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21. 发明授权

US06190530B1 Anode container, electroplating system, method and plated object 失效
标题翻译：阳极容器，电镀系统，方法和电镀对象
公开(公告)号：US06190530B1
公开(公告)日：2001-02-20
申请号：US09291135
申请日：1999-04-12
申请人： William Louis Brodsky , Donald W. Henderson , Lawrence Philip Lehman
发明人： William Louis Brodsky , Donald W. Henderson , Lawrence Philip Lehman
IPC分类号： C25D500
CPC分类号： C25D5/20 , C25D17/12
摘要： An anode container, electroplating system, method and object so plated. A feature of the invention is that an anode container has an interior cross-sectional area, at or near a lower end thereof, that is larger than an interior cross-sectional area of an upper end thereof. An anode-receiving container also has a body with a plurality of sides and a lower end having a larger cross-sectional interior area than an upper end. The container may also include punched out apertures positioned to provide strength to the container and an apparatus to vibrate the container coupled to a lower end of the container.
摘要翻译：阳极容器，电镀系统，电镀方法和物体。本发明的一个特征是阳极容器在其下端处或其附近具有大于其上端的内部横截面积的内部横截面积。阳极容纳容器还具有多个侧面的本体和具有比上端更大的横截面内部面积的下端。容器还可以包括定位成为容器提供强度的冲孔，以及用于使与容器的下端相连的容器振动的装置。

22. 发明授权

US06217671B1 Composition for increasing activity of a no-clean flux 有权
标题翻译：用于增加免清洁助焊剂活性的组合物
公开(公告)号：US06217671B1
公开(公告)日：2001-04-17
申请号：US09461557
申请日：1999-12-14
申请人： Donald W. Henderson , James Spalik
发明人： Donald W. Henderson , James Spalik
IPC分类号： B23K35362
CPC分类号： B23K35/3618 , B23K35/3612 , B23K35/3617 , H05K3/3489
摘要： An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.
摘要翻译：用于焊接的活性不清洁助焊剂组合物包括在约2重量％至约4重量％范围内的二羧酸，有机溶剂和乙酸。

23. 发明授权

US06921015B2 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder 失效
标题翻译：倒装芯片器件的焊接保护涂层和无焊接接合在具有电镀焊料的层压板上
公开(公告)号：US06921015B2
公开(公告)日：2005-07-26
申请号：US10417690
申请日：2003-04-17
申请人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
发明人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
IPC分类号： B23K35/22 , C23C8/00 , C23C26/00 , H01L21/60 , H05K3/28 , H05K3/34 , B23K31/02
CPC分类号： H01L24/81 , B23K35/226 , C23C8/00 , C23C26/00 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/014 , H05K3/282 , H05K3/3457
摘要： A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
摘要翻译：提供了一种用于保护氧化锡涂覆的焊料表面以防止进一步氧化的方法以及这种表面的无焊剂焊料接合的方法。

24. 发明授权

US06550667B2 Flux composition and soldering method for high density arrays 有权
标题翻译：高密度阵列的焊剂组成和焊接方法
公开(公告)号：US06550667B2
公开(公告)日：2003-04-22
申请号：US09726697
申请日：2000-11-29
申请人： William E. Bernier , Donald W. Henderson , James Spalik
发明人： William E. Bernier , Donald W. Henderson , James Spalik
IPC分类号： B23K35362
CPC分类号： B23K35/3618 , B23K35/3612 , B23K35/3617 , H05K3/3489
摘要： A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1. A method for using the inventive composition to solder high density arrays which, for eutectic lead/tin solder, involves heating at extended dwell times and high temperature relative to typical compositions.
摘要翻译：适用于高密度阵列的单相通量组合物，其包含足以与高密度阵列中的氧化表面积反应的二羧酸，第一有机溶剂和具有较高蒸发温度的第二有机溶剂比所述第一有机溶剂的。优选的二羧酸是己二酸，庚二酸，辛二酸，壬二酸和癸二酸。优选地，组合物包含大于6％的二羧酸，更优选大于6％至约15％，甚至更优选约8％至约10％的二羧酸。第一有机溶剂的优选量为约25重量％至约75重量％，优选的第二有机溶剂的量为约10重量％至约35重量％。优选地，第一有机溶剂与第二有机溶剂的比例为约3:1。使用本发明组合物来焊接高密度阵列的方法，对于共晶铅/锡焊料，其涉及相对于典型组合物在延长的停留时间和高温下加热。

25. 发明授权

US06305258B1 Punch actuator monitoring system and method 失效
公开(公告)号：US06305258B1
公开(公告)日：2001-10-23
申请号：US09025601
申请日：1998-02-18
申请人： Donald W. Henderson , Edward F. Helinski
发明人： Donald W. Henderson , Edward F. Helinski
IPC分类号： B26D100
CPC分类号： G05B19/44 , B26D5/00 , B26D7/08 , B26F1/02 , B26F2210/08 , H05K3/005 , Y10T83/04 , Y10T83/089 , Y10T83/141 , Y10T83/152 , Y10T83/173 , Y10T83/8765 , Y10T83/9425 , Y10T83/9428 , Y10T83/943
摘要： A method and apparatus for detecting performance of an apparatus for punching holes in a substrate, ensuring hole quality and/or minimizing or eliminating damage to the films during the hole punching process.

26. 发明授权

US4534827A Cutting implement and method of making same 失效
标题翻译：切割工具及其制作方法
公开(公告)号：US4534827A
公开(公告)日：1985-08-13
申请号：US527165
申请日：1983-08-26
申请人： Donald W. Henderson
发明人： Donald W. Henderson
IPC分类号： A61B17/3211 , A61B17/32 , A61F2/00 , B23P15/40 , B24B3/36 , B26B9/00 , B26B21/58 , C23F1/00 , C23F1/06
CPC分类号： A61B17/3211 , B26B21/58 , A61F2002/30084
摘要： A cutting tool, preferably in the form of a scalpel, microtome or razor blade is fabricated from single crystal material such as aluminum oxide with a preferential etching process to produce a radius of curvature less than 100 Angstroms on the edge. Depending upon the etchant, the crystallographic orientation of the blank and the resulting different etch rates on blade surfaces, the preferential etching process not only sharpens a preformed edge but also, in one embodiment, produces an opposing edge which meets the sharpened edge at a point, thereby to produce a particularly efficient scalpel blade configuration having two cutting edges converging at a point for plunging and cutting. With respect to the sharpening of the cutting edge, consistent with all other blade forming requirements, the subject blade is made to a maximum sharpness by utilizing a maximum ratio of bevel plane etch rate to edge plane etch rate. This maximum ratio maximizes the edge sharpness when a steady state etching geometry has been achieved. In one embodiment, and for a given edge sharpness, blade drag is minimized by selecting the crystallographic orientation and etchant such that the etchant chemically polishes the bevels and maintains the planarity of the bevel planes. In order to achieve identical etching of the bevels meeting at the blade edge and thus maintain original blade geometry, the blank can be oriented such that the edge forming planes are crystallographically identical planes.
摘要翻译：优选以手术刀，切片机或剃刀刀片形式的切割工具由诸如氧化铝的单晶材料制成，具有优先蚀刻工艺，以在边缘上产生小于100埃的曲率半径。取决于蚀刻剂，坯料的晶体取向和叶片表面上产生的不同蚀刻速率，优选的蚀刻工艺不仅可以锐化预成型的边缘，而且在一个实施例中，还产生一个相对的边缘，其在一个点处与锋利的边缘相遇从而产生特别有效的手术刀刀片构造，其具有两个切削刃在一个点处会聚，用于切入和切割。关于切削刃的磨削，与所有其他刀片成形要求一致，通过利用斜面平面蚀刻速率与边缘平面蚀刻速率的最大比率使主体刀片达到最大锐度。当达到稳态蚀刻几何形状时，该最大比率使边缘锐度最大化。在一个实施例中，并且对于给定的边缘清晰度，通过选择晶体取向和蚀刻剂使刀片阻力最小化，使得蚀刻剂化学抛光斜面并保持斜面的平面度。为了实现在叶片边缘处相遇的斜面的相同蚀刻，从而保持原始叶片几何形状，坯料可以被定向成使得边缘形成平面在晶体学上是相同的平面。

27. 发明授权

US06686664B2 Structure to accommodate increase in volume expansion during solder reflow 有权
标题翻译：结构以适应焊料回流期间体积膨胀的增加
公开(公告)号：US06686664B2
公开(公告)日：2004-02-03
申请号：US09845448
申请日：2001-04-30
申请人： David Vincent Caletka , Krishna Darbha , Donald W. Henderson , Lawrence P. Lehman , George Henry Thiel
发明人： David Vincent Caletka , Krishna Darbha , Donald W. Henderson , Lawrence P. Lehman , George Henry Thiel
IPC分类号： H01L2348
CPC分类号： H01L23/49811 , B23K3/0623 , B23K2101/40 , H01L21/563 , H01L23/13 , H01L23/49838 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05017 , H01L2224/05026 , H01L2224/05078 , H01L2224/05551 , H01L2224/05568 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/8121 , H01L2224/81385 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/113 , H05K3/284 , H05K3/3436 , H05K2201/0116 , H05K2201/0133 , H05K2201/0382 , H05K2201/068 , H05K2201/09036 , H05K2201/09509 , H05K2201/0969 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171 , H01L2924/00011 , H01L2924/00 , H01L2224/29099 , H01L2224/05552
摘要： Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.
摘要翻译：诸如低熔点C4焊球的焊球在回流期间经历体积膨胀。当焊球被封装时，膨胀压力可能会损坏器件的完整性。每个焊球下方的半导体芯片基板中的体积扩展区容纳体积膨胀。可以使用气垫缓冲图，可变形材料和不可润湿的表面，以允许在冷却期间焊料返回到其原始位置。也可以使用具有足以适应膨胀的空隙的多孔介质。

28. 发明授权

US06649833B1 Negative volume expansion lead-free electrical connection 有权
标题翻译：负容积扩展无铅电气连接
公开(公告)号：US06649833B1
公开(公告)日：2003-11-18
申请号：US10215451
申请日：2002-08-09
申请人： David V. Caletka , Krishna Darbha , Donald W. Henderson , Lawrence P. Lehman , George H. Thiel
发明人： David V. Caletka , Krishna Darbha , Donald W. Henderson , Lawrence P. Lehman , George H. Thiel
IPC分类号： H05L2328
CPC分类号： C22C13/02 , B23K35/26 , B23K35/264 , C22C12/00 , H01L21/563 , H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/73203 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/284 , H05K3/3436 , H05K3/3463 , H05K2201/10977 , Y02P70/613 , H01L2924/01083 , H01L2924/00014 , H01L2924/01031 , H01L2924/00
摘要： An electronic package is provided including a substrate, a device mounted on the substrate, and a solder member electrically coupling the device to the substrate. The package includes a dielectric material positioned substantially around the solder member which forms a physical connection between the substrate and the device. The volume of the solder member contracts during melting thereof to prevent failure of the physical connection and/or the electrical coupling between the substrate and the device.
摘要翻译：提供了一种电子封装，包括基板，安装在基板上的装置以及将该装置电耦合到基板的焊料构件。封装包括基本上围绕焊料部件定位的电介质材料，其形成衬底和器件之间的物理连接。在熔化期间焊料的体积收缩以防止物理连接和/或基板与装置之间的电耦合的故障。

29. 发明授权

US06598505B2 Punch actuator monitoring system and method 失效
标题翻译：打孔执行器监控系统及方法
公开(公告)号：US06598505B2
公开(公告)日：2003-07-29
申请号：US09792011
申请日：2001-02-23
申请人： Donald W. Henderson , Edward F. Helinski
发明人： Donald W. Henderson , Edward F. Helinski
IPC分类号： B26D100
CPC分类号： G05B19/44 , B26D5/00 , B26D7/08 , B26F1/02 , B26F2210/08 , H05K3/005 , Y10T83/04 , Y10T83/089 , Y10T83/141 , Y10T83/152 , Y10T83/173 , Y10T83/8765 , Y10T83/9425 , Y10T83/9428 , Y10T83/943
摘要： A method and apparatus for detecting performance of an apparatus for punching holes in a substrate, ensuring hole quality and/or minimizing or eliminating damage to the films during the hole punching process.
摘要翻译：一种用于检测用于在基板中冲孔的装置的性能的方法和装置，确保孔质量和/或最小化或消除在打孔过程中对膜的损坏。

30. 发明授权

US06585150B1 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder 失效
标题翻译：倒装芯片器件的焊接保护涂层和无焊接接合在具有电镀焊料的层压板上
公开(公告)号：US06585150B1
公开(公告)日：2003-07-01
申请号：US09687524
申请日：2000-10-12
申请人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
发明人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
IPC分类号： B23K3102
CPC分类号： H01L24/81 , B23K35/226 , C23C8/00 , C23C26/00 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/014 , H05K3/282 , H05K3/3457
摘要： A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
摘要翻译：提供了一种用于保护氧化锡涂覆的焊料表面以防止进一步氧化的方法以及这种表面的无焊剂焊料接合的方法。

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