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    • 21. 发明申请
    • IMAGE DISPLAY DEVICE, IMAGE DISPLAY SYSTEM, AND METHODS FOR FABRICATING THE SAME
    • 图像显示装置,图像显示系统及其制造方法
    • US20100133998A1
    • 2010-06-03
    • US12628084
    • 2009-11-30
    • Ryuji NishikawaHsiang-Lun HSU
    • Ryuji NishikawaHsiang-Lun HSU
    • H01J1/62H01L33/36
    • H05B33/22H01L51/5268H05B33/28
    • A display device including a display panel is provided, including a substrate having a luminance region and a none-luminance region thereover. An interlayer dielectric layer is disposed over the substrate. A reflection layer is disposed over the interlayer dielectric layer in the luminance region. A planarization layer is disposed over the reflection layer, having a rugged top surface corresponding to the reflection layer. A first electrode is disposed over the planarization layer, having a rugged top surface corresponding to the reflection layer. A pixel defining layer is disposed over the planarization layer, exposing the rugged top surface of the first electrode and defining the luminance region. An electroluminescent layer and a second electrode are sequentially stacked over the first electrode.
    • 提供了一种包括显示面板的显示装置,包括具有亮度区域和非亮度区域的基板。 层间电介质层设置在衬底上。 在亮度区域中的层间电介质层上设置反射层。 平坦化层设置在反射层上,具有对应于反射层的粗糙的顶表面。 第一电极设置在平坦化层之上,具有与反射层相对应的粗糙的顶表面。 像素限定层设置在平坦化层之上,暴露第一电极的粗糙的顶表面并限定亮度区域。 电致发光层和第二电极依次层叠在第一电极上。
    • 22. 发明授权
    • Display panel manufacturing method and display panel
    • 显示面板制造方法和显示面板
    • US07572162B2
    • 2009-08-11
    • US10586821
    • 2005-06-13
    • Tetsuji OmuraRyuji Nishikawa
    • Tetsuji OmuraRyuji Nishikawa
    • H01J9/00
    • H01L51/5246
    • A frame-shaped groove is formed on a panel adhering part of a sealing board, a paste including low melting point glass powder is buried in the groove, and a frame-shaped glass paste layer is formed. A solvent included in the glass paste layer is volatilized for solidification, and a low melting point glass frame is provided. Then, the low melting point glass frame protruded on the surface of the sealing board is removed, and the surface of a plane including the surface of the adhering part of the sealing board is flattened. A low heat resistant layer is formed on the flattened adhering plane of the sealing board. The sealing board is arranged to face an element board at a prescribed interval, laser beams are applied on the low melting point glass frame through the element board, and the area is heated. Thus, the low melting point glass rises, and the sealing board is welded with the element board.
    • 在密封板的面板粘接部上形成框状的槽,将含有低熔点玻璃粉末的糊料埋入槽内,形成框状的玻璃浆料层。 包含在玻璃浆料层中的溶剂挥发以固化,并且提供低熔点玻璃框架。 然后,去除在密封板表面上突出的低熔点玻璃框架,使包含密封板的粘合部分的表面的平面的表面变平。 在密封板的平坦化粘合面上形成低耐热层。 密封板配置成以规定的间隔与元件板对置,激光束通过元件板施加在低熔点玻璃框架上,并且该区域被加热。 因此,低熔点玻璃升高,密封板与元件板焊接。