuwahara
    • Hatsuki OguroJun MitaderaHisayuki Kuwahara
    • C08G69/28C08G69/26C08L77/06
    • C08G69/265C08G69/26C08L77/06
    • Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. The polyamide resin comprises a diamine unit containing 70 mol % or more of a xylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a straight chain aliphatic dicarboxylic acid unit, wherein the xylylenediamine unit is composed of 50 to 95 mol % of p-xylylenediamine and 50 to 5 mol % of m-xylylenediamine; the straight chain aliphatic dicarboxylic acid unit is composed of 50 to 100 mol % of adipic acid and 0 to less than 50 mol % of sebacic acid or other straight chain aliphatic dicarboxylic acids; the molar ratio of reacted diamine units to reacted dicarboxylic acid units (the number of moles of reacted diamine units/the number of moles of reacted dicarboxylic acid units) is less than 0.994; and the polyamide resin has a number average molecular weight of 10,000 to 25,000 and a melting point of 285° C. or more.
    • 提供耐热性高,成型性优异,机械特性优异的聚酰胺树脂。 聚酰胺树脂包含含有70摩尔%以上的苯二甲胺单元的二胺单元和含有70摩尔%以上的直链脂肪族二羧酸单元的二羧酸单元,其中,所述苯二甲胺单元为50〜95摩尔% 对苯二甲胺和50〜5摩尔间苯二甲胺; 直链脂肪族二羧酸单元由50〜100摩尔%的己二酸和0〜小于50摩尔%的癸二酸或其它直链脂肪族二羧酸组成, 反应的二胺单元与反应的二羧酸单元的摩尔比(反应的二胺单元的摩尔数/反应的二羧酸单元的摩尔数)小于0.994; 聚酰胺树脂的数均分子量为10,000〜25,000,熔点为285℃以上。