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21. 发明授权

US07268014B2 Fabrication method of light emitting diode package 有权
标题翻译：发光二极管封装的制造方法
公开(公告)号：US07268014B2
公开(公告)日：2007-09-11
申请号：US11314003
申请日：2005-12-22
申请人： Young Ki Lee , Seog Moon Choi , Yong Sik Kim , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Yong Sik Kim , Sang Hyun Shin
IPC分类号： H01L21/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/16245 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2933/0075 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.
摘要翻译：本发明提供一种用于容易地制造具有优异散热特性的LED封装的LED封装的制造方法。在该方法中，制备具有形成在凹部中的凹部和反射表面的金属封装基板，并且将封装基板选择性地阳极氧化并分成彼此分开的两个封装电极部分。然后，将发光装置安装在凹部的底部。优选地，封装衬底是由Al或Al基金属制成的金属衬底。

22. 发明授权

US08058781B2 Anodized metal substrate module 有权
标题翻译：阳极氧化金属基板模块
公开(公告)号：US08058781B2
公开(公告)日：2011-11-15
申请号：US11723059
申请日：2007-03-16
申请人： Young Ki Lee , Seog Moon Choi , Young Bok Yoon , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Young Bok Yoon , Sang Hyun Shin
IPC分类号： H01K1/02 , F21V7/04
CPC分类号： H05K1/053 , F21K9/00 , F21V29/76 , F21V29/89 , H01L2924/0002 , H05K1/021 , H05K1/182 , H05K2201/0347 , H05K2201/10106 , H05K2203/0315 , H01L2924/00
摘要： An anodized metal substrate module superior in heat radiation properties and reduced in manufacturing costs. A metal plate is provided. An anodized film is formed on the metal plate. A heat generating device is mounted on the metal plate. Also, a conductive line is formed on the anodized film.
摘要翻译：阳极氧化金属基板模块，其散热性能优异，制造成本降低。提供金属板。阳极氧化膜形成在金属板上。发热装置安装在金属板上。此外，在阳极氧化膜上形成导线。

23. 发明申请

US20110065219A1 LIGHT EMITTING DIODE PACKAGE, CIRCUIT BOARD FOR LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：发光二极管封装，发光二极管封装的电路板及其制造方法
公开(公告)号：US20110065219A1
公开(公告)日：2011-03-17
申请号：US12952760
申请日：2010-11-23
申请人： Sang Hyun SHIN , Seog Moon Choi , Young Ki Lee
发明人： Sang Hyun SHIN , Seog Moon Choi , Young Ki Lee
IPC分类号： H01L33/52 , H05K3/10
CPC分类号： H01L33/486 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01322 , H05K1/053 , H05K3/0052 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.
摘要翻译：一种用于散热效率提高的发光二极管封装的电路板及其制造方法。在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。在发光二极管封装中，板体由导热金属制成。绝缘氧化层形成在板体的一对相对的边缘处。分别在绝缘氧化层上形成第一导电图案。此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。此外，绝缘层通过阳极氧化与板体一体形成，从而提高生产率和耐久性。

24. 发明申请

US20070215894A1 Insulation structure for high temperature conditions and manufacturing method thereof 有权
标题翻译：高温条件的绝缘结构及其制造方法
公开(公告)号：US20070215894A1
公开(公告)日：2007-09-20
申请号：US11723236
申请日：2007-03-19
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H05K3/28 , H05K2203/0315 , H05K2203/0542
摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
摘要翻译：一种用于高温条件的绝缘结构及其制造方法。在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

25. 发明授权

US09231167B2 Insulation structure for high temperature conditions and manufacturing method thereof 有权
标题翻译：高温条件的绝缘结构及其制造方法
公开(公告)号：US09231167B2
公开(公告)日：2016-01-05
申请号：US14555186
申请日：2014-11-26
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L29/207 , H01L33/48 , H05K3/28 , H01L33/62 , H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H05K3/28 , H05K2203/0315 , H05K2203/0542
摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
摘要翻译：一种用于高温条件的绝缘结构及其制造方法。在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

26. 发明授权

US08603842B2 Method of manufacturing package substrate for optical element 有权
标题翻译：制造光学元件封装基板的方法
公开(公告)号：US08603842B2
公开(公告)日：2013-12-10
申请号：US13418241
申请日：2012-03-12
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/62
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。还提供了一种制造用于光学元件的封装衬底的方法。

27. 发明授权

US08304279B2 Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
标题翻译：具有阳极氧化绝缘层的发光二极管封装及其制造方法
公开(公告)号：US08304279B2
公开(公告)日：2012-11-06
申请号：US13220258
申请日：2011-08-29
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L21/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
摘要翻译：一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

28. 发明授权

US08299692B2 Light emitting device package and method of manufacturing the same 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US08299692B2
公开(公告)日：2012-10-30
申请号：US12213241
申请日：2008-06-17
申请人： Young Ki Lee , Seog Moon Choi , Hyung Jin Jeon , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Hyung Jin Jeon , Sang Hyun Shin
IPC分类号： H01J1/62 , H01J9/02 , H01L31/00
CPC分类号： H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48227
摘要： The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.
摘要翻译：本发明涉及一种发光器件封装及其制造方法。提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。

29. 发明申请

US20110260198A1 INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：高温条件绝缘结构及其制造方法
公开(公告)号：US20110260198A1
公开(公告)日：2011-10-27
申请号：US13177276
申请日：2011-07-06
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H05K3/28 , H05K2203/0315 , H05K2203/0542
摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device.A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
摘要翻译：一种用于高温条件的绝缘结构及其制造方法。在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

30. 发明申请

US20110140144A1 PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于光学元件的封装基板及其制造方法
公开(公告)号：US20110140144A1
公开(公告)日：2011-06-16
申请号：US12721539
申请日：2010-03-10
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/00 , H01L31/00
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。还提供了一种制造用于光学元件的封装衬底的方法。

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