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21. 发明申请

US20060057747A1 Reloading of die carriers without removal of die carriers from sockets on test boards 有权
标题翻译：重新加载模具载体，而不需要从测试板上的插座中取出模具
公开(公告)号：US20060057747A1
公开(公告)日：2006-03-16
申请号：US10940288
申请日：2004-09-13
申请人： Martin Hemmerling , Seang Malathong
发明人： Martin Hemmerling , Seang Malathong
IPC分类号： H01L21/66
CPC分类号： G01R1/0483 , G01R1/0408
摘要： A method of testing microelectronic dies is described. A respective set of dies is inserted into die carrier bodies releasably held within a set of sockets secured to a burn-in board. A set of die carrier covers is closed, each die carrier cover being secured to a respective die carrier body and closing over a respective die. The burn-in board is then inserted into a burn-in oven. Burn-in testing of the dies is then carried out while in the burn-in oven. The burn-in board is then removed from the oven. The die carrier covers are then opened. The dies are removed from the die carrier bodies without removing the die carrier bodies from the sockets. The process is then repeated with subsequent sets of dies.
摘要翻译：描述了测试微电子管芯的方法。相应的一组模具插入到可释放地保持在固定到老化板的一组插座内的模具载体中。一组模具托架盖关闭，每个模具托架盖固定到相应的模具托架主体并在相应的模具上封闭。然后将老化板插入老化炉。然后在老化炉中进行模具的老化测试。然后将老化板从烤箱中取出。然后打开模具托架盖。将模具从模具载体主体上移除，而不将模具载体主体从插座中取出。然后，随后的模具组重复该过程。

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