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21. 发明授权

US07690817B2 Illumination device with semiconductor light-emitting elements 失效
标题翻译：具有半导体发光元件的照明装置
公开(公告)号：US07690817B2
公开(公告)日：2010-04-06
申请号：US11947075
申请日：2007-11-29
申请人： Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
发明人： Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
IPC分类号： F21V29/00
CPC分类号： H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译：照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。基板包括表面和突出部分。突起部形成为从其端部朝向基板的表面逐渐变厚。绝缘体形成在表面上。导体形成在绝缘体上。半导体发光元件安装在突出部分上。半导体发光元件通过连接构件电连接到导体。密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

22. 发明授权

US5278422A Normally open solid state relay with minimized response time of relay action upon being turned off 失效
标题翻译：常开固态继电器，在关闭时继电器动作的响应时间最小
公开(公告)号：US5278422A
公开(公告)日：1994-01-11
申请号：US935413
申请日：1992-08-26
申请人： Fumio Kato , Sigeo Akiyama , Masahiro Izumi , Noriteru Furumoto
发明人： Fumio Kato , Sigeo Akiyama , Masahiro Izumi , Noriteru Furumoto
IPC分类号： H03K17/0412 , H03K17/16 , H03K17/785 , G02B27/00 , H03K3/42
CPC分类号： H03K17/163 , H03K17/04123 , H03K17/785
摘要： A solid state relay circuit includes a MOSFET receiving a photovoltaic output generated across a photovoltaic diode array responsive to a light signal from a light emitting element, a control electrode of a normally ON type driving transistor made to be at a high impedance state by a voltage generated across an impedance element connected in series to the photovoltaic diode array upon application of the photovoltaic output across the gate and source of the MOSFET and at a low impedance state upon disappearance of the photovoltaic output is connected to a connecting point between the diode array and the impedance element, and the driving transistor is connected across the gate and source of the MOSFET with a resistor interposed. A falling gradient of output signal upon being turned OFF of the relay circuit is made thereby sufficiently gentle, and relay operation upon being turned OFF can be minimized in response time.
摘要翻译：固态继电器电路包括：MOSFET接收光电二极管阵列产生的光电输出，该光伏输出响应于来自发光元件的光信号，正常导通型驱动晶体管的控制电极被制成处于高阻抗状态的电压在跨越MOSFET的栅极和源极施加光伏输出并且在光伏输出消失时处于低阻抗状态的阻抗元件上串联连接到光伏二极管阵列的阻抗元件连接到二极管阵列和阻抗元件和驱动晶体管连接在MOSFET的栅极和源极之间，并插入电阻器。使继电器电路断开时的输出信号的下降斜率足够平缓，并且在关断时的继电器动作可以在响应时间内最小化。

23. 发明授权

US5181491A Intake system in multi-cylinder type internal combustion engine 失效
标题翻译：多缸式内燃机进气系统
公开(公告)号：US5181491A
公开(公告)日：1993-01-26
申请号：US842703
申请日：1992-02-27
申请人： Masahiro Izumi , Toshiharu Aoshima , Yutaka Ide , Ritsuko Terawaki , Hideaki Hosoya
发明人： Masahiro Izumi , Toshiharu Aoshima , Yutaka Ide , Ritsuko Terawaki , Hideaki Hosoya
IPC分类号： F02B27/00 , F02B75/18 , F02D9/10 , F02M3/06 , F02M23/08 , F02M35/10 , F02M35/104 , F02M69/32
CPC分类号： F02M35/10183 , F02B27/005 , F02D9/1055 , F02D9/1095 , F02M23/08 , F02M3/06 , F02M35/10 , F02M35/10222 , F02M35/10255 , F02B2075/1812 , Y02T10/14 , Y02T10/146
摘要： An intake system in a multi-cylinder type internal combustion engine comprises throttle valves disposed in a plurality of intake passages commonly connected to an air cleaner, and fuel injection valves disposed in the intake passages downstream of the throttle valves in an intake direction. In such intake system, a plurality of funnel-shaped portions are provided in a throttle body having opposite ends directly coupled to an intake manifold and an air cleaner, respectively, and each of the throttle valves is disposed in the throttle body, so that its upstream end in the intake direction is located at least on the corresponding funnel-shaped portion, when the throttle valve is fully opened. The throttle body includes ports provided therein, which are opened into the intake passages between a coupled surface of the throttle body to the intake manifold and the throttle valves, respectively, and which communicate with one another. This provides an increase in space efficiency and an increase in intake inertial effect.
摘要翻译：多缸型内燃机中的进气系统包括设置在共同连接到空气滤清器的多个进气通道中的节流阀，以及设置在进气通道中的进气通道在进气方向下游的燃料喷射阀。在这种进气系统中，多个漏斗形部分分别设置在节气门体中，其相对的端部分别直接联接到进气歧管和空气滤清器，并且每个节流阀设置在节气门体中，使得其当节流阀完全打开时，进气方向的上游端至少位于相应的漏斗形部分上。节气门体包括设置在其中的端口，其分别在节气门本体与进气歧管的联接表面和节流阀之间的进气通道中打开并彼此连通。这提供了空间效率的增加和摄入惯性效应的增加。

24. 发明授权

US08894254B2 Luminaire and lamp apparatus housing 有权
标题翻译：灯具和灯具外壳
公开(公告)号：US08894254B2
公开(公告)日：2014-11-25
申请号：US13361791
申请日：2012-01-30
申请人： Ryotaro Matsuda , Jun Sasaki , Shigeru Osawa , Yuichiro Takahara , Hiromichi Nakajima , Kenji Takanashi , Keiichi Shimizu , Masahiro Izumi , Hiroshi Matsushita , Masahiro Toda , Junichi Kimiya , Hiroshi Takenaga , Takeshi Osada
发明人： Ryotaro Matsuda , Jun Sasaki , Shigeru Osawa , Yuichiro Takahara , Hiromichi Nakajima , Kenji Takanashi , Keiichi Shimizu , Masahiro Izumi , Hiroshi Matsushita , Masahiro Toda , Junichi Kimiya , Hiroshi Takenaga , Takeshi Osada
IPC分类号： F21V29/00 , F21V15/01 , F21K99/00 , F21V23/00 , F21V17/00 , F21S8/02 , F21V7/09 , F21V3/02 , F21Y101/02
CPC分类号： F21S2/005 , F21K9/20 , F21S8/026 , F21V3/02 , F21V7/09 , F21V15/01 , F21V17/002 , F21V23/006 , F21V23/009 , F21V29/004 , F21V29/713 , F21V29/773 , F21V29/85 , F21V29/89 , F21Y2115/10
摘要： According to one embodiment, a lamp apparatus includes a light-emitting module, housing, and a lighting circuit. The light-emitting module includes a light-emitting element. The housing opens in the direction of irradiation of a light beam and having a cap on a side opposite from the direction of irradiation of the light beam. The cap is provided with a light-emitting module mounting portion projecting in the direction of irradiation of the light beam and the light-emitting module is mounted on the light-emitting module mounting portion. The lighting circuit is accommodated in the housing.
摘要翻译：根据一个实施例，灯装置包括发光模块，壳体和照明电路。发光模块包括发光元件。壳体在照射光束的方向上开口，并且在与光束的照射方向相反的一侧具有盖。盖设有沿光束照射方向突出的发光模块安装部，发光模块安装在发光模块安装部上。照明电路容纳在壳体中。

25. 发明授权

US08569786B2 Light emitting device and illumination device 失效
标题翻译：发光装置及照明装置
公开(公告)号：US08569786B2
公开(公告)日：2013-10-29
申请号：US13105868
申请日：2011-05-11
申请人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
发明人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
IPC分类号： H01L33/62
CPC分类号： F21S8/086 , F21K9/23 , F21V23/06 , F21W2131/103 , F21Y2115/10 , H01R12/515
摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.
摘要翻译：根据一个实施例，发光器件包括衬底，发光元件和连接器。基板具有表面和背面，并且在表面上形成电源端子。发光元件安装在基板的表面上。连接器包括与基板的表面侧上的电源端子接触的接触部分和具有在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到电线连接器端子的连接部分。

26. 发明授权

US08558272B2 Illumination apparatus having a plurality of semiconductor light-emitting devices 有权
标题翻译：具有多个半导体发光装置的照明装置
公开(公告)号：US08558272B2
公开(公告)日：2013-10-15
申请号：US13184320
申请日：2011-07-15
申请人： Tomohiro Sanpei , Masahiro Izumi , Shinji Nogi , Akiko Saito
发明人： Tomohiro Sanpei , Masahiro Izumi , Shinji Nogi , Akiko Saito
IPC分类号： H01L33/00
CPC分类号： F21V31/04 , F21K9/68 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H01L33/483 , H01L2224/48091 , H01L2224/4911 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014
摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.
摘要翻译：照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。反射层的间隔尺寸设置有半导体发光元件。导体部分设置在反射层上，电连接到半导体发光器件。粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

27. 发明授权

US08398267B2 Illumination device with semiconductor light-emitting elements 失效
标题翻译：具有半导体发光元件的照明装置
公开(公告)号：US08398267B2
公开(公告)日：2013-03-19
申请号：US13449513
申请日：2012-04-18
申请人： Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda
发明人： Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda
IPC分类号： F21V7/22
CPC分类号： H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译：照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。基板包括表面和突出部分。突起部形成为从其端部朝向基板的表面逐渐变厚。绝缘体形成在表面上。导体形成在绝缘体上。半导体发光元件安装在突出部分上。半导体发光元件通过连接构件电连接到导体。密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

28. 发明申请

US20110303927A1 LIGHT EMITTING MODULE AND ILLUMINATION APPARATUS 失效
标题翻译：发光模块和照明装置
公开(公告)号：US20110303927A1
公开(公告)日：2011-12-15
申请号：US13202689
申请日：2010-02-26
申请人： Tomohiro Sanpei , Kiyoshi Otani , Masahiro Izumi , Junya Murata , Akiko Saito , Yumiko Hayashida
发明人： Tomohiro Sanpei , Kiyoshi Otani , Masahiro Izumi , Junya Murata , Akiko Saito , Yumiko Hayashida
IPC分类号： H01L33/60
CPC分类号： F21V29/70 , F21K9/00 , F21V29/75 , F21V29/76 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A light emitting module (1) comprises a module substrate (2), a light emitting diode string (31), and a sealing member (48). The light emitting diode string (31) includes light emitting diode elements (32) and bonding wires (37) which connect the light emitting diode elements (32). The light emitting diode element (32) has a pair of element electrodes (33, 34) and has a rectangular shape extending in a direction along which the element electrodes (33, 34) are aligned. The sealing member (48) is laminated on the module substrate (2) to seal the light emitting diode string (31). The light emitting diode elements (32) are arranged at intervals in a direction crossing the direction along which the element electrodes (33, 34) are aligned, and the element electrodes (33, 34) with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements (32) between the light emitting diode elements (32) adjacent to each other. Each bonding wire (37) is obliquely wired with respect to the arrangement direction of the light emitting diode elements (32) to connect the element electrodes (33, 34) with different polarities of the light emitting diode elements (32) adjacent to each other.
摘要翻译：发光模块（1）包括模块基板（2），发光二极管串（31）和密封构件（48）。发光二极管串（31）包括连接发光二极管元件（32）的发光二极管元件（32）和接合线（37）。发光二极管元件（32）具有一对元件电极（33,34），并且具有在元件电极（33,34）对齐的方向上延伸的矩形形状。密封构件（48）层压在模块基板（2）上以密封发光二极管串（31）。发光二极管元件（32）沿与元件电极（33,34）对准的方向交叉的方向间隔配置，具有相同极性的元件电极（33,34）在彼此相邻的发光二极管元件（32）之间的发光二极管元件（32）的布置方向上彼此相对。每个接合线（37）相对于发光二极管元件（32）的布置方向倾斜地连接，以将彼此相邻的发光二极管元件（32）的不同极性的元件电极（33,34）连接。

29. 发明申请

US20110278632A1 LIGHT EMITTING DEVICE AND ILLUMINATION DEVICE 失效
标题翻译：发光装置和照明装置
公开(公告)号：US20110278632A1
公开(公告)日：2011-11-17
申请号：US13105868
申请日：2011-05-11
申请人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
发明人： Haruki Takei , Seiko Kawashima , Masahiro Izumi , Akiko Saito , Yusuke Shibahara , Tsuyoshi Oyaizu
IPC分类号： H01L33/62
CPC分类号： F21S8/086 , F21K9/23 , F21V23/06 , F21W2131/103 , F21Y2115/10 , H01R12/515
摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with, the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.
摘要翻译：根据一个实施例，发光器件包括衬底，发光元件和连接器。基板具有表面和背面，并且在表面上形成电源端子。发光元件安装在基板的表面上。连接器包括与基板表面侧的电源端子接触的接触部分和在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到连接器端子的导线连接部分。

30. 发明申请

US20110273880A1 ILLUMINATION APPARATUS HAVING A PLURALITY OF SEMICONDUCTOR LIGHT-EMITTING DEVICES 有权
标题翻译：具有多个半导体发光装置的照明装置
公开(公告)号：US20110273880A1
公开(公告)日：2011-11-10
申请号：US13184320
申请日：2011-07-15
申请人： Tomohiro Sanpei , Masahiro Izumi , Shinji Nogi , Akiko Saito
发明人： Tomohiro Sanpei , Masahiro Izumi , Shinji Nogi , Akiko Saito
IPC分类号： F21V7/00
CPC分类号： F21V31/04 , F21K9/68 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H01L33/483 , H01L2224/48091 , H01L2224/4911 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014
摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.
摘要翻译：照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。反射层的间隔尺寸设置有半导体发光元件。导体部分设置在反射层上，电连接到半导体发光器件。粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

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