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21. 发明申请

US20100241447A1 CUSTOMIZATION OF WOUND DRESSING USING RULE-BASED ALGORITHM 审中-公开
标题翻译：使用基于规则的算法来定制绕线条
公开(公告)号：US20100241447A1
公开(公告)日：2010-09-23
申请号：US12436071
申请日：2009-05-05
申请人： Oleg Siniaguine , Dmitry Krasnov , Theo Brower , Dmitriy Sinyagin
发明人： Oleg Siniaguine , Dmitry Krasnov , Theo Brower , Dmitriy Sinyagin
IPC分类号： G06Q50/00 , G06Q99/00 , G06Q10/00
CPC分类号： A61F13/00987 , A61F13/0276 , G06F19/325 , G06F19/3481 , G06Q10/06375 , G06Q50/22 , G16H50/20 , G16H50/70
摘要： A method and/or system for customizing wound dressings based on an effective wound treatment protocol created by collecting and analyzing wound treatment records. The wound treatment records are collected from one or more wound treatment facilities. The wound dressings are not customized for each patient based solely on experiences and knowledge of medical practitioners but also based on the wound treatment protocol. Further, an intuitive and systematic user interface for a wound dressing fabricator is provided to allow medical practitioners with varying levels of experiences and knowledge to customize wound dressings for a specific wound. By using the wound treatment protocol and the systematic user interface, flawed wound dressings are less likely to be fabricated. Various other functionalities are also provided to manage and support the wound dressing fabricator.
摘要翻译：基于通过收集和分析伤口治疗记录产生的有效伤口治疗方案来定制伤口敷料的方法和/或系统。创伤治疗记录从一个或多个伤口处理设备收集。伤口敷料根据医生的经验和知识，也不是根据伤口治疗方案为每个病人定制的。此外，提供用于伤口敷料制造者的直观和系统的用户界面，以允许具有不同水平的经验和知识的医疗人员定制针对特定伤口的伤口敷料。通过使用伤口治疗方案和系统的用户界面，有缺陷的伤口敷料不太可能被制造。还提供了各种其他功能来管理和支持伤口敷料制造者。

22. 发明授权

US07179397B2 Plasma processing methods and apparatus 失效
标题翻译：等离子体处理方法和装置
公开(公告)号：US07179397B2
公开(公告)日：2007-02-20
申请号：US10414603
申请日：2003-04-15
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： C23C16/00 , C23C16/453 , C23F1/00 , B65H1/00
CPC分类号： H01L21/67017 , C23C16/4584 , C23C16/513 , C23C16/54 , H01J37/32743 , H01J37/32788 , H01J2237/20228 , H01J2237/31701 , H01L21/67745 , H01L21/67796 , H01L21/68707
摘要： To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is asymmetric so that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. In some embodiments, two shuttles are provided for loading and unloading the plasma processing system. One of the shuttles stands empty waiting to unload the processed articles from the system, while the other shuttle holds unprocessed articles waiting to load them into the system. After the plasma processing terminates, the empty shuttle unloads processed articles from the system, takes the articles away, and gets unloaded and reloaded with unprocessed articles. Meanwhile, the other shuttle loads unprocessed articles into the system and the plasma processing begins. Since the plasma processing system does not wait for the first shuttle, the productivity of the system is increased.
摘要翻译：为了在等离子体处理期间将物品移入和移出等离子体，物品通过围绕第一轴线的第一驱动器旋转，并且第一驱动器本身由第二驱动器旋转。结果，物品以不同的角度进入等离子体，用于第一轴的不同位置。等离子体接触制品的等离子体横截面是不对称的，使得以更大的线速度（由于离第一轴越远）移动的制品上的那些点移动通过等离子体的较长距离。结果，物品表面上的不同点的等离子体处理时间变得更加均匀。在一些实施例中，提供两个梭子来装载和卸载等离子体处理系统。其中一个班车空着，等待从系统中卸载已处理的物品，而另一个梭子将未加工物品等待装载到系统中。等离子处理结束后，空梭从系统中卸载加工物品，取出物品，卸载并重新加载未加工物品。同时，其他梭子将未处理的物品装载到系统中，等离子体处理开始。由于等离子体处理系统不等待第一班车，所以系统的生产率提高。

23. 发明申请

US20050207238A1 Clock distribution networks and conductive lines in semiconductor integrated circuits 有权
标题翻译：半导体集成电路中的时钟分配网络和导线
公开(公告)号：US20050207238A1
公开(公告)日：2005-09-22
申请号：US11131711
申请日：2005-05-18
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： G06F1/10 , G11C7/00 , H01L21/44 , H01L21/4763 , H01L21/48 , H01L21/50 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/52 , H01L23/528 , H01L27/10 , H01L29/739 , H01L31/00
CPC分类号： H01L21/563 , G06F1/10 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/3128 , H01L23/481 , H01L23/49833 , H01L23/528 , H01L23/5283 , H01L24/97 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05023 , H01L2224/05024 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2924/01019 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A clock distribution network (110) is formed on a semiconductor interposer (320) which is a semiconductor integrated circuit. An input terminal (120) of the clock distribution network is formed on one side of the interposer, and output terminals (130) of the clock distribution network are formed on the opposite side of the interposer. The interposer has a through hole (360), and the clock distribution network includes a conductive feature going through the through hole. The side of the interposer which has the output terminals (130) is bonded to a second integrated circuit (310) containing circuitry clocked by the clock distribution network. The other side of the interposer is bonded to a third integrated circuit or a wiring substrate (330). The interposer contains a ground structure, or ground structures (390, 510), that shield circuitry from the clock distribution network. Conductive lines (150) in an integrated circuit are formed in trenches (610) in a semiconductor substrate.
摘要翻译：时钟分配网络（110）形成在作为半导体集成电路的半导体插入器（320）上。时钟分配网络的输入端子（120）形成在插入器的一侧上，时钟分配网络的输出端子（130）形成在插入器的相对侧。插入器具有通孔（360），并且时钟分配网络包括穿过通孔的导电特征。具有输出端子（130）的插入器侧被接合到包含由时钟分配网络计时的电路的第二集成电路（310）。插入器的另一侧被结合到第三集成电路或布线基板（330）。插入器包含一个接地结构，或者将电路从时钟分配网络屏蔽的接地结构（390,510）。集成电路中的导电线（150）形成在半导体衬底中的沟槽（610）中。

24. 发明授权

US06844241B2 Fabrication of semiconductor structures having multiple conductive layers in an opening 有权
标题翻译：在开口中制造具有多个导电层的半导体结构
公开(公告)号：US06844241B2
公开(公告)日：2005-01-18
申请号：US09941447
申请日：2001-08-28
申请人： Patrick B. Halahan , Oleg Siniaguine
发明人： Patrick B. Halahan , Oleg Siniaguine
IPC分类号： H01L29/872 , H01L21/3205 , H01L21/329 , H01L21/768 , H01L21/822 , H01L23/48 , H01L23/52 , H01L23/552 , H01L27/04 , H01L29/47 , H01L29/861 , H01L21/76 , H01L21/302 , H01L21/46
CPC分类号： H01L23/552 , H01L21/76898 , H01L23/481 , H01L2223/6622 , H01L2224/16 , H01L2924/04941 , H01L2924/12032 , H01L2924/3025 , Y10S438/977 , H01L2924/00
摘要： In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and a plurality of conductive layers in the opening. In some embodiments, one conductive layer provides an electromagnetic shield that shields the substrate from AC signals carried by a contact pad made from another conductive layer on a backside of the substrate. The conductive layers can also be used to form capacitor/rectifier networks. Manufacturing methods also provided.
摘要翻译：在一些实施例中，电路结构包括半导体衬底，在衬底的第一侧和衬底的第二侧之间穿过衬底的开口以及开口中的多个导电层。在一些实施例中，一个导电层提供电磁屏蔽，其屏蔽基板与由衬底背面上的另一导电层制成的接触焊盘承载的交流信号。导电层也可用于形成电容器/整流器网络。还提供了制造方法。

25. 发明授权

US06664129B2 Integrated circuits and methods for their fabrication 有权
公开(公告)号：US06664129B2
公开(公告)日：2003-12-16
申请号：US10318833
申请日：2002-12-12
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： H01L2144
CPC分类号： H01L21/441 , H01L21/304 , H01L21/3065 , H01L21/76898 , H01L23/481 , H01L23/482 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05001 , H01L2224/13009 , H01L2225/06513 , H01L2225/06541 , H01L2225/06593 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： To fabricate contacts on a wafer backside, openings (124) are formed in the face side of the wafer (104). A dielectric layer (140) and some contact material (150), e.g. metal, are deposited into the openings. Then the backside is etched until the contacts (150C) are exposed and protrude out. The protruding portion of each contact has an outer sidewall (150V). At least a portion of the sidewall is vertical or sloped outwards with respect to the opening when the contact is traced down. The contact is soldered to an another structure (410), e.g. a die or a PCB. The solder (420) reaches and at least partially covers the sidewall portion which is vertical or sloped outwards. The strength of the solder bond is improved as a result. The dielectric layer protrudes around each contact. The protruding portion (140P) of the dielectric becomes gradually thinner around each contact in the downward direction. The thinned dielectric is more flexible, and is less likely detach from the contact when the contact is pulled sideways. Other embodiments are also described.

26. 发明授权

US06287976B1 Plasma processing methods and apparatus 有权
公开(公告)号：US06287976B1
公开(公告)日：2001-09-11
申请号：US09315122
申请日：1999-05-19
申请人： Oleg Siniaguine , Igor Bagriy
发明人： Oleg Siniaguine , Igor Bagriy
IPC分类号： H01L21302
CPC分类号： H01J37/32752 , H01L21/68
摘要： To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive, so that the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is such that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. The direction of rotation of the first and/or second drive changes during processing to improve processing uniformity. The article is allowed to be processed with the plasma only during one-half of each revolution of the second drive. In the other half of each revolution, the processing is substantially prevented by increasing the second drive velocity as the article is carried through the plasma.

27. 发明授权

US6105534A Apparatus for plasma jet treatment of substrates 失效
标题翻译：用于等离子体处理基板的装置
公开(公告)号：US6105534A
公开(公告)日：2000-08-22
申请号：US194247
申请日：1998-11-25
申请人： Oleg Siniaguine , Iskander Tokmouline
发明人： Oleg Siniaguine , Iskander Tokmouline
IPC分类号： H01J37/32 , C23C16/458 , C23C16/50 , C23C16/513 , C23C16/54 , C23F4/00 , H01L21/302 , H01L21/3065 , C23C16/00
CPC分类号： C23C16/513 , C23C16/4584 , C23C16/54
摘要： An apparatus for processing substrates with a plasma jet with increased throughput is described. The apparatus comprises at least two carrousels for holding a plurality of substrates. Each of the carrousels includes a rotatable angle drive having a rotation axis Da, a plurality of arms extending radially from the angle drive and a plurality of rotatable substrate holders. Each of the substrate holders is connected to one of the arms, each of the rotatable substrate holders has a rotation axis Ha positioned at a distance R from the rotation axis Da of the rotatable angle drive. The carousel angle drive provides programmable motion of the substrates being treated relative to a plasma jet generator. The plasma jet generator is movable from a first position Z.sub.1 adjacent to the first carousel to a second position Z.sub.2 adjacent to the second carousel. While the substrates on the first carousel are being treated by the plasma jet, the substrates on the second carousel can be loaded or unloaded. Once the treatment of the substrates on the first carousel is completed, the plasma jet is moved from the first position Z.sub.1 to the second position Z.sub.2 to treat the substrates on the second carousel and allow loading and unloading of substrates from the first carousel.
摘要翻译： PCT No.PCT / US97 / 09234。 371日期：1998年11月25日 102（e）1998年11月25日日期PCT提交1997年5月30日PCT公布。第WO92 / 45857号公报日期1997年12月4日描述了一种用于通过具有增加的生产量处理等离子体射流来处理衬底的设备。该装置包括用于保持多个基板的至少两个转盘。每个转盘包括具有旋转轴线Da的可旋转角度驱动器，从角度驱动器径向延伸的多个臂和多个可旋转衬底保持器。每个基板保持器连接到一个臂，每个可旋转的基板保持器具有旋转轴线Ha，旋转轴线Ha位于距可旋转角度驱动器的旋转轴线Da的距离R处。传送带角度驱动器提供了相对于等离子体射流发生器进行处理的基板的可编程运动。等离子体喷射发生器可从邻近第一转盘的第一位置Z1移动到与第二转盘相邻的第二位置Z2。当通过等离子体射流处理第一转盘上的基板时，第二转盘上的基板可被装载或卸载。一旦第一转盘上的基板的处理完成，等离子体射流从第一位置Z1移动到第二位置Z2，以处理第二转盘上的基板，并允许从第一转盘装载和卸载基板。

28. 发明授权

US09050211B2 Self-adaptive and optionally also otherwise adaptable wound dressing 有权
标题翻译：自适应和任选地也适用于伤口敷料
公开(公告)号：US09050211B2
公开(公告)日：2015-06-09
申请号：US13402170
申请日：2012-02-22
申请人： Oleg Siniaguine , Elena Kachiguina
发明人： Oleg Siniaguine , Elena Kachiguina
IPC分类号： A61F13/00 , A61F13/02 , A61F13/15
CPC分类号： A61F13/00046 , A61F13/00029 , A61F13/00042 , A61F13/0206 , A61F13/0226 , A61F13/15211 , A61F2013/00246 , A61F2013/00727 , A61F2013/00855 , A61L15/20 , A61L15/44 , A61L2300/404
摘要： An automatically self-adjusting variable permeability providing (AVPP) layer is provided over and in operative interaction with a wound site containing a wound to the integumentary system of a living creature such as the skin of a human patient. The AVPP layer has the capability of automatically changing in respective fluid permeability characteristics provided by respective subregions of the AVPP layer where the changes are in reaction to extant or changed conditions in corresponding micro-zones of the wound site. The automatic self-adjusting behaviors of the respective subregions of the AVPP layer can include providing a faster rate of vapor removal for micro-zones of the wound site that are too wet and providing a slower rate of vapor removal or essentially no vapor removal for micro-zones of the wound site that are too dry.
摘要翻译：提供自动调节可变渗透性（AVPP）层，并且与包含例如人类患者皮肤的生物体的皮肤系统的伤口部位相互作用地进行操作。 AVPP层具有自动改变由AVPP层的各个子区域提供的各个流体渗透特性的能力，其中变化与伤口部位的相应微区中的现有或改变的条件相反。 AVPP层的各个子区域的自动自调节行为可以包括为伤口部位的微区域提供更快的蒸汽去除速率，其过湿且提供较慢的蒸气去除速率或基本上不对微生物进行蒸气去除伤口部位的区域过于干燥。

29. 发明授权

US08237007B2 Wound dressing with controllable permeability 失效
标题翻译：伤口敷料具有可控渗透性
公开(公告)号：US08237007B2
公开(公告)日：2012-08-07
申请号：US11972452
申请日：2008-01-10
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： A61F13/00
CPC分类号： A61F13/00021 , A61F13/00063 , A61F13/00995 , A61F2013/00255 , A61F2013/00604 , A61F2013/00863 , A61F2013/0091
摘要： Wound dressings and methods of manufacturing wound dressings are provided. The wound dressings include portions that are converted from a moisture vapor permeable material to a material having reduced moisture vapor permeability. The conversion may be accomplished in a variety of ways. In some embodiments, a solvent is used to dissolve a porous material to thereby form a non-porous film. In other embodiments, heat is applied to melt a porous material to thereby form a non-porous film. The heat may be applied using a heated gas or a heating element to directly or indirectly heat the material.
摘要翻译：提供伤口敷料和制造伤口敷料的方法。伤口敷料包括从透湿气体材料转变成具有降低的透湿性的材料的部分。转换可以以各种方式完成。在一些实施方案中，使用溶剂来溶解多孔材料，从而形成无孔膜。在其它实施例中，施加热量以熔化多孔材料，从而形成无孔膜。可以使用加热气体或加热元件来施加热量以直接或间接加热材料。

30. 发明申请

US20090020554A1 WOUND DRESSING AND APPARATUS FOR FORMING SAME 失效
公开(公告)号：US20090020554A1
公开(公告)日：2009-01-22
申请号：US12198676
申请日：2008-08-26
申请人： Oleg Siniaguine
发明人： Oleg Siniaguine
IPC分类号： A61L15/00 , G01F11/00 , B67D5/00 , B67D5/34
CPC分类号： A61F13/022 , A61F13/00995 , A61F13/023 , A61F13/0289 , A61F15/001 , A61F15/02 , A61F2013/00255 , A61F2013/00727 , A61F2013/00863
摘要： A multi-layered wound dressing includes a moisture-retaining portion for enhancing the healing of a wound. The wound dressing includes an intermediate layer that has both water soluble and water insoluble fibers. An apparatus that includes a cutting tool and a reservoir of liquid to pre-moisten a portion of the dressing may be used to manufacture the dressings.

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