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21. 发明授权

EP2845456B1 ELEKTRISCHE DURCHKONTAKTIERUNG MIT MECHANISCHER DÄMPFUNG 有权
标题翻译：与机械阻尼的电接触
公开(公告)号：EP2845456B1
公开(公告)日：2017-11-15
申请号：EP13720315.4
申请日：2013-04-24
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , RATCHEV, Roumen , FIX, Andreas
IPC分类号： H05K3/32 , H05K3/34
CPC分类号： H05K3/308 , H05K3/321 , H05K3/3447 , H05K2201/10909

22. 发明授权

EP2670976B1 VERFAHREN UND VORRICHTUNG ZUR WANDLUNG VON ENERGIE DURCH ELEKTROAKTIVE POLYMER 有权
公开(公告)号：EP2670976B1
公开(公告)日：2017-04-19
申请号：EP11805438.6
申请日：2011-12-08
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , MICHALKE, Gabriele , HAGEMANN, Benjamin , GRAUER, Matthias , DENES, Istvan
IPC分类号： F03B17/06 , F03D5/00
CPC分类号： F03B17/06 , F03D5/00 , F05B2220/709 , F05B2260/407 , Y02E10/28 , Y02E10/70

23. 发明公开

EP2476300A1 ELEKTRONIKEINHEIT UND VERFAHREN ZUM HERSTELLEN DERSELBEN 失效
标题翻译：电子设备和方法生产同样
公开(公告)号：EP2476300A1
公开(公告)日：2012-07-18
申请号：EP10752750.9
申请日：2010-09-01
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , DONIS, Dieter , SCHMID, Stefan , BIRKHOLD, Andreas
IPC分类号： H05K5/06
CPC分类号： H05K5/064 , H05K7/20463
摘要： The invention relates to an electronic unit (10). The electronic unit (10) comprises a circuit board (1) populated with at least one electronic component (3) and a circuit board direct contact (9), wherein the circuit board (1) is disposed in a housing (2) filled with a heat-conducting medium (7). A closing stopper (8) made of an adhesive layer delimits a contact region (4) having the circuit board direct contact (9) from a circuit region (5) having the at least one electronic component (3).

24. 发明授权

EP2880717B1 Einpresspin 有权转让
公开(公告)号：EP2880717B1
公开(公告)日：2020-04-22
申请号：EP13744478.2
申请日：2013-07-24
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , GUENTER, Friedhelm , RATHGEBER, Sabrina , FISCHER, Marc
IPC分类号： H01R12/58 , H01R13/03

25. 发明公开

EP2880717A1 EINPRESSKONTAKTIERUNG 有权转让
公开(公告)号：EP2880717A1
公开(公告)日：2015-06-10
申请号：EP13744478.2
申请日：2013-07-24
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , GUENTER, Friedhelm , RATHGEBER, Sabrina , FISCHER, Marc
IPC分类号： H01R12/58 , H01R13/03
摘要： The invention relates to an electrical contact, particularly designed as a press-in pin (16) for a circuit carrier (10). The press-in pin comprises at least one press-in zone (14) at which conductor traces (30) can be contacted. The press-in pin (16) is either made of solid aluminium material (36) or contains at least one aluminium material section (40) or is made of solid aluminium material (36, 46) with a copper jacket coating (48).
摘要翻译：电触头技术领域本发明涉及一种电触头，尤其是设计为用于电路载体（10）的压入销（16）。压入销包括至少一个压入区（14），导体迹线（30）可以与压入区相接触。压入销（16）或者由固体铝材料（36）制成或者包含至少一个铝材料部分（40）或者由具有铜护套涂层（48）的固体铝材料（36,46）制成。

26. 发明公开

EP2801106A1 VERFAHREN ZUR HERSTELLUNG EINES VERBUNDKÖRPERS MIT GESINTERTER FÜGESCHICHT UND SINTERVORRICHTUNG ZUR HERSTELLUNG EINES DERARTIGEN VERBUNDKÖRPERS 审中-公开
标题翻译：用于生产复合体烧结法添加图层和烧结设备技术这样的复合体的制造
公开(公告)号：EP2801106A1
公开(公告)日：2014-11-12
申请号：EP12816024.9
申请日：2012-12-11
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael
IPC分类号： H01L21/60 , B30B5/02
CPC分类号： B30B5/02 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2224/29339 , H01L2224/32225 , H01L2224/7525 , H01L2224/75315 , H01L2224/75317 , H01L2224/755 , H01L2224/7598 , H01L2224/83005 , H01L2224/83209 , H01L2224/8384 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/04642 , H01L2924/00014 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/00
摘要： The invention relates to a method for producing a composite body (10), in particular a composite body (10) for constructing an electronic component, which, in a completed state, comprises at least two partial bodies (12, 14) that are firmly bonded to each other, wherein the firm bond is produced by at least one joining layer (18) that is arranged in a joining direction (16) between the partial bodies (12, 14) and formed from a sintered material, characterized by the following steps: a) creating an assembly of the at least two partial bodies (12, 14) and the at least one unsintered joining layer (18) arranged in the joining direction (16) between the at least two partial bodies (12, 14) into an assembled composite body (10); b) placing the assembled composite body (10) in a first partial chamber (36) of a sintering chamber (22) that can be sealed substantially gas-tight, has chamber walls (26), and has a substantially gas-impermeable chamber divider (32) that divides the sintering chamber (22) into the first partial chamber (36) and at least one second partial chamber (38) in the direct vicinity of the chamber divider (32), wherein the chamber divider (32) has at least one deformable partial element (34) having a position that is modifiable relative to the chamber walls (26); c) producing a positive chamber pressure difference between the second partial chamber (38) and the first partial chamber (36); and d) heating the arranged composite body (10) at least to a temperature predetermined as a sintering temperature. The invention further relates to a sintering device for producing such a composite body (10).

27. 发明公开

EP2165584A2 VERFAHREN UND VORRICHTUNG ZUM FESTLEGEN EINES EINE ELEKTRISCHE SCHALTUNG ODER DERGLEICHEN AUFWEISENDEN FLÄCHENSUBSTRATS IN EINER EINBAUPOSITION 有权
标题翻译：方法和设备，用于存储电气电路，具有表面基材在安装位置
公开(公告)号：EP2165584A2
公开(公告)日：2010-03-24
申请号：EP08750167.2
申请日：2008-05-07
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , GEISSLER, Alexander
IPC分类号： H05K7/14 , H05K5/00
CPC分类号： H05K7/1417 , C08L2201/12 , H05K5/0039
摘要： The invention relates to a method for immobilizing a planar substrate in a mounting position on an element to be mounted, said substrate comprising an electric circuit or the like and holding means acting upon the planar substrate so as to immobilize it. The method according to the invention is characterized in that an activatable expansion element is used as the holding means. The invention further relates to a device, especially for carrying out the method, comprising at least one planar substrate (4) comprising an electric circuit (5) or the like, said substrate being immobilized in a mounting position on an element to be mounted, and holding means (20) acting upon the planar substrate (4) so as to immobilize it. The holding means (20) is configured as an activatable expansion element (21).

29. 发明公开

EP2880716A1 BELASTUNGSMINIMIERENDE ELEKTRISCHE DURCHKONTAKTIERUNG 审中-公开
标题翻译： LOAD电通过减少
公开(公告)号：EP2880716A1
公开(公告)日：2015-06-10
申请号：EP13739734.5
申请日：2013-07-24
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , GUENTER, Friedhelm , RATCHEV, Roumen , RAMSAYER, Reiner , FIX, Andreas
IPC分类号： H01R12/58 , H01R13/03 , H01R43/16
CPC分类号： H01R13/03 , H01R12/585 , H01R43/16
摘要： The invention relates to a contact element (10) with a plug side (14) and a solder side (16) to be contacted with a circuit board or a carrier substrate. The contact element (10) is produced from an Al/Cu material composite (36), the Cu portion (42) of which forms the plug side (14) and the Al portion (44) of which forms the solder side (16) of the contact element (10).

30. 发明公开

EP2729965A1 VERFAHREN ZUM HERSTELLEN VON STRUKTURIERTEN SINTERVERBINDUNGSSCHICHTEN UND HALBLEITERBAUELEMENT MIT STRUKTURIERTER SINTERVERBINDUNGSSCHICHT 有权转让
标题翻译：的生产方法结构化烧结LINK层和半导体元件结构化烧结链路层
公开(公告)号：EP2729965A1
公开(公告)日：2014-05-14
申请号：EP12731389.8
申请日：2012-06-26
申请人： Robert Bosch GmbH
发明人： GUYENOT, Michael , GUENTHER, Michael , HERBOTH, Thomas
IPC分类号： H01L23/492 , H01L23/373 , H01L21/60
摘要： The fundamental concept of the invention is to produce a sintering layer connection between a substrate (11) and a chip (13), said connection creating both an excellent electric and thermal bond between the substrate (11) and the chip (13) and also reducing mechanical stress in the chip (13). The invention relates to a method for producing a sintering layer (12), comprising the steps of applying in a structured fashion a plurality of sintering elements (22a, 22b, 22c) composed of a starting material that forms the sintering layer to a contact area (21) of a main surface (11a) of a substrate (11), arranging a chip to be connected to the substrate on the sintering elements (22a, 22b, 22c), and heating and compressing the sintering elements (22a, 22b, 22c) in order to produce a structured sintering layer which connects the substrate and the chip and which extends within the contact area (21), wherein the area occupation density of the sintering elements (22a, 22b, 22c) on the substrate (11) in a central region (21a) of the contact area (21) is greater than the area occupation density of the sintering elements in an edge region (21c) of the contact area (21), and wherein at least one passage channel (23) runs from each of the sintering elements (22a, 22b, 22c) laterally with respect to the main surface of the substrate to the edge of the contact area (21). A large-area sintering element (22a) can be located in the central region (21a) of the contact surface (21) and a plurality of, for example circular, sintering elements (22c) can be located in an edge region (21c) of the contact surface (21). The sintering elements (22a, 22b, 22c) can also have notches (24). The invention also relates to a corresponding device (10, 10', 10").

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