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21. 发明授权

US09754603B2 Speech feature extraction apparatus and speech feature extraction method 有权
公开(公告)号：US09754603B2
公开(公告)日：2017-09-05
申请号：US13728287
申请日：2012-12-27
申请人： Masanobu Nakamura , Takashi Masuko
发明人： Masanobu Nakamura , Takashi Masuko
IPC分类号： G10L21/00 , G10L15/02 , G10L15/20
CPC分类号： G10L21/00 , G10L15/02 , G10L15/20
摘要： According to one embodiment, a speech feature extraction apparatus includes an extraction unit and a calculation unit. The extraction unit extracts speech segments over a predetermined period at intervals of a unit time from either an input speech signal or a plurality of subband input speech signals obtained by extracting signal components of a plurality of frequency bands from the input speech signal, to generate either a unit speech signal or a plurality of subband unit speech signals. The calculation unit calculates either each average time of the unit speech signal in each of the plurality of frequency bands or each average time of each of the plurality of subband unit speech signals to obtain a speech feature.

22. 发明授权

US09309446B2 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device 有权
标题翻译：光敏粘合剂组合物，薄膜状粘合剂，粘合片，粘合剂图案，具有粘合剂层的半导体晶片，半导体器件
公开(公告)号：US09309446B2
公开(公告)日：2016-04-12
申请号：US13410702
申请日：2012-03-02
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： G03F7/00 , G03F7/004 , C09J7/02 , H01L23/00 , G03F7/027 , G03F7/037 , G03F7/038 , C08G73/10 , C09J179/08 , H01L21/683 , H01L25/065 , H01L23/29 , H01L23/31
CPC分类号： C09J7/0203 , C08G73/105 , C08L63/00 , C09J7/35 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/08 , G03F7/027 , G03F7/037 , G03F7/038 , H01L21/6836 , H01L23/293 , H01L23/3128 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/68377 , H01L2224/05554 , H01L2224/27002 , H01L2224/27416 , H01L2224/27436 , H01L2224/27622 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , Y10T428/24802 , Y10T428/2817 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
摘要翻译：本发明涉及一种感光性粘合剂组合物，其通过曝光和显影进行图案化后具有对粘合剂的热压粘合性，并且能够进行碱显影，其中在曝光和进一步热固化后110℃下的储能弹性模量不小于10 MPa。

23. 发明授权

US08779195B2 Polyamine derivatives 失效
标题翻译：多胺衍生物
公开(公告)号：US08779195B2
公开(公告)日：2014-07-15
申请号：US12514540
申请日：2007-11-12
申请人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
发明人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
IPC分类号： C07C303/00 , C07C307/00 , C07C309/00 , C07C311/00
CPC分类号： C07C311/18 , C07C311/05
摘要： A compound having the general formula (I) or a pharmacologically acceptable salt thereof: X—NH—Y—NH—R1 (I) [wherein X represents R2—SO2— in which R2 represents an optionally substituted lower alkyl group or phenyl group; Y represents a group selected from the group consisting of —R3—NH—R4—, —R5—NH—R6—NH—R7—, —R8—NH—R9—NH—R10—NH—R11—and —R12—NH—R13—NH—R14—NH—R15— in which R3 to R15 each independently represent a C3 to C5 alkylene group; and R1 represents hydrogen or an optionally substituted lower alkyl group, with the proviso that the case where X represents a tosyl group, Y represents —(CH2)3—NH—(CH2)4—NH—(CH2)3—and R1 represents hydrogen is excepted].
摘要翻译：具有通式（I）的化合物或其药学上可接受的盐：X-NH-Y-NH-R1（I）[其中X表示R2-SO2-，其中R2表示任选取代的低级烷基或苯基; Y表示选自-R 3 -NH-R 4 - ，-R 5-NH-R 6 -NH-R 7 - ， - R 8 -NH-R 9 -NH-R 10 -NH-R 11 - 和-R 12-NH -R13-NH-R14-NH-R15-，其中R3至R15各自独立地表示C3至C5亚烷基; 并且R 1表示氢或任选取代的低级烷基，条件是X表示甲苯磺酰基，Y表示 - （CH 2）3 -NH-（CH 2）4 -NH-（CH 2）3 - 并且R 1表示氢除外]。

24. 发明授权

US08507323B2 Method of producing semiconductor device with patterned photosensitive adhesive 有权
标题翻译：用图案化感光胶制造半导体器件的方法
公开(公告)号：US08507323B2
公开(公告)日：2013-08-13
申请号：US13551816
申请日：2012-07-18
申请人： Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
发明人： Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： C09J4/00 , C08G65/3322 , C08G65/33306 , C08G2650/50 , C08L71/02 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J171/02 , C09J179/08 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.
摘要翻译：一种能够进行碱显影的感光性粘合剂，该感光性粘合剂在通过曝光和显影进行图案化后，对被粘物具有粘合性，该感光性粘接剂用于半导体装置100的制造方法中，其特征在于， 1，通过曝光和显影设置在半导体芯片20的电路表面上; 以及将另一半导体芯片21直接结合到图案化感光性粘接剂1的工序。

25. 发明授权

US08373283B2 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device 失效
标题翻译：粘合剂组合物，薄膜状粘合剂，粘合片和半导体装置
公开(公告)号：US08373283B2
公开(公告)日：2013-02-12
申请号：US13057322
申请日：2009-04-30
申请人： Takashi Masuko , Shigeki Katogi
发明人： Takashi Masuko , Shigeki Katogi
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： C09J4/06 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C09J7/20 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2463/00 , C09J2479/08 , H01L21/6836 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68377 , H01L2224/27436 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48221 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83885 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , Y10T428/287 , Y10T428/2896 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group.
摘要翻译：本发明的粘合剂组合物包含（A）Tg不高于100℃的热塑性树脂和（B）热固性组分，其中（B）热固性组分包括（B1）具有烯丙基的化合物和（B2）具有马来酰亚胺基团的化合物。

26. 发明申请

US20120256326A1 ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF 审中-公开
标题翻译：胶粘组合物，其半导体器件及其制造方法
公开(公告)号：US20120256326A1
公开(公告)日：2012-10-11
申请号：US13509355
申请日：2010-11-10
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： C09J163/00 , H01L29/02 , C09J163/02 , H01L21/50
CPC分类号： H01L23/3128 , C08F220/32 , C08F222/1006 , C09J4/06 , H01L21/565 , H01L21/67115 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48221 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/92 , H01L2224/92247 , H01L2224/94 , H01L2225/0651 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/03 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm2 or less at 30° C. and 200 gf/cm2 or more at 120° C.
摘要翻译：公开了一种用于粘合含有可辐射聚合化合物，光引发剂和热固性树脂的半导体芯片的粘合剂组合物。当通过照射使形成粘合剂层的粘合剂组合物达到B阶时，粘合剂层的表面在30℃下具有200gf / cm 2以下的粘合力，在30℃下具有200gf / cm 2以上的粘着力 120°C

27. 发明申请

US20120248634A1 METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造薄膜粘合剂的方法，粘合片，半导体器件以及制造半导体器件的方法
公开(公告)号：US20120248634A1
公开(公告)日：2012-10-04
申请号：US13509370
申请日：2010-11-10
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
IPC分类号： H01L21/50 , B05D3/06 , C09J7/02 , H01L23/00
CPC分类号： H01L24/27 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H01L2924/3025 , Y10T428/2809 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive.
摘要翻译：根据本发明的膜状粘合剂的制造方法包括：涂布粘合剂组合物，其包含（A）辐射聚合性化合物，（B）光引发剂和（C）热固性树脂，溶剂含量为5 质量％以下，在25℃下为液体，在基材上形成粘合剂组合物层; 并用光照射粘合剂组合物层，从而形成膜状粘合剂。

28. 发明申请

US20110159238A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT 审中-公开
标题翻译：光敏胶粘剂组合物，感光胶粘剂，粘合剂图案，带有粘合剂，半导体器件和电子部件的半导体滤波器
公开(公告)号：US20110159238A1
公开(公告)日：2011-06-30
申请号：US13060679
申请日：2009-08-26
申请人： Takashi Kawamori , Kazuyuki Mitsukura , Takashi Masuko , Shigeki Katogi
发明人： Takashi Kawamori , Kazuyuki Mitsukura , Takashi Masuko , Shigeki Katogi
IPC分类号： B32B3/02 , G03F7/004 , B32B17/10
CPC分类号： C09J4/00 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/20 , C08L2666/22 , C09J4/06 , C09J163/00 , C09J179/08 , G03F7/038 , G03F7/70383 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2224/16 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83856 , H01L2224/92247 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12041 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24355 , Y10T428/287 , Y10T428/31518 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T1 (μm) of the adhesive pattern formed after development satisfying the conditions represented by the following expression (1). (T1/T0)×100≧90 (1) [In expression (1), T0 represents the film thickness (μm) of the adhesive layer before developing treatment.]
摘要翻译：一种感光性粘合剂组合物，其可以在被粘物上形成粘合剂层，并通过曝光处理形成粘合剂图案，并用显影液进行显影处理，该感光性粘合剂组合物具有溶解性和显影性，并且膜厚度T1（μm ）形成的粘合剂图案满足以下表达式（1）表示的条件。（T1 / T0）×100≥90（1）[表达式（1）中，T0表示显影处理前的粘合剂层的膜厚（μm）]

29. 发明授权

US07647224B2 Apparatus, method, and computer program product for speech recognition 失效
标题翻译：用于语音识别的装置，方法和计算机程序产品
公开(公告)号：US07647224B2
公开(公告)日：2010-01-12
申请号：US11285013
申请日：2005-11-23
申请人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
发明人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
IPC分类号： G10L15/00 , G10L19/14 , G10L15/04
CPC分类号： G10L15/02
摘要： A speech recognition apparatus includes a sound information acquiring unit that acquires sound information, a unit segment dividing unit that divides the sound information into plural unit segments, a segment information acquiring unit that acquires segment information that indicates a feature of each unit segment, a segment relation value calculating unit that calculates a segment relation value that indicates a relative feature of a target segment which is a unit segment to be processed with respect to an adjacent segment which is a unit segment adjacent to the target segment, based on segment information of the target segment and segment information of the adjacent segment among the segment information, a recognition candidate storing unit that stores recognition candidates that are targets of speech recognition, and a recognition result selecting unit that selects a recognition result from the recognition candidates stored in the recognition candidate storing unit utilizing the segment relation value.
摘要翻译：一种语音识别装置，包括获取声音信息的声音信息获取单元，将声音信息分割为多个单位区段的单位分割单元，获取表示每个单位区间的特征的区段信息的分段信息获取单元，关系值计算单元，其基于所述目标段的分段信息，计算表示作为与所述目标段相邻的作为单位段的相邻段的要处理的单位段的目标段的相对特征的段关系值分段信息中的相邻段的目标段和段信息，存储作为语音识别的目标的识别候选的识别候选存储单元和从存储在识别候选中的识别候选中选择识别结果的识别结果选择单元存储单元关系价值。

30. 发明申请

US20060136206A1 Apparatus, method, and computer program product for speech recognition 失效
标题翻译：用于语音识别的装置，方法和计算机程序产品
公开(公告)号：US20060136206A1
公开(公告)日：2006-06-22
申请号：US11285013
申请日：2005-11-23
申请人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
发明人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
IPC分类号： G10L15/00
CPC分类号： G10L15/02
摘要： A speech recognition apparatus includes a sound information acquiring unit that acquires sound information, a unit segment dividing unit that divides the sound information into plural unit segments, a segment information acquiring unit that acquires segment information that indicates a feature of each unit segment, a segment relation value calculating unit that calculates a segment relation value that indicates a relative feature of a target segment which is a unit segment to be processed with respect to an adjacent segment which is a unit segment adjacent to the target segment, based on segment information of the target segment and segment information of the adjacent segment among the segment information, a recognition candidate storing unit that stores recognition candidates that are targets of speech recognition, and a recognition result selecting unit that selects a recognition result from the recognition candidates stored in the recognition candidate storing unit utilizing the segment relation value.
摘要翻译：一种语音识别装置，包括获取声音信息的声音信息获取单元，将声音信息分割为多个单位区段的单位分割单元，获取表示每个单位区间的特征的区段信息的分段信息获取单元，关系值计算单元，其基于所述目标段的分段信息，计算表示作为与所述目标段相邻的作为单位段的相邻段的要处理的单位段的目标段的相对特征的段关系值分段信息中的相邻段的目标段和段信息，存储作为语音识别的目标的识别候选的识别候选存储单元和从存储在识别候选中的识别候选中选择识别结果的识别结果选择单元存储单元关系价值。

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