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21. 发明授权

US4174250A Apparatus for sublimation imprinting tiles 失效
标题翻译：升华印花瓷砖装置
公开(公告)号：US4174250A
公开(公告)日：1979-11-13
申请号：US895229
申请日：1978-04-10
申请人： David Durand
发明人： David Durand
IPC分类号： B28B11/00 , B41F16/00 , B30B15/34 , B30B5/02
CPC分类号： B41F16/00 , B28B11/001
摘要： An apparatus and method for imprinting articles such as tiles by the sublimation transfer of dyes into a dye receptive surface coating provided thereon. A platen having a press member formed of liquid metal and a flexible confining membrane is utilized to heat and press a sheet having the dye imprinted design thereon so as to sublimate such designs into the adjacent coated surface of the articles. The press member is accordingly both capable of transmitting heat and pressure to the surface coating of such articles so as to simultaneously transfer said design and the texture of the membrane, sheet or separate texturing member disposed therebetween to the surface of the article.
摘要翻译：用于通过将染料升华转印到其上提供的染料接收表面涂层中来将诸如瓷砖的物品印刷的设备和方法。具有由液态金属形成的压制构件和柔性约束膜的压板用于在其上加热和压制其上具有染料印刷设计的片材，以将这种设计升华成制品的相邻涂层表面。因此，压制构件能够将热和压力传递到这些制品的表面涂层，以便同时将设置在其间的膜，片或单独的纹理构造的设计和结构转移到制品的表面。

22. 发明授权

US06761393B2 Hinge system for motor vehicle boot lid comprising an articulated arm and a sliding arm 失效
标题翻译：用于机动车驾驶室盖的铰链系统包括铰接臂和滑动臂
公开(公告)号：US06761393B2
公开(公告)日：2004-07-13
申请号：US10182910
申请日：2002-08-02
申请人： David Durand , Dominique Pastourel
发明人： David Durand , Dominique Pastourel
IPC分类号： B60J510
CPC分类号： B60J5/06 , B60J5/062 , B60J5/12 , B60J5/125 , E05D15/30 , E05F15/63 , E05F15/649 , E05Y2900/516 , E05Y2900/548 , Y10T16/35
摘要： A motor vehicle trunk door articulated to the ends of a first arm mounted pivoting, at its other end, about a vertical lateral pin integral with a body. The truck door moves from a closing position towards an opening position, substantially perpendicular to the closing position, by the first arm having a curved shape, and a second arm. One of the ends of the second arm is secured to the trunk door and the other end is mounted pivoting on a sliding sleeve mounted on a guide rail.
摘要翻译：铰链到第一臂的端部的机动车辆行李箱门，其安装在其另一端围绕与主体成一体的垂直侧向销枢转。卡车门从关闭位置朝着基本上垂直于关闭位置的打开位置，由具有弯曲形状的第一臂和第二臂移动。第二臂的一个端部被固定到行李箱门，另一端安装在安装在导轨上的滑动套筒上。

23. 发明授权

US5531020A Method of making subsurface electronic circuits 失效
标题翻译：制作地下电子电路的方法
公开(公告)号：US5531020A
公开(公告)日：1996-07-02
申请号：US112225
申请日：1993-08-27
申请人： David Durand , Roger A. Iannetta, Jr.
发明人： David Durand , Roger A. Iannetta, Jr.
IPC分类号： C09J163/00 , H01B1/22 , H01L21/48 , H01L21/60 , H01R4/04 , H05K1/09 , H05K1/18 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/28 , H05K3/32 , H05K3/34
CPC分类号： H01L24/83 , C09J163/00 , H01B1/22 , H01L21/4867 , H01L24/29 , H01L24/81 , H01R4/04 , H05K3/1258 , H05K3/321 , H01L2224/13111 , H01L2224/29101 , H01L2224/2919 , H01L2224/29399 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/3025 , H05K1/095 , H05K1/181 , H05K2201/0125 , H05K2201/0218 , H05K2201/023 , H05K2201/0245 , H05K2201/0272 , H05K2201/09036 , H05K2201/09472 , H05K2203/0307 , H05K2203/0568 , H05K2203/1105 , H05K2203/1453 , H05K3/0023 , H05K3/107 , H05K3/28 , Y10T29/49144 , Y10T29/49155
摘要： A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).
摘要翻译：公开了一种制造具有组装的至少一个电子电路部件的平面的地下电子电路的方法。首先，在衬底上的电介质材料内形成散布有焊盘的三维，基本上为方形的通道。然后将通道用含有导电金属填料的可固化聚合物材料一次填充，使得由该导电材料形成的电路迹线的上表面基本上与焊盘的上表面相同。电路元件是与导电材料接合的地方。然后在放置电子部件之后固化可固化材料。

24. 发明授权

US5455394A Flexible printed polymer lead frame 失效
标题翻译：柔性印刷聚合物引线框架
公开(公告)号：US5455394A
公开(公告)日：1995-10-03
申请号：US112226
申请日：1993-08-27
申请人： David Durand , Chon M. Wong , Roger A. Iannetta, Jr.
发明人： David Durand , Chon M. Wong , Roger A. Iannetta, Jr.
IPC分类号： H01L21/60 , H01L23/495 , H05K1/18
CPC分类号： H01L24/50 , H01L23/49572 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/73203 , H01L2224/8319 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15173 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A polymer lead frame is made from a flexible substrate with flexible conductive traces. The generally square lead frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.
摘要翻译：聚合物引线框架由具有柔性导电迹线的柔性基板制成。大致正方形的引线框架具有从拐角向中心部分延伸的对角切口，以及位于模具的占位面积内的中心孔。模具直接粘合到引线框架上，优选地与各向异性的导电粘合剂粘合。将模具放置在引线框架在夹具中。施加保持力以固定模具，并且如果需要，在固化周期期间施加固化力。固定装置允许将组件运送到固化炉并允许施加固化力。模具具有接触垫，其特征在于非平面的非凸起状表面，其凹陷具有至少约各向异性导电粘合剂中导电颗粒直径的约七分之一的深度。

25. 发明授权

US5180523A Electrically conductive cement containing agglomerate, flake and powder metal fillers 失效
标题翻译：导电水泥含有附聚物，片状和粉末状金属填料
公开(公告)号：US5180523A
公开(公告)日：1993-01-19
申请号：US436199
申请日：1989-11-14
申请人： David Durand , David P. Vieau , Ang-Ling Chu , Tai S. Weiu
发明人： David Durand , David P. Vieau , Ang-Ling Chu , Tai S. Weiu
IPC分类号： C09J163/00 , H01B1/22 , H01R4/04 , H05K1/18 , H05K3/00 , H05K3/32
CPC分类号： H05K3/321 , C09J163/00 , H01B1/22 , H01R4/04 , H05K1/181 , H05K2201/0125 , H05K2201/0218 , H05K2201/023 , H05K2201/0245 , H05K2201/0272 , H05K2203/0307 , H05K2203/0568 , H05K2203/1105 , H05K2203/1453 , H05K3/0023 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shrinkage of the polymeric carrier upon curing.
摘要翻译：在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。当固化时聚合物载体的体积收缩结果确定粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。

26. 发明授权

US5093038A Ultraviolet curable ink composition 失效
标题翻译： ULTRAVIOLET可固化油墨组合物
公开(公告)号：US5093038A
公开(公告)日：1992-03-03
申请号：US472190
申请日：1990-01-30
申请人： David Durand
发明人： David Durand
IPC分类号： H05K3/28 , C09D11/00 , C09D11/10 , H01B1/22 , H01F41/16 , H05K1/09 , H05K3/12 , H05K3/24 , H05K9/00
CPC分类号： H05K3/1283 , C09D11/101 , C09D11/52 , H01B1/22 , H01F41/16 , H05K1/095 , H05K3/245 , H05K2201/083 , H05K2203/104
摘要： A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

27. 发明授权

US4960614A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US4960614A
公开(公告)日：1990-10-02
申请号：US365712
申请日：1989-06-14
申请人： David Durand
发明人： David Durand
IPC分类号： H05K3/28 , C09D11/00 , C09D11/10 , H01B1/22 , H01F41/16 , H05K1/09 , H05K3/12 , H05K3/24 , H05K9/00
CPC分类号： H05K3/1283 , C09D11/101 , C09D11/52 , H01B1/22 , H01F41/16 , H05K1/095 , H05K3/245 , H05K2201/083 , H05K2203/104
摘要： A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source having an output in the region between 360 nm and 420 nm in a pulsing manner consisting of 5 to 8 one-half second exposure periods where each exposure period is followed by a non-exposure period of about 2 to 3 seconds.
摘要翻译：制造电路板的方法包括：可固化油墨以期望的电路图案在基材上，并通过将其暴露于脉冲的U.V. 源以360nm至420nm之间的区域输出，脉冲方式由5至8个半秒的曝光期组成，其中每个曝光周期之后是约2至3秒的非曝光周期。

28. 发明授权

US4863757A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US4863757A
公开(公告)日：1989-09-05
申请号：US011975
申请日：1987-02-06
申请人： David Durand
发明人： David Durand
IPC分类号： H01B1/22 , H05K1/09 , H05K3/12 , H05K3/24
CPC分类号： H05K3/1283 , H01B1/22 , H05K1/095 , H05K3/245 , H05K2201/083 , H05K2203/104
摘要： A method for producing a circuit board having conductive circuit elements patterened on a non-conductive substrate involves printing a film of a U.V. curable ink composed of a suspension of silver-coated magnetite particles in a U.V. curable resin onto the substrate in a circuit pattern, subjecting the pattern to a magnetic field to move the magnetite particles to a position at or near the upper surface of the resin and effecting U.V. radiation cure of the U.V. curable ink.
摘要翻译：一种具有导电电路元件的电路板的制造方法，其特征在于，印刷非导电性基板的膜。可固化油墨由银涂覆的磁铁矿颗粒悬浮液组成。以电路图案在基板上固化，使图案经受磁场使磁铁矿颗粒移动到树脂的上表面或其附近的位置，并实现U.V。紫外线辐射治疗可固化油墨。

29. 发明授权

US4668239A Method of applying a dye image to a plastic member 失效
标题翻译：将染料图像施加到塑料构件的方法
公开(公告)号：US4668239A
公开(公告)日：1987-05-26
申请号：US648390
申请日：1984-09-07
申请人： David Durand
发明人： David Durand
IPC分类号： B41F16/00 , B41M1/30 , B41M5/035 , H01H9/18 , B32B5/16 , B32B27/36 , B44C1/16 , D06P1/16
CPC分类号： H01H9/18 , B41F16/00 , B41M5/0358 , Y10T428/24901
摘要： A method of applying a dye image to a plastic member and the image bearing member thereby formed. A disperse dye having a melting point which is below the thermal deflection temperature of the plastic of the member and a vaporization point which is above said deflection temperature is applied to a surface of the member in a desired image. The dye bearing plastic is then heated to a temperature which is above the melting point of the dye and below the thermal deflection temperature of the plastic, but which is nevertheless high enough to cause some softening of said plastic. The dye is then permitted to diffuse into the plastic to provide a sharp, clear and durable image thereon.
摘要翻译：将染料图像施加到由此形成的塑料构件和图像承载构件的方法。熔点低于构件的塑料的热变形温度和高于所述挠曲温度的蒸发点的分散染料以期望的图像施加到构件的表面。然后将染料轴承塑料加热至高于染料熔点并低于塑料的热变形温度的温度，但仍然高到足以引起所述塑料的一些软化。然后允许染料扩散到塑料中，以在其上提供清晰，透明和持久的图像。

30. 发明授权

US4401686A Printed circuit and method of forming same 失效
标题翻译：印刷电路及其形成方法
公开(公告)号：US4401686A
公开(公告)日：1983-08-30
申请号：US346941
申请日：1982-02-08
申请人： David Durand
发明人： David Durand
IPC分类号： H05K3/00 , H05K3/14 , H05K3/38 , H05K3/12
CPC分类号： H05K3/386 , H05K3/146 , H05K2201/0108 , H05K2201/0166 , H05K2203/0522 , H05K2203/1572 , H05K3/0082 , H05K3/143
摘要： An ultraviolet reactive ink is applied to a translucent substrate in the desired circuit image and partially cured to a tacky state with ultraviolet radiation. A resist material is then applied to the substrate in the negative circuit image and metallic particles are deposited on the ink by vacuum deposition. The ink is then further cured to a hardened state with ultraviolet radiation applied from both above and beneath the substrate to counteract the tendency of the metal to reflect radiation applied only from above the substrate. Finally, the resist material is removed from the substrate leaving the fully formed circuit board comprising the substrate, the fully cured ink circuit image bonded thereto, and a metallic conductive layer on the ink.
摘要翻译：将紫外线反应性油墨施加到所需电路图像中的半透明基板上，并用紫外线辐射部分固化至发粘状态。然后将抗蚀剂材料施加到负电路图像中的基板上，并通过真空沉积将金属颗粒沉积在墨上。然后将墨水进一步固化至硬化状态，并从基材上方和下方施加紫外线辐射，以抵消金属反射仅从基材上方施加的辐射的趋势。最后，将抗蚀剂材料从衬底上除去，留下完全形成的电路板，其中包括基片，完全固化的墨水回路图象与其上的金属导电层。

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