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21. 发明授权

US07560460B2 Substituted piperazines and methods of use 失效
标题翻译：取代的哌嗪和使用方法
公开(公告)号：US07560460B2
公开(公告)日：2009-07-14
申请号：US11116759
申请日：2005-04-27
申请人： Christopher H. Fotsch , Michael G. Kelly , Mark H. Norman , Ning Xi , Shimin Xu
发明人： Christopher H. Fotsch , Michael G. Kelly , Mark H. Norman , Ning Xi , Shimin Xu
IPC分类号： A61K31/497 , C07D241/02 , C07D403/10 , C07D401/08 , C07D403/04 , C07D405/02 , C07D411/02
CPC分类号： C07D207/08 , A61K38/00 , C07D205/04 , C07D207/09 , C07D209/14 , C07D209/42 , C07D211/26 , C07D211/60 , C07D211/62 , C07D213/38 , C07D213/81 , C07D213/82 , C07D215/48 , C07D217/06 , C07D217/14 , C07D217/26 , C07D233/64 , C07D295/185 , C07D317/60 , C07D317/68 , C07D319/18 , C07D401/12 , C07D403/12 , C07D409/12 , C07D413/12 , C07D417/12 , C07D451/02 , C07K5/06026 , C07K5/06139 , C07K5/06147 , C07K5/06191
摘要： Selected substituted piperazine compounds are effective for prophylaxis and treatment of diseases, such as obesity and the like. The invention encompasses novel compounds, analogs, prodrugs and pharmaceutically acceptable salts thereof, pharmaceutical compositions and methods for prophylaxis and treatment of diseases and other maladies or conditions involving activation of the melanocortin receptor. The subject invention also relates to processes for making such compounds as well as to intermediates useful in such processes.
摘要翻译：所选的取代哌嗪化合物对于预防和治疗诸如肥胖症等疾病是有效的。本发明包括新颖的化合物，类似物，前药和药学上可接受的盐，用于预防和治疗涉及黑皮质素受体活化的疾病和其它疾病或病症的药物组合物和方法。本发明还涉及制备这些化合物的方法以及在这些方法中有用的中间体。

22. 发明授权

US07537960B2 Method of making multi-chip package with high-speed serial communications between semiconductor dice 有权
标题翻译：半导体芯片之间采用高速串行通信制造多芯片封装的方法
公开(公告)号：US07537960B2
公开(公告)日：2009-05-26
申请号：US11972602
申请日：2008-01-10
申请人： Michael G. Kelly , Paul G. Chenard , Revathi Uma Polisetti , Patrick A. McKinley
发明人： Michael G. Kelly , Paul G. Chenard , Revathi Uma Polisetti , Patrick A. McKinley
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
摘要翻译：多芯片封装包括封装基板。第一和第二半导体管芯形成在封装衬底上。第一和第二半导体管芯被配置为经由高速串行通信协议相互通信。

23. 发明授权

US07359198B2 System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry 失效
标题翻译：用于在流体中引起湍流以耗散电子电路的热能的系统和方法
公开(公告)号：US07359198B2
公开(公告)日：2008-04-15
申请号：US11238418
申请日：2005-09-29
申请人： Michael G. Kelly , Mark D. Johnson , William H. Sisson , Jeffrey P. Tobin
发明人： Michael G. Kelly , Mark D. Johnson , William H. Sisson , Jeffrey P. Tobin
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at least a portion of a turbulence-inducing device arranged in the path, and dissipating thermal energy from the circuit by the fluid. A system comprises a circuit, and a closed-loop cooling system comprising fluid for cooling the circuit and at least one active turbulence-inducing device. In one embodiment, the turbulence-inducing device is a microelectromechanical system (MEMS) device. In one embodiment, the MEMS device is solely responsible for bulk fluid movement through the closed-loop cooling system.
摘要翻译：用于冷却回路的方法包括沿着通过闭环系统的路径产生流体的运动。该方法还包括通过移动位于路径中的紊流诱导装置的至少一部分，并且通过流体从该回路消散热能来在流体中引起湍流。一种系统包括电路和闭环冷却系统，其包括用于冷却电路的流体和至少一个主动湍流诱导装置。在一个实施例中，湍流诱导装置是微机电系统（MEMS）装置。在一个实施例中，MEMS装置单独负责通过闭环冷却系统的大量流体运动。

24. 发明授权

US07342310B2 Multi-chip package with high-speed serial communications between semiconductor die 有权
标题翻译：多芯片封装与半导体芯片之间的高速串行通信
公开(公告)号：US07342310B2
公开(公告)日：2008-03-11
申请号：US10841741
申请日：2004-05-07
申请人： Michael G. Kelly , Paul A. Chenard , Revathi Uma Polisetti , Patrick A. Mckinley
发明人： Michael G. Kelly , Paul A. Chenard , Revathi Uma Polisetti , Patrick A. Mckinley
IPC分类号： H01L23/34
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
摘要翻译：多芯片封装包括封装基板。第一和第二半导体管芯形成在封装衬底上。第一和第二半导体管芯被配置为经由高速串行通信协议相互通信。

25. 发明授权

US06689792B2 Antipsychotic indolyl derivatives 失效
标题翻译：抗精神病药物吲哚衍生物
公开(公告)号：US06689792B2
公开(公告)日：2004-02-10
申请号：US09976321
申请日：2001-10-12
申请人： Michael G. Kelly , Young H. Kang
发明人： Michael G. Kelly , Young H. Kang
IPC分类号： A61K31454
CPC分类号： C07D209/42 , C07D209/08 , C07D209/34 , C07D403/12
摘要： Compounds of formula (1) are provided: wherein R1 and R2 are H, OH, F, Cl, Br, I, 1 to 6 carbon alkyl or alkenyl, 1 to 6 carbon alkoxy, aryl, OR5, nitro, amino, CF3 or R1 and R2 are taken together to form a fused ring at the 2,3- or 3,4-positions providing a fused phenyl group or a benzodioxane group, or a 4- or 7-substituted indole group, or a 5- or 8-substituted quinoline group; R3 represents a group selected from hydrogen, a 1 to 6 carbon alkyl, a 1 to 4 carbon alkoxy or a halogen; R4 represents a group selected from hydrogen, 1 to 6 carbon alkyl or R5; R5 is CH2Ph in which the phenyl ring can be optionally substituted by a group selected from OMe, halogen, CF3; X is selected from a group represented by C, CR4, [[CHR4]] and CHCH2; A is selected from a group represented by N, NH, CH and CH2; B is selected from a group represented by ═O, ═S, H and H2; or A and B may be concatenated together to form indole, benzimidazole, indolone or indoline moieties; or a pharmaceutically acceptable salt thereof, as well as pharmaceutical compositions and methods of treating central nervous system disorders utilizing these compounds.
摘要翻译：提供式（1）化合物：其中R 1和R 2是H，OH，F，Cl，Br，I，1至6碳烷基或烯基，1至6个碳烷氧基，芳基，OR 5，硝基，氨基，CF 3或R 1 并且R 2一起在2,3或3,4位上形成稠环，提供稠合苯基或苯并二恶烷基，或4-或7-取代的吲哚基，或5-或8-取代的吲哚基，取代的喹啉基; R 3表示选自氢，1至6个碳烷基，1至4个碳烷氧基或卤素的基团; R 4表示选自氢，1至6个碳烷基或R 5的基团; R 5是CH 2 Ph，其中苯环可任选被选自OMe，卤素，CF 3的基团取代; X选自C，CR 4，[[CHR]]和CHCH 2表示的基团; A选自N，NH， CH和CH 2; B选自由= O，= S，H和H 2表示的基团;或者A和B可以连接在一起形成吲哚，苯并咪唑，吲哚酮或二氢吲哚部分; 或其药学上可接受的盐，以及利用这些化合物治疗中枢神经系统疾病的药物组合物和方法。

26. 发明授权

US06204274B1 Indolyl derivatives as serotonergic agents 失效
标题翻译：吲哚衍生物作为血清素能药
公开(公告)号：US06204274B1
公开(公告)日：2001-03-20
申请号：US09298200
申请日：1999-04-23
申请人： Michael G. Kelly , Young H. Kang
发明人： Michael G. Kelly , Young H. Kang
IPC分类号： A61K31445
CPC分类号： C07D401/14
摘要： The present invention provides compounds of the formula (1): wherein R1 and R2 each independently represent hydrogen, hydroxy, F, Cl, Br, I, CN, 1 to 6 carbon alkyl, 1 to 6 carbon alkoxy, nitro, CF3 and phenyloxy or benzyloxy, in which the aromatic ring can be optionally substituted by from 1 to 3 groups selected from C1-C6 alkoxy (preferably OMe), F, Cl, Br, I, and CF3; R3 and R4 are each independently a hydrogen, a 1 to 6 carbon alkyl or a CH2Ph in which the phenyl ring can be optionally substituted by from 1 to 3 groups selected from C1-C6 alkoxy (preferably OMe), F, Cl, Br, I, and CF3; Y is selected from CH2 or CH and, X is selected from a group represented by N, CR3, CHR3, CHCH; or a pharmaceutically acceptable salt thereof, as well as pharmaceutical compositions and methods of using the compounds to treat central nervous system disorders, such as depression, anxiety, drug withdrawal, eating and sexual disorders and other conditions for which serotonin reuptake inhibitors are used.
摘要翻译：本发明提供式（1）的化合物：其中R 1和R 2各自独立地表示氢，羟基，F，Cl，Br，I，CN，1至6个碳原子的烷基，1至6个碳烷氧基，硝基，CF 3和苯氧基或苄氧基，其中芳环可以任选被1至3个选自C 1 -C 6烷氧基（优选OMe），F，Cl，Br，I和CF 3的基团取代; R 3和R 4各自独立地为氢，至6碳烷基或CH 2 Ph，其中苯环可以任选被1至3个选自C 1 -C 6烷氧基（优选OMe），F，Cl，Br，I和CF 3的基团取代; Y选自CH 2或 CH，X选自由N，CR 3，CHR 3，CHCH表示的基团;或其药学上可接受的盐，以及使用该化合物治疗中枢神经系统疾病如抑郁症，焦虑症，药物戒断，饮食和性障碍以及使用5-羟色胺再摄取抑制剂的其他条件。

27. 发明授权

US5798567A Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors 失效
标题翻译：球栅阵列集成电路封装，采用倒装芯片集成电路和去耦电容
公开(公告)号：US5798567A
公开(公告)日：1998-08-25
申请号：US915969
申请日：1997-08-21
申请人： Michael G. Kelly , Pirooz Emad
发明人： Michael G. Kelly , Pirooz Emad
IPC分类号： H01L23/13 , H01L23/498 , H01L23/50 , H05K1/02 , H05K3/34 , H01L23/34
CPC分类号： H01L23/50 , H01L23/13 , H01L23/49816 , H01L23/49827 , H05K1/0231 , H05K3/3436 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L24/45 , H01L24/48 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H05K2201/10477 , H05K2201/1053 , H05K2201/10734 , Y02P70/613
摘要： A ball grid array to integrated circuit interconnection. The interconnection includes a ball grid array substrate having a first surface and a second surface. The first surface comprising a plurality of substrate interconnection conductive pads. A power supply via connects a power supply conductive pad of the first surface to a first conductive area on the second surface. A ground via connects a ground conductive pad of the first surface to a second conductive area on the second surface. A decoupling capacitor connected between the first conductive area and the second conductive area. The interconnection further comprises an integrated circuit comprising a plurality of integrated circuit conductive pads. A plurality of smaller solder balls interconnect at least one of the integrated circuit conductive pads to at least one of the substrate interconnection conductive pads. A circuit board substrate is electrically interconnected by larger solder balls to the ball grid array substrate.
摘要翻译：一个球栅阵列到集成电路互连。互连包括具有第一表面和第二表面的球栅阵列基板。所述第一表面包括多个衬底互连导电焊盘。电源通孔将第一表面的电源导电焊盘连接到第二表面上的第一导电区域。接地通孔将第一表面的接地导电焊盘连接到第二表面上的第二导电区域。连接在第一导电区域和第二导电区域之间的去耦电容器。互连还包括包括多个集成电路导电焊盘的集成电路。多个较小的焊球将至少一个集成电路导电焊盘连接到至少一个衬底互连导电焊盘。电路板基板通过较大的焊球与球栅阵列基板电连接。

28. 发明授权

US4550189A Soil repellents derived from fluorinated acrylates and aromatic amines 失效
标题翻译：衍生自氟化丙烯酸酯和芳族胺的防污剂
公开(公告)号：US4550189A
公开(公告)日：1985-10-29
申请号：US697293
申请日：1985-02-01
申请人： Michael G. Kelly , James H. Covill
发明人： Michael G. Kelly , James H. Covill
IPC分类号： C08K5/18 , C07C101/447
CPC分类号： C08K5/18
摘要： Soil repellents derived from fluorinated acrylates and aromatic amines are disclosed which have excellent durability and resistance to laundering. The compounds are represented by the formula(R).sub.m --Ar--(NHCH.sub.2 CH(R.sub.1)CO.sub.2 R.sub.f).sub.nwherein n is 1 to 3 and m is 0 to 4, Ar is an aromatic radical containing from 1 to 3 benzene rings which may be fused together or linked through a single carbon-carbon bond or a linking group, R.sub.f is a fluorinated radical, R.sub.1 is H or CH.sub.3, and R is independently selected from lower alkyl, lower alkoxy, halogen, hydroxy, nitro, cyano, amino, lower alkylamino, lower acylamino, --CO.sub.2 R.sub.3 and --NHCH.sub.2 CH(R.sub.1)CO.sub.2 R.sub.3 wherein R.sub.3 is lower alkyl, --CH.sub.2 CH.sub.2 OH, or --CH.sub.2 CH(OH)CH.sub.2 Cl. Also disclosed are polyester and nylon fibers having these compounds incorporated therein.
摘要翻译：公开了从氟化丙烯酸酯和芳族胺衍生的防污剂，其具有优异的耐久性和耐洗涤性。化合物由式（R）m-Ar-（NHCH 2 CH（R 1）CO 2 R f）n表示，其中n为1至3，m为0至4，Ar为含有1至3个苯环的芳族基团，其可以是稠合在一起或通过单个碳 - 碳键或连接基团连接，Rf是氟化基团，R1是H或CH3，R独立地选自低级烷基，低级烷氧基，卤素，羟基，硝基，氰基，氨基，低级烷基氨基，低级酰基氨基，-CO 2 R 3和-NHCH 2 CH（R 1）CO 2 R 3，其中R 3是低级烷基，-CH 2 CH 2 OH或-CH 2 CH（OH）CH 2 Cl。还公开了具有这些化合物的聚酯和尼龙纤维。

29. 发明授权

US4534770A Multi-ring fluorinated carbamates with textiles soil repellent activity 失效
标题翻译：多环氟化氨基甲酸酯具有纺织品防污性能
公开(公告)号：US4534770A
公开(公告)日：1985-08-13
申请号：US674398
申请日：1984-11-23
申请人： Michael G. Kelly
发明人： Michael G. Kelly
IPC分类号： C07C271/06 , D06M13/428 , D06M13/40 , C07C125/06 , C09B67/00
CPC分类号： C07C271/06 , D06M13/428 , Y10S8/922 , Y10S8/924 , Y10S8/93
摘要： Multi-ring fluorinated carbamates are disclosed which have excellent anti-soiling properties, durability and resistance to laundering. The compounds are represented by the formula ##STR1## wherein R.sub.f is a fluorinated radical. Compositions containing at least 10% of such compounds are also disclosed, as well as polyester and nylon fibers having such compounds incorporated therein.
摘要翻译：公开了具有优异的防污性能，耐久性和耐洗涤性的多环氟化氨基甲酸酯。化合物由式（Ⅰ）表示，其中Rf是氟化基团。还公开了含有至少10％的这类化合物的组合物，以及掺入其中的这种化合物的聚酯和尼龙纤维。

30. 发明授权

US08802499B2 Methods for temporary wafer molding for chip-on-wafer assembly 有权
标题翻译：片上晶片组装的临时晶片成型方法
公开(公告)号：US08802499B2
公开(公告)日：2014-08-12
申请号：US13678026
申请日：2012-11-15
申请人： Michael G. Kelly , David Jon Hiner , Ronald Patrick Huemoeller
发明人： Michael G. Kelly , David Jon Hiner , Ronald Patrick Huemoeller
IPC分类号： H01L21/00
CPC分类号： H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L22/14 , H01L22/20 , H01L23/04 , H01L23/147 , H01L23/3675 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/95 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/73204 , H01L2224/73253 , H01L2224/81001 , H01L2224/81191 , H01L2224/81908 , H01L2224/81986 , H01L2224/83192 , H01L2224/83908 , H01L2224/83986 , H01L2224/92125 , H01L2924/12042 , H01L2924/16152 , H01L2924/1616 , H01L2924/18161 , H01L2924/19105 , H01L2924/00
摘要： Methods for temporary wafer molding for chip-on-wafer assembly may include bonding one or more semiconductor die to an interposer wafer, applying a temporary mold material to encapsulate the bonded die, and backside processing the interposer, which may be singulated to generate assemblies comprising the bonded die, the interposer die, which may be bonded to packaging substrates. The temporary mold material may be removed and the bonded die may be tested. Additional die may be bonded to the assemblies based on the electrical testing. The interposer may be singulated utilizing one or more of: a laser cutting process, reactive ion etching, a sawing technique, and a plasma etching process. The backside processing may comprise thinning the interposer wafer to expose through-silicon-vias (TSVs) and placing metal contacts on the exposed TSVs. The die may be bonded to the interposer utilizing a mass reflow or thermal compression process.
摘要翻译：用于片上晶片组装的临时晶片成型的方法可以包括将一个或多个半导体管芯接合到插入器晶片，施加临时模制材料以封装接合的管芯，以及背面处理插入件，其可以被单个化以产生组件，可以粘合到封装衬底上的粘合模，插入模。可以移除临时模具材料并且可以测试粘合的模具。基于电气测试，附加模具可以结合到组件。可以使用激光切割工艺，反应离子蚀刻，锯切技术和等离子体蚀刻工艺中的一种或多种来切割插入器。背面处理可以包括使内插器晶片变薄以暴露穿过硅通孔（TSV）并且将金属触点放置在暴露的TSV上。可以使用质量回流或热压缩工艺将管芯结合到插入件。

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