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21. 发明专利

DE69431032D1 未知
公开(公告)号：DE69431032D1
公开(公告)日：2002-08-29
申请号：DE69431032
申请日：1994-05-31
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： UCHINO KATSUYA , NOMURA TOSHIO , OHARA HISANORI , CHUDO MASUO , KOBAYASHI MITSUNORI
IPC分类号： C23C16/32 , C23C16/34 , C23C16/36 , C23C30/00 , C23C16/30 , B23B27/14 , B23P15/28
摘要： A coated cutting tool suitable for high speed cutting process and a method for producing the same, the tool comprising a base material formed of tungsten-carbide-based cemented carbide and a coating layer on the base material comprising in turn an internal layer and an external layer, wherein the internal layer consists of a single layer of titanium carbonitride in contact with the base material, a double layer consisting of a 0.1 to 2 mu m thick titanium nitride layer in contact with the base material and a titanium carbonitride layer directly thereon, and a multi-layer prepared by applying another coating of titanium carbide to the titanium carbonitride layer, the tool being characterized in that the chlorine content of the internal layer is 0.05 atomic % or less on average, the peak strength ratio of a specific plane falls within a specific range when the titanium carbonitride is X-ray diffracted, or the internal layer constituting the coating layer consists of a first layer of titanium nitride that contacts the base material and a second layer, placed on the first one, has a hardness ranging from 1600 to 2400 kg/mm . The realized coating has high wear-resistance, and the coating film and the base material are strongly bonded to each other, thereby providing superior peeling resistance during cutting.

22. 发明专利

AT221142T 未知
公开(公告)号：AT221142T
公开(公告)日：2002-08-15
申请号：AT94916435
申请日：1994-05-31
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： UCHINO KATSUYA , NOMURA TOSHIO , OHARA HISANORI , CHUDO MASUO , KOBAYASHI MITSUNORI
IPC分类号： C23C16/32 , C23C16/34 , C23C16/36 , C23C30/00 , C23C16/30 , B23B27/14 , B23P15/28
摘要： A coated cutting tool suitable for high speed cutting process and a method for producing the same, the tool comprising a base material formed of tungsten-carbide-based cemented carbide and a coating layer on the base material comprising in turn an internal layer and an external layer, wherein the internal layer consists of a single layer of titanium carbonitride in contact with the base material, a double layer consisting of a 0.1 to 2 mu m thick titanium nitride layer in contact with the base material and a titanium carbonitride layer directly thereon, and a multi-layer prepared by applying another coating of titanium carbide to the titanium carbonitride layer, the tool being characterized in that the chlorine content of the internal layer is 0.05 atomic % or less on average, the peak strength ratio of a specific plane falls within a specific range when the titanium carbonitride is X-ray diffracted, or the internal layer constituting the coating layer consists of a first layer of titanium nitride that contacts the base material and a second layer, placed on the first one, has a hardness ranging from 1600 to 2400 kg/mm . The realized coating has high wear-resistance, and the coating film and the base material are strongly bonded to each other, thereby providing superior peeling resistance during cutting.

23. 发明专利

AT218245T 未知
公开(公告)号：AT218245T
公开(公告)日：2002-06-15
申请号：AT96110773
申请日：1996-07-02
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： KOBAYASHI MITSUNORI , FUKUI AKIRA , TAKASHIMA KOUICHI
IPC分类号： C22C27/04 , H01L21/48 , H01L23/14 , H01L23/373 , H01L23/492 , H01L23/06
摘要： A plate type member of a Cu-W and/or Mo alloy for a semiconductor device package which can be bonded to a ceramic member or the like with no trouble due to suppression of a warp in a heating step, and a package for a semiconductor device employing this plate type member are provided. In the plate type member (8) for a semiconductor device package consisting of a Cu-W and/or Mo alloy, the difference between alkaline earth metal contents in upper and lower halves along the thickness direction is not more than 10 ppm, or an alkaline earth metal content is not more than 5 ppm per W and/or Mo. This plate type member is manufactured by reducing the alkaline earth metal content in W and/or Mo raw material powder, or standing a skeleton (1) on a refractory plate (3) in Cu infiltration, for performing homogeneous heating and cooling in manufacturing thereby preventing maldistribution of the alkaline earth metal.

24. 发明专利

ES2084850T3 未知
公开(公告)号：ES2084850T3
公开(公告)日：1996-05-16
申请号：ES92101647
申请日：1992-01-31
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： MORIGUCHI HIDEKI , KOBAYASHI MITSUNORI , NOMURA TOSHIO , NAKAMATA TOSIAKI
IPC分类号： B23B27/14 , C04B41/52 , C04B41/53 , C04B41/89 , C04B41/91

25. 发明专利

DE69207613D1 未知
公开(公告)号：DE69207613D1
公开(公告)日：1996-02-29
申请号：DE69207613
申请日：1992-01-31
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： MORIGUCHI HIDEKI , KOBAYASHI MITSUNORI , NOMURA TOSHIO , NAKAMATA TOSIAKI
IPC分类号： B23B27/14 , C04B41/52 , C04B41/53 , C04B41/89 , C04B41/91

26. 发明专利

DE3117299C3 未知
公开(公告)号：DE3117299C3
公开(公告)日：1994-10-20
申请号：DE3117299
申请日：1981-04-30
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： KOBAYASHI MITSUNORI , DOI YOSHIHIKO
IPC分类号： B23B27/14 , B23P15/28 , C23C14/06 , C23C14/32 , C23C30/00 , C30B28/12 , C30B29/36 , C30B29/38 , B23C5/20 , B23G1/00

27. 发明专利

MX9301741A 未知
公开(公告)号：MX9301741A
公开(公告)日：1993-10-01
申请号：MX9301741
申请日：1992-07-17
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： OMORI NAOYA , KOBAYASHI MITSUNORI , NOMURA TOSHIO
IPC分类号： C09K3/14

28. 发明专利

ZA8403959B A CUTTING TOOL AND THE PRODUCTION THEREOF 未知
公开(公告)号：ZA8403959B
公开(公告)日：1986-01-29
申请号：ZA8403959
申请日：1984-05-24
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： FUJII HIROSHI , HARA AKIO , MORI YOSHITATSU , KOBAYASHI MITSUNORI
IPC分类号： B23B27/14 , B23P15/28 , B23P15/30 , C23C30/00 , B23B , B23C , B23G , B23P , B23Q
CPC分类号： B23P15/30 , B23B27/145 , B23B2200/242 , B23B2200/245 , B23B2222/28 , B23B2224/20 , B23B2224/28 , B23B2224/36 , B23P15/28 , C23C30/005 , Y10T407/27

29. 发明专利

AU2855984A COATED HARD METAL TOOL 未知
公开(公告)号：AU2855984A
公开(公告)日：1984-11-29
申请号：AU2855984
申请日：1984-05-24
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： FUJII HIROSHI , HARA AKIO , KOBAYASHI MITSUNORI , MORI YOSHIKATSU
IPC分类号： B23B27/14 , B23P15/28 , B23P15/30 , C23C30/00 , B23B27/16 , B23B51/00 , B23C5/00

30. 发明专利

DE69736144D1 未知
公开(公告)号：DE69736144D1
公开(公告)日：2006-08-03
申请号：DE69736144
申请日：1997-02-05
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： SASAKI KAZUTAKA , NAKATA HIROHIKO , SASAME AKIRA , KOBAYASHI MITSUNORI
IPC分类号： H01L23/15 , H05K1/09 , C04B37/02 , C04B41/52 , H01L23/498 , H05K3/38
摘要： A highly reliable member for a semiconductor device, in which a high melting point metallizing layer, which consists mainly of a high melting point metal such as W and/or Mo, and an intervening metal layer, which has a melting point of not greater than 1,000 DEG C and consists mainly of at least one selected from among Ni, Cu and Fe, are provided on an AlN substrate material in this order on the AlN substrate material, and a conductor layer consisting mainly of copper is directly bonded to the intervening metal layer without intervention of a solder material layer. A semiconductor element or the like is mounted on the member for a semiconductor device, thereby fabricating a semiconductor device. The high melting point metallizing layer is formed on an aluminum nitride substrate by post-fire or co-fire matallization.

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