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21. 发明授权

US4108720A Control system for boiling-water reactor 失效
标题翻译：沸水反应堆控制系统
公开(公告)号：US4108720A
公开(公告)日：1978-08-22
申请号：US595330
申请日：1975-07-11
申请人： Takao Sato , Sakae Sugiyama
发明人： Takao Sato , Sakae Sugiyama
IPC分类号： G21C7/26 , G21C7/36 , G21D3/00 , G21D3/10 , G21D3/14 , G21C7/00
CPC分类号： G21D3/10 , G21C7/36 , Y02E30/31 , Y02E30/39
摘要： A plurality of local power range monitors are provided in the core of a nuclear reactor and the total output of the reactor is obtained from the outputs of the monitors. The output of the reactor, if it reached its equilibrium state, will normally keep a constant value, but after the load is changed, the output is also varied by the influence of the neutron absorbing property of the fission products generated as a result of the load change, and especially after the reactor output has been increased, it is spontaneously increased over its setting value to cause the reactor to overheat. The minimum allowable recirculating flow which prevents the overheat at a given total output, is obtained on the basis of the total output. If the actual recirculating flow is larger than the minimum allowable flow, the recirculating flow is freely controlled, but if the actual flow is smaller than the minimum value, the control of the recirculating flow is prohibited and the control rods are inserted for the control of the reactor output. The insertion begins with one of the control rods near the local power range monitor whose output is the maximum.
摘要翻译：在核反应堆的核心中提供多个局部功率范围监视器，并且从监视器的输出获得反应堆的总输出。如果反应堆的平衡状态达到平衡状态，反应堆的输出通常会保持恒定值，但是在负载变化之后，输出也会随着作为结果产生的裂变产物的中子吸收特性的影响而变化尤其是在反应器输出增加之后，自然增加超过其设定值使反应堆过热。基于总输出获得防止给定总输出过热的最小允许再循环流量。如果实际的再循环流量大于最小允许流量，则可以自由地控制循环流量，但如果实际流量小于最小值，则禁止再循环流量的控制，并且控制杆被插入以控制反应堆输出。插入开始于输出为最大值的本地功率范围监视器附近的控制杆之一。

22. 发明授权

US09329408B2 Wettable hydrogel contact lens and method for producing same 有权
标题翻译：可湿性水凝胶隐形眼镜及其制造方法
公开(公告)号：US09329408B2
公开(公告)日：2016-05-03
申请号：US13322864
申请日：2009-09-01
申请人： Toru Matsunaga , Yoko Fujishiro , Takao Sato
发明人： Toru Matsunaga , Yoko Fujishiro , Takao Sato
IPC分类号： G02C7/04 , C08L5/04 , G02B1/04
CPC分类号： G02C7/049 , C08L5/04 , G02B1/043 , C08L101/14
摘要： Disclosed is a hydrogel contact lens which has improved and long-lasting wettability in the surface and inner structures, while exhibiting excellent contamination resistance, shape stability and mechanical strength. Also disclosed is a method for producing the hydrogel contact lens. The wettable hydrogel contact lens is characterized by containing an ionic hydrophilic polymer which is a compound having a hydroxy group and an anionic group. The method for producing a hydrogel contact lens is characterized in that a constituent component of the hydrogel contact lens is a copolymer containing at least a cationic monomer and an anionic monomer, and in that the method comprises a step wherein counter ions of the monomers form ionic bonds and a step wherein an ionic hydrophilic polymer, which is a compound having a hydroxy group and an anionic group, is contained.
摘要翻译：公开了一种水凝胶隐形眼镜，其在表面和内部结构中具有改善的和持久的润湿性，同时具有优异的耐污染性，形状稳定性和机械强度。还公开了一种水凝胶隐形眼镜的制造方法。可湿性水凝胶隐形眼镜的特征在于含有作为具有羟基和阴离子基团的化合物的离子型亲水性聚合物。水凝胶隐形眼镜的制造方法的特征在于，水凝胶隐形眼镜的构成成分是至少含有阳离子单体和阴离子单体的共聚物，该方法包括以下步骤：单体的抗衡离子形成离子性键和其中包含作为具有羟基和阴离子基团的化合物的离子亲水性聚合物的步骤。

23. 发明授权

US08941246B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08941246B2
公开(公告)日：2015-01-27
申请号：US13623249
申请日：2012-09-20
申请人： Masayuki Miura , Taku Kamoto , Takao Sato
发明人： Masayuki Miura , Taku Kamoto , Takao Sato
IPC分类号： H01L29/40 , H01L23/00 , H01L27/115 , H01L25/065 , H01L21/56
CPC分类号： H01L24/94 , H01L21/568 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L27/115 , H01L2224/05554 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/00012 , H01L2224/81 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a chip stacked body disposed on an interposer substrate and an interface chip mounted on the chip stacked body. The chip stacked body has plural semiconductor chips, and is electrically connected via through electrodes provided in the semiconductor chips excluding a lowermost semiconductor chip in a stacking order of the plural semiconductor chips and bump electrodes. The interface chip is electrically connected to the interposer substrate via a rewiring layer formed on a surface of an uppermost semiconductor chip in the stacking order or through electrodes provided in the interface chip.
摘要翻译：在一个实施例中，半导体器件包括设置在插入器基板上的芯片堆叠体和安装在芯片堆叠体上的接口芯片。芯片堆叠体具有多个半导体芯片，并且以多个半导体芯片和凸块电极的堆叠顺序通过设置在半导体芯片中的除了最下半导体芯片之外的半导体芯片中的电极电连接。接口芯片通过层叠顺序中形成在最上半导体芯片的表面上的再布线层，或通过设置在接口芯片中的电极，电连接到插入器基板。

24. 发明授权

US08549349B2 Storage controller and storage control method 失效
标题翻译：存储控制器和存储控制方法
公开(公告)号：US08549349B2
公开(公告)日：2013-10-01
申请号：US13023150
申请日：2011-02-08
申请人： Atsushi Yuhara , Masao Nakano , Takao Sato , Kazunobu Ohashi , Takahiko Takeda
发明人： Atsushi Yuhara , Masao Nakano , Takao Sato , Kazunobu Ohashi , Takahiko Takeda
IPC分类号： G06F11/00
CPC分类号： G06F11/2092 , G06F11/0724 , G06F11/0727 , G06F11/0757
摘要： This storage controller includes a port unit and multiple processing units for inputting and outputting data to and from a storage apparatus. The port unit sorts the data I/O requests given from a host system to the corresponding processing units according to a table pre-defining the storage apparatus or a storage area in the storage apparatus to perform data I/O processing allocated to each of the processing units. The processing unit inputs data in the corresponding storage apparatus or the corresponding storage area according to the data I/O request sorted to itself from the port unit and, upon detecting a blockage of the other processing unit due to a failure, updates the table retained in each of the port units so as to sort the storage apparatuses or the storage areas allocated to the other processing unit to the remaining unblocked processing units.
摘要翻译：该存储控制器包括端口单元和用于向存储装置输入和输出数据的多个处理单元。端口单元根据预先定义存储装置的表或存储装置中的存储区域将从主机系统给出的数据I / O请求分类到相应的处理单元，以执行分配给每个处理单元的数据I / O处理处理单位。处理单元根据从端口单元自身分配的数据I / O请求在对应的存储装置或对应的存储区域中输入数据，并且在检测到由于故障导致的其他处理单元的阻塞时更新保留的表在每个端口单元中，将分配给其他处理单元的存储装置或存储区域分配给剩余的未阻塞处理单元。

25. 发明申请

US20130075895A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130075895A1
公开(公告)日：2013-03-28
申请号：US13623249
申请日：2012-09-20
申请人： Masayuki Miura , Taku Kamoto , Takao Sato
发明人： Masayuki Miura , Taku Kamoto , Takao Sato
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/94 , H01L21/568 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L27/115 , H01L2224/05554 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/00012 , H01L2224/81 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a chip stacked body disposed on an interposer substrate and an interface chip mounted on the chip stacked body. The chip stacked body has plural semiconductor chips, and is electrically connected via through electrodes provided in the semiconductor chips excluding a lowermost semiconductor chip in a stacking order of the plural semiconductor chips and bump electrodes. The interface chip is electrically connected to the interposer substrate via a rewiring layer formed on a surface of an uppermost semiconductor chip in the stacking order or through electrodes provided in the interface chip.
摘要翻译：在一个实施例中，半导体器件包括设置在插入器基板上的芯片堆叠体和安装在芯片堆叠体上的接口芯片。芯片堆叠体具有多个半导体芯片，并且以多个半导体芯片和凸块电极的堆叠顺序通过设置在半导体芯片中的除了最下半导体芯片之外的半导体芯片中的电极电连接。接口芯片通过层叠顺序中形成在最上半导体芯片的表面上的再布线层，或通过设置在接口芯片中的电极，电连接到插入器基板。

26. 发明申请

US20130015570A1 STACKED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：堆叠半导体封装及其制造方法
公开(公告)号：US20130015570A1
公开(公告)日：2013-01-17
申请号：US13411061
申请日：2012-03-02
申请人： Takao Sato
发明人： Takao Sato
IPC分类号： H01L23/538 , H01L21/50 , H01L23/498
CPC分类号： H01L23/3135 , H01L23/3128 , H01L23/49816 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： In an embodiment, a stacked semiconductor package includes a wiring board having external connection terminals and internal connection terminals, and first and second modules stacked on the wiring board. Each of the first and second modules includes a plurality of semiconductor chips mounted on an interposer and a sealing resin layer. The interposers and the internal connection terminals of the wiring board are electrically connected by connecting members such as metal wires, printed wiring layers or metal bumps. The first and second modules are collectively sealed by a sealing resin layer formed on the wiring board.
摘要翻译：在一个实施例中，堆叠半导体封装包括具有外部连接端子和内部连接端子的布线板，以及堆叠在布线板上的第一和第二模块。第一和第二模块中的每一个包括安装在插入件上的多个半导体芯片和密封树脂层。布线板的插入件和内部连接端子通过金属线，印刷布线层或金属凸块等连接构件电连接。第一和第二模块由形成在布线板上的密封树脂层共同密封。

27. 发明申请

US20120268358A1 LIQUID CRYSTAL DISPLAY DEVICE 有权
标题翻译：液晶显示装置
公开(公告)号：US20120268358A1
公开(公告)日：2012-10-25
申请号：US13535643
申请日：2012-06-28
申请人： Yuji MAEDE , Takao Sato
发明人： Yuji MAEDE , Takao Sato
IPC分类号： G09G3/36
CPC分类号： G02F1/134363 , G02F1/136286 , G02F2201/123
摘要： A liquid crystal display device is provided which can enhance a numerical aperture. The display has a pixel transparent conductive film electrode and a transparent conductive film counter electrode formed on an insulation film, which in turn is formed on a first substrate to cover the pixel electrode. A plurality of linear portions of the counter electrode are arranged on the pixel electrode. A gate-signal-line side of the pixel electrode of the first pixel is formed on a first-pixel side of the gate signal line and a gate-signal-line side of the pixel electrode of the second pixel is formed on a second-pixel side of the gate signal line. The gate-signal-line-side frame portion of the counter electrode of the first pixel and the gate-signal-line-side frame portion of the counter electrode of the second pixel are formed in common on the gate signal line in a striding manner.
摘要翻译：提供一种能够增强数值孔径的液晶显示装置。显示器具有形成在绝缘膜上的像素透明导电膜电极和透明导电膜对电极，该绝缘膜又形成在第一基板上以覆盖像素电极。对电极的多个直线部分布置在像素电极上。第一像素的像素电极的栅极信号线侧形成在栅极信号线的第一像素侧，第二像素的像素电极的栅极信号线侧形成在第二像素电极上，像素侧的栅极信号线。第一像素的对置电极的栅极信号线侧框架部分和第二像素的对电极的栅极信号线侧框架部分以栅栏方式在栅极信号线上共同形成。

28. 发明授权

US08234471B2 Remote copy method and remote copy system 有权
标题翻译：远程复制方式和远程复制系统
公开(公告)号：US08234471B2
公开(公告)日：2012-07-31
申请号：US12570461
申请日：2009-09-30
申请人： Ryusuke Ito , Yusuke Hirakawa , Yoshihiro Asaka , Takashi Kaga , Hiroshi Arakawa , Takahiko Takeda , Takao Sato
发明人： Ryusuke Ito , Yusuke Hirakawa , Yoshihiro Asaka , Takashi Kaga , Hiroshi Arakawa , Takahiko Takeda , Takao Sato
IPC分类号： G06F12/00
CPC分类号： G06F11/2074 , G06F11/2066 , G06F2201/855 , Y10S707/99953 , Y10S707/99955
摘要： A remote copy system includes: a first storage system having a first logical volume accompanied with a first plurality of disk drives in the first storage system; a second storage system having a second logical volume, which is a virtual volume not accompanied with a second plurality of disk drives in the second storage system, the virtual volume configuring a first remote copy pair with the first logical volume; and a third storage system having a third logical volume accompanied with a third plurality of disk drives in the third storage system, the third logical volume configuring a second remote copy pair with the virtual volume and storing a copied data of data stored in the first logical volume. If the second storage system receives write data sent from the first storage system to the virtual volume, the second storage system transfers the write data to the third logical volume in the third storage system.
摘要翻译：远程复制系统包括：具有第一逻辑卷的第一存储系统，伴随着第一存储系统中的第一多个磁盘驱动器; 具有第二逻辑卷的第二存储系统，所述第二逻辑卷是不伴随所述第二存储系统中的第二多个磁盘驱动器的虚拟卷，所述虚拟卷与所述第一逻辑卷配置第一远程副本对; 以及具有第三逻辑卷的第三存储系统，所述第三逻辑卷伴随所述第三存储系统中的第三多个磁盘驱动器，所述第三逻辑卷与所述虚拟卷配置第二远程副本对并存储存储在所述第一逻辑中的数据的复制数据卷。如果第二存储系统接收从第一存储系统发送到虚拟卷的写入数据，则第二存储系统将写入数据传送到第三存储系统中的第三逻辑卷。

29. 发明申请

US20120052632A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20120052632A1
公开(公告)日：2012-03-01
申请号：US13215427
申请日：2011-08-23
申请人： Takao Sato , Masayuki Miura , Taku Kamoto
发明人： Takao Sato , Masayuki Miura , Taku Kamoto
IPC分类号： H01L21/50
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/81 , H01L24/85 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2221/68327 , H01L2221/68331 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2224/13111 , H01L2224/16225 , H01L2224/32225 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/81005 , H01L2224/81191 , H01L2224/814 , H01L2224/81801 , H01L2224/85 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a separation layer and a wiring layer are formed in order on a supporting substrate. A plurality of semiconductor chips are mounted on the wiring layer. The plural semiconductor chips are collectively sealed by a sealing resin layer. A resin-sealed body is evenly held by a holder. The resin-sealed body is separated from the supporting substrate by shearing the separation layer while being heated. The separated resin-sealed body is cooled while a state of the resin-sealed body being held evenly by the holder is maintained, and then a holding state of the resin-sealed body by the holder is released. The resin-sealed body is cut to singulate a circuit structure body.
摘要翻译：在一个实施例中，在支撑衬底上依次形成分离层和布线层。多个半导体芯片安装在布线层上。多个半导体芯片由密封树脂层共同密封。树脂密封体被保持器均匀地保持。树脂密封体通过在加热时剪切分离层与支撑基板分离。分离的树脂密封体被冷却，同时树脂密封体被保持器均匀地保持的状态，然后释放由树脂密封体保持的状态。树脂密封体被切割成单个电路结构体。

30. 发明授权

US08037245B2 Storage system 有权
标题翻译：存储系统
公开(公告)号：US08037245B2
公开(公告)日：2011-10-11
申请号：US12026858
申请日：2008-02-06
申请人： Manabu Kitamura , Junji Ogawa , Shunji Kawamura , Takao Sato , Naoto Matsunami , Shintaro Ito , Tomohiro Yoshihara , Takuji Ogawa
发明人： Manabu Kitamura , Junji Ogawa , Shunji Kawamura , Takao Sato , Naoto Matsunami , Shintaro Ito , Tomohiro Yoshihara , Takuji Ogawa
IPC分类号： G06F12/16 , H03M13/11
CPC分类号： G06F11/1076 , G06F2211/1014
摘要： One code (a compressed redundant code) is created based on a plurality of first redundant codes, each created on the basis of a plurality of data units, and this compressed redundant code is written to a nonvolatile storage area. This compressed redundant code is used to restore either a data element constituting a multiple-failure data, or a first redundant code corresponding to the multiple-failure data, which is stored in an unreadable sub-storage area of a partially failed storage device, and to restore the data element constituting the multiple-failure data which is stored in a sub-storage area of a completely failed storage device, based on the restored either data element or first redundant code, and either another data element constituting the multiple-failure data or the first redundant code corresponding to the multiple-failure data.
摘要翻译：基于多个基于多个数据单元创建的多个第一冗余代码来创建一个代码（压缩冗余代码），并将该压缩的冗余代码写入非易失性存储区域。该压缩冗余代码用于恢复存储在部分故障存储设备的不可读子存储区域中的构成多故障数据的数据元素或对应于多故障数据的第一冗余代码，以及基于恢复的数据元素或第一冗余代码，恢复存储在完全失败的存储设备的子存储区域中的构成多故障数据的数据元素，以及构成多故障数据的另一数据元素或对应于多故障数据的第一冗余码。

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