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21. 发明专利

JP2011000892A Resin composite film 审中-公开
标题翻译：树脂复合膜
公开(公告)号：JP2011000892A
公开(公告)日：2011-01-06
申请号：JP2010224291
申请日：2010-10-01
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： WAKIZAKA YASUHIRO
IPC分类号： B32B7/02 , B32B15/08 , B32B27/00 , H05K1/00 , H05K1/03
CPC分类号： B32B15/20 , B32B7/02 , B32B15/08 , B32B15/085 , B32B15/09 , B32B27/08 , B32B27/26 , B32B27/281 , B32B27/325 , B32B27/36 , B32B2250/03 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/31 , B32B2307/536 , B32B2307/54 , B32B2307/546 , B32B2307/7265 , B32B2457/08 , H05K1/036 , H05K1/0393 , H05K2201/10681 , Y10T428/24355 , Y10T428/269 , Y10T428/31504 , Y10T428/31678
摘要： PROBLEM TO BE SOLVED: To provide a resin composite film which gives a flexible wiring substrate superior in insulating performance, superior in bendable mechanical characteristic and superior in closeness.SOLUTION: In the resin composite film which is made by forming a resin B layer on at least one surface of a resin A layer, the thickness of the resin B layer is 0.1 to 4 μm, and the resin B layer is made of an insulating material which can give a film having a water absorbing rate of 0.03 to 0.25% and a thickness of 10 μm, wherein, when a metal layer is provided on the surface of the resin B layer of this resin composite film, a metal resin composite film is obtained.
摘要翻译：要解决的问题：提供一种树脂复合膜，其赋予绝缘性能优异的柔性布线基板，优异的弯曲机械特性和优良的接合性。解决方案：在通过在上面形成树脂B层制成的树脂复合膜树脂A层的至少一个表面，树脂B层的厚度为0.1〜4μm，树脂B层由能够得到吸收率为0.03〜0.25％的膜的绝缘材料形成，厚度为10μm，其中，当在该树脂复合膜的树脂B层的表面上设置金属层时，得到金属树脂复合膜。

22. 发明专利

JP2005264076A Thermosetting slurry and electric insulating film using the same 审中-公开
标题翻译：使用相同的热浸浆和电绝缘膜
公开(公告)号：JP2005264076A
公开(公告)日：2005-09-29
申请号：JP2004081361
申请日：2004-03-19
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： KAWASAKI MASAFUMI , ITO AZUMI , WAKIZAKA YASUHIRO
IPC分类号： B05D5/12 , B05D7/24 , B32B27/18 , C08G59/42 , C08K9/02 , C08L101/08 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide thermosetting slurry with good storing stability for electric insulating layers without a question of poisonous substance emission at the incineration that is suitable for obtaining a multilayer circuit board on which an electric insulating layer having excellent flame retardancy and surface flatness can be formed, and fine wiring patterns can be formed highly densely and neatly. SOLUTION: This thermosetting slurry comprises an insulating polymer (A) having a carboxy group, curing agent (B), flame retardant (C) and organic solvent (D). The flame retardant (C) is a metal hydroxide covered with an acidic compound and is finely dispersed to have a secondary particle size of not more than 30 μm. Preferable acidic compounds are inorganic acidic compounds or boric acid derived from phosphates, silicates, or borates. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供对电绝缘层具有良好储存稳定性的热固性浆料，而没有在焚烧时有毒物质排放的问题，适合于获得具有优异阻燃性的电绝缘层的多层电路板和可以形成表面平坦度，并且可以高密度地且整齐地形成精细的布线图案。解决方案：该热固性浆料包含具有羧基的绝缘聚合物（A），固化剂（B），阻燃剂（C）和有机溶剂（D）。阻燃剂（C）是用酸性化合物覆盖的金属氢氧化物，其微细分散，二次粒径为30μm以下。优选的酸性化合物是衍生自磷酸盐，硅酸盐或硼酸盐的无机酸性化合物或硼酸。版权所有（C）2005，JPO＆NCIPI

23. 发明专利

JP2004292652A Flame retardant slurry and use of the same 有权
公开(公告)号：JP2004292652A
公开(公告)日：2004-10-21
申请号：JP2003087334
申请日：2003-03-27
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： WAKIZAKA YASUHIRO , FUJIMURA MAKOTO
IPC分类号： C09K21/02 , C09K21/12 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having an electrical insulating layer excellent in high-temperature high-humidity resistance and electrical insulating properties.
SOLUTION: A flame retardant slurry comprises an organic dispersion medium, a phosphate particle of a basic nitrogen-containing compound and a metallic compound hardly soluble in the organic dispersion medium (wherein the metal belongs to the 2nd group or the 13th group of a long form of the periodic table). The multilayer printed wiring board is obtained by forming an electrical insulating layer on an inner layer board using a varnish of a curable resin composition comprising an insulating polymer, a curing agent and the flame retardant slurry. The flame retardant slurry can be prepared by stirring, in a wet mill, the organic dispersion medium, the phosphate particle of the basic nitrogen-containing compound and the metallic compound hardly soluble in the organic dispersion medium (wherein the metal belongs to the 2nd group or the 13th group of the long form of the periodic table).
COPYRIGHT: (C)2005,JPO&NCIPI

24. 发明专利

JP2004039273A Varnish and its utilization 审中-公开
公开(公告)号：JP2004039273A
公开(公告)日：2004-02-05
申请号：JP2002190548
申请日：2002-06-28
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： TSUKAMOTO ATSUSHI , WAKIZAKA YASUHIRO , KAWASAKI MASAFUMI
IPC分类号： B05D5/00 , B05D7/00 , H01B3/00 , H01B3/30 , H01B3/44 , H05K3/28 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a vanish that shows good fire-retardancy and high-temperature and high-humidity resistance, and is superior in electric insulation and forms an electric insulating layer with little dielectric constant variation, and also to provide an electric insulating membrane obtained using this, and a laminated body having this. SOLUTION: This is the hardened vanish that contains an insulating polymer, a hardening agent, a fire-retardant, and an organic solvent organic solvent. A vanish made of a particle having a secondary particle size of 30 μm or less is obtained so that the fire-retardant makes a flame retardancy assistant contact with a dispersant having an organic compound or a carboxyl group in the organic solvent. Using this varnish, an electric insulating membrane is formed and a multi-layered circuit board is obtained. COPYRIGHT: (C)2004,JPO

25. 发明专利

JP2003332738A Method of forming multilayered circuit structure and substrate having multilayered circuit structure 有权
标题翻译：形成多层电路结构的方法和具有多层电路结构的衬底
公开(公告)号：JP2003332738A
公开(公告)日：2003-11-21
申请号：JP2002142564
申请日：2002-05-17
申请人： Japan Science & Technology Corp , Kumabo Metal:Kk , Nippon Zeon Co Ltd , Ogata Kogyo Kk , Toppan Printing Co Ltd , 凸版印刷株式会社 , 日本ゼオン株式会社 , 株式会社熊防メタル , 科学技術振興事業団 , 緒方工業株式会社
发明人： WAKIZAKA YASUHIRO , FURUYA AKIHIKO , YASUDA KEIICHIRO , BABA TOMOYUKI
IPC分类号： H05K3/18 , H05K3/38 , H05K3/46
CPC分类号： H05K3/389 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2203/0796 , H05K2203/121 , H05K2203/124 , Y10T428/24917
摘要： PROBLEM TO BE SOLVED: To provide a method of forming multilayered circuit structure by which the adhesive property of a conductor circuit layer can be improved while the surface of an electrical insulating layer is kept in a flat state, and to provide a substrate having a multilayered circuit structure. SOLUTION: After a film of a curable composition composed of an insulating polymer and a curing agent is formed as the outermost layer of an internal substrate, the electrical insulating layer is formed on the surface of the film of the curable composition by bringing a compound having coordination geometry to a metal into contact with the surface of the insulating layer and curing the film of the curable composition. Then the surface of the formed electrical insulating layer is treated to have a hydrophilic property and a metallic thin film layer is formed on the surface of the insulating layer by using an ethylenediaminetetraacetic acid-copper complex. After the metallic thin film layer is formed, the conductor circuit layer containing the thin film layer is formed. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种形成多层电路结构的方法，通过该方法，可以在电绝缘层的表面保持平坦状态的同时改善导体电路层的粘合性，并提供基板具有多层电路结构。解决方案：在由绝缘聚合物和固化剂组成的可固化组合物的膜形成为内部基材的最外层之后，通过使可固化组合物的膜的表面形成电绝缘层具有与金属的配位几何形状的化合物与绝缘层的表面接触并固化可固化组合物的膜的化合物。然后将形成的电绝缘层的表面处理为具有亲水性，并且通过使用乙二胺四乙酸铜络合物在绝缘层的表面上形成金属薄膜层。在形成金属薄膜层之后，形成包含薄膜层的导体电路层。版权所有（C）2004，JPO

26. 发明专利

JP2003053879A Circuit board and manufacturing method thereof 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：JP2003053879A
公开(公告)日：2003-02-26
申请号：JP2001295698
申请日：2001-09-27
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： KAWASAKI MASAFUMI , WAKIZAKA YASUHIRO , KANDA NAOKI
IPC分类号： B32B7/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board in which the adhesiveness between electrical insulation layers is high and the interlaminar electric resistance is low. SOLUTION: An inner-layer base constituted of the electrical insulation layer (1) and a conductor circuit (a) formed on the surface of the layer (1) is brought into contact with a corrosive or a plasma and then with a thiol compound to form a primer layer. Subsequently a sheet or a film prepared by molding a curable resin composition containing an alicyclic olefin polymer is cured to form the electrical insulation layer (2). Thereby the multilayer circuit board is manufactured.
摘要翻译：要解决的问题：提供电绝缘层之间的粘合性高并且层间电阻低的电路板。解决方案：由形成在层（1）的表面上的电绝缘层（1）和导体电路（a）构成的内层基底与腐蚀性或等离子体接触，然后与硫醇化合物接触形成底漆层。随后，通过模塑含有脂环族烯烃聚合物的可固化树脂组合物制备的薄片或薄膜被固化以形成电绝缘层（2）。从而制造多层电路板。

27. 发明专利

JP2011076981A Manufacturing method of secondary battery positive electrode, slurry for secondary battery positive electrode, and secondary battery 审中-公开
标题翻译：二次电池正极电极的制造方法，二次电池正极电极的浆料和二次电池
公开(公告)号：JP2011076981A
公开(公告)日：2011-04-14
申请号：JP2009229713
申请日：2009-10-01
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： WAKIZAKA YASUHIRO , YABUUCHI YASUSUKE
IPC分类号： H01M4/139 , H01M4/26 , H01M4/32 , H01M4/62 , H01M10/052 , H01M10/0566
CPC分类号： Y02P70/54
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a secondary battery positive electrode in which corrosion of a current collector at the time of applying an active material for high capacity in the aqueous slurry is controlled, and output characteristics of the secondary battery can be improved. SOLUTION: The manufacturing method of a secondary battery positive electrode comprises a process in which a slurry for secondary battery positive electrode containing a positive electrode active material, water, water soluble polymer, and particulate polymer is coated on the current collector made of metal and a process in which the coated slurry for secondary battery positive electrode is dried, and pH of the slurry for the secondary battery positive electrode is 10 or more and 12 or less. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种二次电池正极的制造方法，其中控制在水性浆液中施加高容量活性物质时的集电体的腐蚀，并且二次电池正极的输出特性电池可以改善。解决方案：二次电池正极的制造方法包括将含有正极活性物质的二次电池正极的浆料，水，水溶性聚合物和粒状聚合物涂布在由金属和二次电池用正极的被覆浆料干燥，二次电池用正极的浆料的pH为10以上且12以下的工序。版权所有（C）2011，JPO＆INPIT

28. 发明专利

JP2011054439A All-solid secondary battery 有权
标题翻译：全固态二次电池
公开(公告)号：JP2011054439A
公开(公告)日：2011-03-17
申请号：JP2009202836
申请日：2009-09-02
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： WAKIZAKA YASUHIRO , HAYANO SHIGETAKA , YOSHIDA NAOKI
IPC分类号： H01M10/056 , H01M4/62
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide an all-solid secondary battery having a solid electrolyte layer with a high binding property, a positive electrode and negative electrode, as well as high cycle characteristics. SOLUTION: In the all-solid secondary battery having a positive electrode, a solid electrolyte layer and a negative electrode, at least either the positive electrode, the solid electrolyte layer, or the negative electrode contains a block polymer consisting of a segment A with a ratio of inorganic property to organic property with an organic conceptual diagram as a pointer to be ≥0 and COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供具有高粘合性的固体电解质层，正极和负极以及高循环特性的全固体二次电池。解决方案：在具有正电极，固体电解质层和负极的全固体二次电池中，至少正电极，固体电解质层或负电极中的至少一个包含由段 A，具有无机性与有机性的比率，有机概念图作为指标≥0和<0.3，以及比例≥0.35和<10的段B。版权所有（C）2011，JPO＆INPIT

29. 发明专利

JP2009167433A Ring-opened copolymer, hydrogenated product of ring-opened copolymer, method for producing the same, and composition thereof 审中-公开
标题翻译：开环共聚物，环状共聚物的氢化产物，其制造方法及其组合物
公开(公告)号：JP2009167433A
公开(公告)日：2009-07-30
申请号：JP2009113088
申请日：2009-05-07
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： TAGUCHI KAZUNORI , TSUNOKAI YASUO , TAKEUCHI HITOMI , WAKIZAKA YASUHIRO , SAKAMOTO KEI
IPC分类号： C08G61/08 , C08L65/00
摘要： PROBLEM TO BE SOLVED: To provide a ring-opened metathesis copolymer having low water absorption, excellent adhesiveness to other materials such as metals and compatibility with other compounds such as a curing agent, exhibiting high heat-resistance and causing little delay and noise of a signal in a high-frequency range, and to provide a hydrogenated product of the copolymer. SOLUTION: The ring-opened metathesis copolymer and the hydrogenated product of the ring-opened metathesis copolymer having a hydroxy group, a desired monomer composition and high molecular weight can be produced by the ring-opening metathesis copolymerization of a norbornene monomer having a hydroxy group and a non-substituted norbornene monomer having three or more rings in the presence of a catalyst principally composed of an organic ruthenium compound having a coordinated neutral electron-donative ligand and hydrogenating the copolymerization product. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有低吸水性的环开环复分解共聚物，对其它材料如金属的粘合性以及与其它化合物如固化剂的相容性显示出高的耐热性并且几乎没有延迟，在高频范围内的信号的噪声，并提供共聚物的氢化产物。解决方案：开环复分解共聚物和具有羟基，所需单体组成和高分子量的开环易位共聚物的氢化产物可以通过开环易位共聚合来制备，所述降冰片烯单体具有羟基和未取代的降冰片烯单体，在主要由具有配位的中性给电子配位体的有机钌化合物组成的催化剂存在下具有三个或更多个环并氢化共聚产物。版权所有（C）2009，JPO＆INPIT

30. 发明专利

JP2007100103A Norbornene resin composition 审中-公开
标题翻译： NORBORNENE树脂组合物
公开(公告)号：JP2007100103A
公开(公告)日：2007-04-19
申请号：JP2006343069
申请日：2006-12-20
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： TSUNOKAI YASUO , WAKIZAKA YASUHIRO
IPC分类号： C08L45/00 , C08F277/00
摘要： PROBLEM TO BE SOLVED: To provide a norbornene resin composition affording a material having sufficient mechanical strength as a molding material even at high temperatures, a low coefficient of linear expansion and excellent heat resistance, low hygroscopicity and even excellent dielectric characteristics.
SOLUTION: The norbornene resin composition is composed of a norbornene addition polymer and a filler. The norbornene addition polymer containing especially ≥50 mol% of repeating units of a norbornene monomer in the whole repeating units of the polymer among cyclic olefinic polymers has especially a high glass transition temperature and excellent heat resistance. Thereby, deterioration of mechanical strength and an increase in coefficient of linear expansion at the high temperatures are slight and effects when compounded with the filler such as an inorganic or an organic filler are remarkably improved. As a result, the material suitable as the molding material for production and having a high frequency of uses at the high temperatures such as a material for electronic parts is obtained.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：待解决的问题：即使在高温下，提供具有作为成型材料的机械强度充分的材料的降冰片烯树脂组合物，线膨胀系数低，耐热性优异，吸湿性低，甚至具有优异的介电特性。解决方案：降冰片烯树脂组合物由降冰片烯加成聚合物和填料组成。在环状烯烃类聚合物中，聚合物的全部重复单元中，降冰片烯类单体的降冰片烯类单体的重均单元特别优选为50摩尔％以上的降冰片烯加聚物，具有特别高的玻璃化转变温度和优异的耐热性。由此，高温下的机械强度的劣化和线膨胀系数的增加是微小的，并且与无机或有机填料等填料混合时的效果显着提高。结果，可以获得适合作为用于生产的成型材料和在高温下使用频率高的材料，例如用于电子部件的材料。版权所有（C）2007，JPO＆INPIT

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