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21. 发明授权

US08240166B2 Cooling system and electronic equipment including cooling system 失效
标题翻译：冷却系统和电子设备包括冷却系统
公开(公告)号：US08240166B2
公开(公告)日：2012-08-14
申请号：US12430153
申请日：2009-04-27
申请人： Noriyo Nishijima , Shigeo Ohashi , Nariaki Shigyo , Tatsuo Morita
发明人： Noriyo Nishijima , Shigeo Ohashi , Nariaki Shigyo , Tatsuo Morita
IPC分类号： F25D23/12
CPC分类号： G03B21/16
摘要： An electronic equipment includes a cooling system using boiling and condensation of a refrigerant, especially stabilizes the cooling performance, and reduces the influence which vibration accompanying phase change of boiling and condensation gives to the electronic equipment. Electronic equipment includes a cooling system including a cooling part which cools heat generating from a heat generator such as a heat generating component by using boiling of a refrigerant and is thermally connected to the heat generator such as the heat generating element, a heat radiation part which radiates heat absorbed by the refrigerant in the cooling part by condensation, a refrigerant drive part for delivering the condensed refrigerant to the cooling part again, and piping which fluidly connects them, and the electronic equipment includes preliminary heating means for heating the refrigerant, which flows to the cooling part from the refrigerant drive part, between the refrigerant drive part and the cooling part.
摘要翻译：电子设备包括使用制冷剂的沸腾和冷凝的冷却系统，特别是稳定冷却性能，并且减少伴随着冷凝相变的振动对电子设备的影响。电子设备包括冷却系统，其包括冷却部件，该冷却部件通过使用沸腾的制冷剂来冷却来自诸如发热部件的发热部件的发热的热量，并且与发热元件等发热体热连接;热辐射部件通过冷凝来散发由冷却部中的制冷剂吸收的热量，再次将冷凝后的制冷剂输送到冷却部的制冷剂驱动部以及流体连接它们的管路，电子设备包括用于加热流过的制冷剂的预热装置从制冷剂驱动部分到制冷剂驱动部分和冷却部分之间的冷却部分。

22. 发明申请

US20070012423A1 Liquid cooling jacket and liquid cooling device 审中-公开
标题翻译：液体冷却套和液体冷却装置
公开(公告)号：US20070012423A1
公开(公告)日：2007-01-18
申请号：US11412971
申请日：2006-04-28
申请人： Koichiro Kinoshita , Hironori Oikawa , Shigeo Ohashi , Koichi Takahashi , Takeshi Hizono , Masato Nakanishi
发明人： Koichiro Kinoshita , Hironori Oikawa , Shigeo Ohashi , Koichi Takahashi , Takeshi Hizono , Masato Nakanishi
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat receiving jacket in a liquid cooling device for electronic equipment, for transferring a heat from a heating portion in the electronic equipment to liquid refrigerant, is composed of a fin piece having a base portion formed thereon with thin fins which rise up from one surface of the base portion, being curved, and a casing accommodating therein the fin piece in its center part so as to cause the liquid refrigerant to flow between the thin fins. Further, the cooling device includes a plurality of heat receiving jackets and a plurality of heat radiating portions which are alternately connected so as to constitute a passage for the liquid refrigerant, a part of the passage being connected with a circulation pump so as to constitute a closed circulation passage for the liquid refrigerant. With this configuration, it is possible to provide a liquid cooling device capable of decreasing the temperature rise of a heating element such as a CPU, having a high performance and being excellent in costs.
摘要翻译：一种用于电子设备的液体冷却装置中的热接收套管，用于将热量从电子设备中的加热部分传送到液体制冷剂，由具有形成有基部的翅片组成，薄片从一个表面起升的基部弯曲，以及在其中心部分容纳翅片的壳体，以使液体制冷剂在薄翅片之间流动。此外，冷却装置包括多个热接收夹套和多个热辐射部分，其交替地连接成构成用于液体制冷剂的通道，所述通道的一部分与循环泵连接以构成一个用于液体制冷剂的封闭循环通道。根据该结构，能够提供能够降低CPU等加热元件的温度上升的液体冷却装置，其性能高，成本优异。

23. 发明授权

US07050299B2 Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：US07050299B2
公开(公告)日：2006-05-23
申请号：US10962472
申请日：2004-10-13
申请人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
发明人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , G06F1/20 , G06F2200/201
摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.
摘要翻译：一种可拆卸地安装在电子设备上的电子模块。电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。

24. 发明授权

US06972954B2 Liquid cooling system and personal computer using the same 失效
标题翻译：液体冷却系统和个人电脑使用相同
公开(公告)号：US06972954B2
公开(公告)日：2005-12-06
申请号：US11079264
申请日：2005-03-15
申请人： Rintaro Minamitani , Makoto Kitano , Noriyuki Ashiwake , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Yuji Yoshitomi , Tsuyoshi Nakagawa
发明人： Rintaro Minamitani , Makoto Kitano , Noriyuki Ashiwake , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Yuji Yoshitomi , Tsuyoshi Nakagawa
IPC分类号： F28D15/02 , F01P11/06 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , F01P2011/066 , F28D15/0266 , G06F2200/201 , Y10S165/905
摘要： A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.
摘要翻译：可用于个人计算机的液体冷却系统包括用于供应冷却液的泵; 提供有冷却液并被定位成接收从发热体产生的热量的热接收套管，用于散发由通过热接收套的冷却液供给的热量的散热管，以及用于使冷却液循环的通道通过热辐射管进入泵。散热管由具有高于受热护套的耐腐蚀性的材料制成。

25. 发明申请

US20050178526A1 Liquid cooling system, and electronic apparatus having the same therein 审中-公开
标题翻译：液体冷却系统及其中具有相同的电子设备
公开(公告)号：US20050178526A1
公开(公告)日：2005-08-18
申请号：US10792719
申请日：2004-03-05
申请人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Atsuo Nishihara
发明人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Atsuo Nishihara
IPC分类号： H05K7/20 , F04D9/00 , F04D13/06 , F28F7/00 , G06F1/20 , H01L23/473
CPC分类号： H05K7/20009 , F04D9/007 , F04D13/0673 , G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In a cooling system of liquid type, dissolving a problem upon starting when applying a centrifugal pump therein, and being freely applicable into various kinds of electronic apparatuses, easily, for cooling a CPU in need of cooling thereof, which is mounted within a housing 100, the system comprises: a cooling jacket 50, a radiator 60 and a circulation pump, wherein the circulation pump is built up with a centrifugal pump, in which a rotor 730 having a plural number of blades formed in a centrifugal manner, a pump chamber 741 receiving the rotor in an inside thereof, and a field coil 712 of an electric motor for driving the rotor rotationally are formed into one body, and the pump chamber is disposed to located below the electric motor, thereby achieving the structure so that a liquid coolant fills up the pump chamber when stopping, in spite of the disposition of the circulation pump, thereby dissolving the problem of idling when starting.
摘要翻译：在液体冷却系统中，当在其中施加离心泵时解决了起动问题，并且可以容易地适用于各种电子设备，用于冷却安装在壳体100内的需要冷却的CPU 该系统包括：冷却套50，散热器60和循环泵，其中循环泵由离心泵构成，其中具有以离心方式形成的多个叶片的转子730，泵室 741，其内部接收转子，并且用于驱动转子的电动机的励磁线圈712旋转地形成为一体，并且泵室设置在电动机的下方，从而实现了液体尽管循环泵的布置，冷却剂在停止时填充泵室，从而解决了起动时的空转问题。

26. 发明申请

US20050007730A1 Electronic apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20050007730A1
公开(公告)日：2005-01-13
申请号：US10239156
申请日：2002-07-10
申请人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa
发明人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： In the structure of an electronic apparatus, in which cooling of an heat-generating element is achieved through circulation of a liquid, in particular, for providing the structure of being high in cooling performance and reliability, wherein a heat-radiation pipe 9 is connected to a heat-radiation plate 10 disposed in a rear surface of a display 2, while thermally connecting a water-cooling jacket 8 with the heat-generating element 7, thereby circulating a coolant liquid between the water-cooling jacket 8 and the heat-radiation pipe 9 by means of a liquid driving device 11. The water-cooling jacket 8 can be formed in one body of a jacket base and a flow passage therein through the die-cast forming thereof, or can be constructed in one body with the water-cooling jacket and the flow passage of piping, through connection between the jacket base and the metal pipe.
摘要翻译：在通过液体循环实现发热元件的冷却的电子设备的结构中，特别是为了提供冷却性能和可靠性高的结构，其中连接有散热管9 到设置在显示器2的后表面中的散热板10，同时将水冷套8与发热元件7热连接，从而使冷却液在水冷套8和热水套8之间循环。辐射管9通过液体驱动装置11形成。水冷套8可以通过其压铸成型形成在套管基体的一个主体和流动通道中，或者可以在一个主体中与水冷套管和管道的通道，通过护套底座和金属管之间的连接。

27. 发明授权

US06809927B2 Liquid circulation cooling system for electronic apparatus 失效
标题翻译：电子仪器液体循环冷却系统
公开(公告)号：US06809927B2
公开(公告)日：2004-10-26
申请号：US10239141
申请日：2003-05-09
申请人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou , Tsuyoshi Nakagawa
发明人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou , Tsuyoshi Nakagawa
IPC分类号： H05K720
CPC分类号： G06F1/203 , F28F1/22 , G06F2200/201 , G06F2200/203
摘要： In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.
摘要翻译：在通过液体循环进行发热元件的冷却的电子设备的结构中，特别是用于提供可靠性高的液冷结构，同时考虑到安全性和组装性能考虑到其中水冷套8与发热元件7热连接，同时将热辐射管9与设置在显示器2的后表面上的散热板10热连接，其中冷却剂液体通过液体驱动装置11在水冷套管8和散热管9之间循环。散热管9连接到散热板的整个区域上，就像在其上爬行一样。在散热板10的上部设有槽14，与散热管9连接。

28. 发明授权

US06808014B2 Cooling device of electronic apparatus 有权
公开(公告)号：US06808014B2
公开(公告)日：2004-10-26
申请号：US10426719
申请日：2003-05-01
申请人： Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Yuji Yoshitomi , Takashi Naganawa , Masato Nakanishi , Tsuyoshi Nakagawa
发明人： Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Yuji Yoshitomi , Takashi Naganawa , Masato Nakanishi , Tsuyoshi Nakagawa
IPC分类号： F28F700
CPC分类号： G06F1/203 , F28D15/0266 , G06F2200/201
摘要： A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.

29. 发明授权

US06741464B2 Liquid cooling system and personal computer using thereof 失效
标题翻译：液体冷却系统及其使用的个人计算机
公开(公告)号：US06741464B2
公开(公告)日：2004-05-25
申请号：US09921925
申请日：2001-08-06
申请人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
发明人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
IPC分类号： G06F120
CPC分类号： G06F1/203 , G06F2200/201 , G06F2200/203
摘要： A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, of the type used in an electronic apparatus that is small and thin in size, or in a personal computer equipped with such a structure therein. The system has a pump of the reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another so as to form a closed loop filled with a cooling liquid. In the system, &Dgr;Vs is equal to or greater than &Dgr;Vp, wherein the inner volume change when the pump emits pulsation therefrom is &Dgr;Vp, the pressure caused by the volume change is P, and the volume change due to the pressure P that occurs in flow passage of the cooling liquid &Dgr;Vp other than within the pump, is &Dgr;Vs.
摘要翻译：一种液体冷却系统，用于冷却尺寸小的电子设备中使用的类型的诸如半导体元件等的高发热体或在其中配备有这种结构的个人计算机中的类型。该系统具有往复运动型泵，热接收套管，散热管和用于将这些部件彼此连接的连接管，以便形成填充有冷却液体的闭合回路。在该系统中，DeltaV等于或大于DeltaVp，其中当泵从其发出脉动时的内部体积变化为DeltaVp，由体积变化引起的压力为P，并且由于在流动中发生的压力P导致的体积变化冷却液通道DeltaVp除泵内外，均为DeltaVs。

30. 发明授权

US5805417A Heat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit board 失效
标题翻译：一种便携式计算机中的散热结构，包括从散热板通过第一电路板延伸到第二电路板上的CPU的散热块
公开(公告)号：US5805417A
公开(公告)日：1998-09-08
申请号：US728171
申请日：1996-10-09
申请人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
发明人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
IPC分类号： G06F1/20 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/36 , H05K7/20
CPC分类号： G06F1/203 , H05K1/141 , H05K1/0203 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/09054 , H05K2201/09072 , H05K3/368
摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.
摘要翻译：个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和女儿板。子板安装有产生热量的中央处理单元。主板上有一个孔。散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。热管可以连接到散热板。

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