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21. 发明授权

US07586529B2 Solid-state imaging device 有权
标题翻译：固态成像装置
公开(公告)号：US07586529B2
公开(公告)日：2009-09-08
申请号：US10969822
申请日：2004-10-21
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H04N3/14 , H01J40/14 , H01L21/00 , H04N5/225
CPC分类号： H01L27/14618 , H01L24/32 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.
摘要翻译：固态成像装置包括基部，设置在基部上并形成内部空间的框状肋，多个布线构件，用于将由基部和肋形成的壳体的内部空间电引导到外部部分，固定在内部空间内的基座的成像元件，固定到肋的上表面的透明板，以及将成像元件的电极电连接到布线构件的连接构件，其中在区域中设置多个突起面向成像元件的基部，并且成像元件通过粘合剂固定到基部，同时由突起支撑。突起使得成像元件能够避免由于跟随基底的表面引起的变形，从而抑制对成像元件的电性能的影响。

22. 发明申请

US20080194055A1 Solid-state imaging device and method for manufacturing the same 失效
公开(公告)号：US20080194055A1
公开(公告)日：2008-08-14
申请号：US12080557
申请日：2008-04-03
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L31/0203 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space of the housing and an external terminal portion exposed at an outer portion of the housing; an imaging element arranged on the base in the internal space of the housing; connecting members connecting electrodes of the imaging element to the internal terminal portions of the metal lead pieces; and a transparent plate fastened to an upper face of the ribs. The upper face of the ribs is provided with a lower step portion that is lowered along an external periphery, and the transparent plate is fastened to the upper face of the ribs by an adhesive filled at least into the lower step portion. The joint between the ribs and the transparent plate has a cushioning effect with respect to stress caused by thermal deformation and the like, improving durability.

23. 发明授权

US07367120B2 Method for producing a solid-state imaging device 有权
标题翻译：固态成像装置的制造方法
公开(公告)号：US07367120B2
公开(公告)日：2008-05-06
申请号：US11599125
申请日：2006-11-14
申请人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
发明人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
IPC分类号： H01K3/22
CPC分类号： H01L27/14618 , H01L2224/16225 , H01L2924/00014 , Y10T29/49121 , Y10T29/49158 , Y10T29/49167 , Y10T29/49176 , Y10T29/49204 , Y10T29/4922 , H01L2224/0401
摘要： A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.
摘要翻译：一种制造固态成像装置的方法。多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接与成像元件的电极电连接。所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述基础。通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

24. 发明授权

US07202469B2 Solid-state imaging device with molded resin ribs and method of manufacturing 有权
标题翻译：具有模制树脂肋的固态成像装置和制造方法
公开(公告)号：US07202469B2
公开(公告)日：2007-04-10
申请号：US10970533
申请日：2004-10-21
申请人： Masanori Minamio , Kouichi Yamauchi , Katsutoshi Shimizu
发明人： Masanori Minamio , Kouichi Yamauchi , Katsutoshi Shimizu
IPC分类号： H01J40/14
CPC分类号： H01L27/14683 , H01L27/14618 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members which connect electrodes of the imaging element and the wiring members. The ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. The package is configured without adhesive interposed between the ribs and the transparent sealing plate, thereby reducing the effect on incident light.
摘要翻译：一种固态成像装置，包括由绝缘树脂构成的布线基板，配置在布线基板上的框状的肋，配置在肋的上表面的透明板，从内部空间由布线板和肋构成的壳体的外部，固定在内部空间内的配线基板上的摄像元件和连接摄像元件的电极和配线构件的连接构件。肋通过树脂成型直接形成在透明板的表面上，并且肋的下表面用粘合剂固定到布线板。该封装被构造成没有粘合剂插入在肋和透明密封板之间，从而减少对入射光的影响。

25. 发明申请

US20070069319A1 Solid-state imaging device and method for producing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20070069319A1
公开(公告)日：2007-03-29
申请号：US11599125
申请日：2006-11-14
申请人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
发明人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
IPC分类号： H01L31/0203 , H01K3/22 , H01R43/00
CPC分类号： H01L27/14618 , H01L2224/16225 , H01L2924/00014 , Y10T29/49121 , Y10T29/49158 , Y10T29/49167 , Y10T29/49176 , Y10T29/49204 , Y10T29/4922 , H01L2224/0401
摘要： A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.
摘要翻译：一种固态成像装置，包括：由绝缘材料制成的底座，具有平面形状的框架形状，其内部形成有孔; 多个布线设置在基座的一个表面上，并沿着孔径从基座的外周延伸; 以及安装在基座表面上的成像元件，其上设置有布线，使得成像元件的光接收区域面向孔。多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接与成像元件的电极电连接。所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述基础。通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

26. 发明申请

US20050001219A1 Solid-state imaging device and method for manufacturing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20050001219A1
公开(公告)日：2005-01-06
申请号：US10876839
申请日：2004-06-25
申请人： Masanori Minamio , Kouichi Yamauchi , Kenichi Nishiyama , Kiyokazu Itoi
发明人： Masanori Minamio , Kouichi Yamauchi , Kenichi Nishiyama , Kiyokazu Itoi
IPC分类号： H01L27/14 , H01L23/02 , H01L23/08 , H01L31/02 , H01L31/0203 , H04N5/335 , H04N5/372 , H01L27/15
CPC分类号： H01L27/14618 , H01L24/97 , H01L31/02002 , H01L31/0203 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/07802 , H01L2924/15151 , H01L2924/16195 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device includes a housing having a resin-molded base and ribs; metal lead pieces embedded in the housing, the metal lead pieces each having an inner terminal portion facing an inner space of the housing, an outer terminal portion exposed at a bottom surface of the housing, and a lateral electrode portion exposed at an outer lateral surface of the housing; an imaging element fixed on the base in the inner space; connecting members connecting electrodes of the imaging element respectively to the inner terminal portions; and a transparent plate fixed to an upper surface of the ribs. The die pad having a through hole is embedded in a center portion of the base so that the die pad's upper and lower surfaces are exposed, and the imaging element is fixed on the die pad. A ventilation hole to the inner space of the housing that is formed in one piece with a resin can be formed easily with a simple configuration.
摘要翻译：固态成像装置包括具有树脂模制基座和肋条的外壳; 嵌入壳体中的金属引线片，金属引线片各自具有面向壳体的内部空间的内部端子部分，暴露在壳体的底部表面的外部端子部分和暴露在外侧表面的侧面电极部分的住房; 固定在所述内部空间中的基座上的成像元件; 连接构件将摄像元件的电极分别连接到内端子部分; 以及固定到肋的上表面的透明板。具有通孔的管芯焊盘嵌入基座的中心部分，使得裸片焊盘的上表面和下表面露出，并将成像元件固定在芯片焊盘上。能够以简单的结构容易地形成到与树脂一体形成的壳体的内部空间的通气孔。

27. 发明授权

US5285240A Image forming machine comprising three separable frames with opening/closing mechanisms between each frame 失效
标题翻译：图像形成机包括在每个框架之间具有开/关机构的三个可分离的框架
公开(公告)号：US5285240A
公开(公告)日：1994-02-08
申请号：US885487
申请日：1992-05-19
申请人： Yoshiya Kinoshita , Kouichi Yamauchi
发明人： Yoshiya Kinoshita , Kouichi Yamauchi
IPC分类号： G03G15/00 , G03G21/16
CPC分类号： G03G21/1647 , G03G21/1628 , G03G2221/1639 , G03G2221/1651 , G03G2221/1654 , G03G2221/1675 , G03G2221/18
摘要： Opening/closing mechanisms for an image formation apparatus is provided to facilitate operations for exchange of, e.g., a fixing unit and paper jam. To exchange the fixing unit, a releasing lever 99a allows a pressing strip 55 to pivot a contact maker 67 of the first opening/closing mechanism X1 and pivot a pivoting member 65. Thus, a contact pad 71 can release an upper coupling strip 61 from a pin 62 of an intermediate frame 23, and an upper frame 24 can be independently opened. To remove a jammed paper, a switch lever 103b allows the pressing strip 55 to move horizontally. Thereafter, the pressing strip 55 is contacted with a lower releasing strip 54 of the second opening/closing mechanism X2 in response to operation of the releasing lever 99a. Thus, an engaging member 83 is released from a pin 81 of a lower frame 21 so that the upper frame 24 is released from the intermediate frame 23. Further, the contact maker 67 of the first opening/closing mechanism X1 is lowered by a spring 74, and transferred below a movement locus of the pressing strip 55. Therefore, the intermediate frame 23 never drops even if the releasing lever 99a is operated.
摘要翻译：提供用于图像形成装置的打开/关闭机构，以便于更换例如定影单元和卡纸的操作。为了更换固定单元，释放杆99a允许按压带55枢转第一打开/关闭机构X1的接触器67并枢转枢转构件65.因此，接触垫71可以将上部联接带61从可以独立地打开中间框架23的销62和上框架24。为了去除卡住的纸张，开关杆103b允许按压带55水平移动。此后，响应于释放杆99a的操作，按压条55与第二打开/关闭机构X2的下释放条54接触。因此，接合构件83从下框架21的销81释放，使得上框架24从中间框架23释放。此外，第一打开/关闭机构X1的接触器67由弹簧并且转移到按压条55的移动轨迹之下。因此，即使释放杠杆99a被操作，中间框架23也不会下降。

28. 发明授权

US07273765B2 Solid-state imaging device and method for producing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07273765B2
公开(公告)日：2007-09-25
申请号：US10676186
申请日：2003-09-30
申请人： Masanori Minamio , Kouichi Yamauchi
发明人： Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device includes: a planar substrate; an imaging element fixed onto the substrate; a rib provided on the substrate so as to surround the imaging element; a transparent plate fixed to a top face of the rib; a plurality of wirings for conducting electricity from inside of a package to outside of the same, the package being composed of the substrate, the rib and the transparent plate; and thin metal wires for connecting electrodes of the imaging element with the respective wirings. Each of the wirings includes: an internal electrode disposed on a surface with the imaging element mounted thereon; an external electrode disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode and an end face electrode disposed on an end face of the substrate, for connecting the internal electrode and the external electrode. An end face of the substrate, a side face of the rib and an end face of the transparent plate form a substantially coplanar surface. The structure of the substrate having an external terminal is simple, thus facilitating the miniaturization of the device.
摘要翻译：固态成像装置包括：平面基板; 固定在基板上的成像元件; 设置在所述基板上以围绕所述成像元件的肋; 固定到所述肋的顶面的透明板; 多个用于从封装内部向外部引导电力的布线，所述封装由所述基板，所述肋和所述透明板构成; 以及用于将成像元件的电极与各个配线连接的细金属线。每个布线包括：设置在其上安装有成像元件的表面上的内部电极; 设置在所述摄像元件安装面的背面和与所述内部电极对应的位置的外部电极和设置在所述基板的端面上的端面电极，用于连接所述内部电极和所述外部电极。基板的端面，肋的侧面和透明板的端面形成基本上共面的表面。具有外部端子的衬底的结构简单，从而有助于器件的小型化。

29. 发明授权

US07154156B2 Solid-state imaging device and method for producing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07154156B2
公开(公告)日：2006-12-26
申请号：US10676135
申请日：2003-09-30
申请人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
发明人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
IPC分类号： H01L27/14 , H01L31/00
CPC分类号： H01L27/14618 , H01L2224/16225 , H01L2924/00014 , Y10T29/49121 , Y10T29/49158 , Y10T29/49167 , Y10T29/49176 , Y10T29/49204 , Y10T29/4922 , H01L2224/0401
摘要： A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.
摘要翻译：一种固态成像装置，包括：由绝缘材料制成的底座，具有平面形状的框架形状，其内部形成有孔; 多个布线设置在基座的一个表面上，并沿着孔径从基座的外周延伸; 以及安装在基座表面上的成像元件，其上设置有布线，使得成像元件的光接收区域面向孔。多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接与成像元件的电极电连接。所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述基础。通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

30. 发明授权

US07138706B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07138706B2
公开(公告)日：2006-11-21
申请号：US10608295
申请日：2003-06-24
申请人： Yoshiyuki Arai , Takashi Yui , Yoshiaki Takeoka , Fumito Itou , Kouichi Yamauchi , Yasutake Yaguchi
发明人： Yoshiyuki Arai , Takashi Yui , Yoshiaki Takeoka , Fumito Itou , Kouichi Yamauchi , Yasutake Yaguchi
IPC分类号： H01L21/44
CPC分类号： H01L21/565 , H01L25/0652 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/731 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/92125 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/06568 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1815 , H01L2924/18161 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.
摘要翻译：提供具有优异的散热特性的半导体器件，其在安装在诸如蜂窝电话等的电子设备中时可以实现高可靠性及其制造方法。半导体器件包括基板，通过在其上顶层叠一个而安装在基板上的多个半导体芯片以及由密封树脂制成的封装树脂层。在多个半导体芯片中，作为最上半导体芯片的第一半导体芯片的表面安装有面向基板的电路，并且形成密封树脂层，使得至少第一半导体芯片与形成电路的表面相对，并且第一半导体芯片的一部分侧表面暴露于封装树脂层的外部。

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