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    • 21. 发明申请
    • Method for manufacturing integrated circuit
    • 集成电路制造方法
    • US20070254400A1
    • 2007-11-01
    • US11790230
    • 2007-04-24
    • Tetsuya YamadaTsutomu Imai
    • Tetsuya YamadaTsutomu Imai
    • H01L21/00
    • H01L31/18
    • The flatness of the surface of the light-receiving portion must be increased when the upper structural layer of a light detector is etched. The present invention provides a method for manufacturing an integrated circuit in which an aperture is formed in a stack in which an underlayer, a light-receiving area pad, and an upper structural layer are layered on a substrate, the method comprising a light-receiving area pad etching step for etching the structural layer and the light-receiving area pad under etching conditions in which a high selectivity ratio is maintained between the upper structural layer and the light-receiving area pad; and an underlayer etching step for switching to etching conditions in which the light-receiving area pad has a high selectivity ratio in relation to the underlayer following the light-receiving area pad etching step, and etching the light-receiving area pad and the underlayer. The bottom surface of the aperture can thereby be made flatter and the amount of incident light in the plane of the light-receiving portion can be made more uniform.
    • 当光检测器的上结构层被蚀刻时,光接收部分的表面的平坦度必须增加。 本发明提供了一种集成电路的制造方法,其中,在基板上层叠有下层,受光面积焊盘和上层结构层的堆叠中形成有开口部,该方法包括:受光部 在上层结构层和受光面积衬垫之间保持高选择率的蚀刻条件下蚀刻结构层和光接收区域焊盘的区域焊盘蚀刻步骤; 以及下层蚀刻步骤,用于切换到光接收区域焊盘相对于光接收区焊盘蚀刻步骤之后的下层具有高选择率的蚀刻条件,并且蚀刻受光区焊盘和底层。 因此,孔的底面可以变得平坦,并且可以使光接收部分的平面中的入射光量更均匀。
    • 23. 发明授权
    • Multilayer printed circuit board
    • 多层印刷电路板
    • US5726863A
    • 1998-03-10
    • US591687
    • 1996-01-25
    • Kouji NakayamaTsutomu Imai
    • Kouji NakayamaTsutomu Imai
    • H05K3/46H05K1/02H05K1/11H05K1/18
    • H05K1/115H05K1/0218H05K1/18H05K2201/09536H05K2201/09627H05K2201/09781H05K2201/10689H05K3/4623
    • A high-density multilayer printed circuit board is provided such that crosstalk noise between through holes is avoided and wiring efficiency is increased. Power supply through holes which connect to power supply pins of component parts are combined to make room for via holes in certain portions of the multilayer printed circuit board. These power supply through holes are subsequently restored into their original form. This permits via holes to exist at certain locations so that certain wiring layers can be interconnected. Additionally, by restoring the power supply through holes, crosstalk noise is reduced as the rear side of the multilayer printed circuit board is approached. Finally, dummy power supply lines can be provided to further reduce crosstalk noise. These dummy power supply lines are not connected to power supply pins of the component parts.
    • 提供高密度多层印刷电路板,以避免通孔之间的串扰噪声,提高布线效率。 与组件的电源引脚连接的电源通孔被组合,为多层印刷电路板的某些部分的通孔留出空间。 这些电源通孔随后恢复到原来的形式。 这允许在某些位置存在通孔,使得某些布线层可以互连。 此外,通过孔恢复电源,随着接近多层印刷电路板的后侧,串扰噪声减小。 最后,可以提供虚拟电源线以进一步减少串扰噪声。 这些虚拟电源线不连接到组件的电源引脚。
    • 26. 发明授权
    • Semiconductor device for use in a solid state imaging device
    • 用于固态成像装置的半导体装置
    • US07138670B2
    • 2006-11-21
    • US11040236
    • 2005-01-21
    • Tetsuya MiwaTsutomu ImaiSeiji KaiTakayuki Kaida
    • Tetsuya MiwaTsutomu ImaiSeiji KaiTakayuki Kaida
    • H01L29/76H01L27/148
    • H01L27/14658H01L21/76838H01L27/14603H01L27/148
    • A compact semiconductor device having a contact hole that improves stability of electric connection between a wire and an electrode. The semiconductor device includes an insulation layer formed on a semiconductor substrate, first electrodes formed on the insulation layer and spaced from one another by an interval, an insulation film covering the first electrodes, and spaced second electrodes formed on the insulation film. Each second electrode includes an intermediate portion filling the space between two adjacent first electrodes, two edge portions respectively laid above the two adjacent first electrodes in an overlapping manner, and an upper surface connected to a wire by a contact. Thickness, t1, of the insulation film, thickness, t2, of each edge portion of the second electrode, and interval, S, between the first electrodes are adjusted to satisfy the expression of S
    • 一种紧凑的半导体器件,其具有提高线和电极之间的电连接的稳定性的接触孔。 半导体器件包括形成在半导体衬底上的绝缘层,形成在绝缘层上并间隔一定距离的第一电极,覆盖第一电极的绝缘膜以及形成在绝缘膜上的间隔开的第二电极。 每个第二电极包括填充两个相邻的第一电极之间的空间的中间部分,以重叠的方式分别铺设在两个相邻的第一电极之上的两个边缘部分,以及通过接触连接到电线的上表面。 调整绝缘膜的厚度t 1,第二电极的每个边缘部分的厚度t 2和第一电极之间的间隔S满足S <(2t 1 + 2t 2)的表达式。
    • 29. 发明授权
    • Transmitter and receiver, apparatus and method, all for delivery of information
    • 发射机和接收机,设备和方法,全部用于传送信息
    • US06574598B1
    • 2003-06-03
    • US09381255
    • 1999-11-18
    • Takashi NakatsuyamaTsutomu Imai
    • Takashi NakatsuyamaTsutomu Imai
    • G10L1308
    • G10L19/0018G10L13/00G10L13/10
    • A transmitter and receiver adapted to deliver transformed information obtained by transforming the text information of an electronic mail into intermediate language information as voicing information. The transmitting apparatus generates intermediate language information on the basis of the text data received by the transmitting apparatus and also transformed information on the basis of the intermediate language information and transmits the information to the receiving apparatus. Upon receiving the transformed information, the receiving apparatus retrieves the intermediate language information from the received transformed data, and carries out an operation of voice synthesis on the basis of the retrieved intermediate language information and outputs the synthesized voice.
    • 适用于将通过将电子邮件的文本信息转换成中间语言信息而获得的变换信息作为发音信息的发送器和接收器。 发送装置根据发送装置接收到的文本数据生成中间语言信息,并根据中间语言信息生成变换后的信息,并将该信息发送到接收装置。 接收装置在接收到变换后的信息后,从接收的变换数据中取出中间语言信息,并根据检索出的中间语言信息进行语音合成的动作,并输出合成声音。