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    • 22. 发明申请
    • Method For Forming Median Crack In Substrate And Apparatus For Forming Median Crack In Substrate
    • 在基材中形成中间裂纹的方法和在基材中形成中间裂纹的装置
    • US20080194079A1
    • 2008-08-14
    • US11572931
    • 2005-07-29
    • Koji YamamotoNoboru Hasaka
    • Koji YamamotoNoboru Hasaka
    • H01L21/301B23K26/08
    • C03B33/093B23K26/40B23K2103/50B28D1/221B28D5/0011
    • A method for forming a median crack and an apparatus for forming a median crack are provided, where the formation of a deep, straight median crack is possible, and an excellent broken surface of a brittle substrate can be gained as a result of breaking.In the method for forming a median crack in a brittle substrate, the brittle substrate is irradiated with a laser beam along a laser-scribe line to be formed with median cracks on the brittle substrate so as to be heated to a temperature that is no higher than its melting temperature, and thereby, a median crack is created along the laser-scribe line to be formed with median cracks and expanded starting from a notch that has been formed in the brittle substrate, and this method for forming a median crack in a brittle substrate is characterized in that high temperature portions that receive intense radiation from a laser beam, and low temperature portions that receive faint radiation from a laser beam are alternately formed along the laser-scribe line to be formed with median cracks.
    • 提供了形成中间裂纹的方法和形成中间裂纹的装置,其中可以形成深的直的中间裂纹,并且作为断裂的结果可以获得脆性基底的优异的破裂表面。 在脆性基板中形成中值裂纹的方法中,沿着激光划线对激光束照射脆性基板,在脆性基板上形成中等裂纹,加热至不高于 比其熔融温度高,从而沿着激光划线产生中间裂缝,以形成中间裂纹,并从形成在脆性基板中的切口开始膨胀,并且该方法用于形成中间裂纹 脆性基板的特征在于,接收来自激光束的强烈辐射的高温部分和从激光束接收微弱辐射的低温部分沿着激光划线交替地形成以形成中间裂纹。
    • 24. 发明申请
    • High frequency heating apparatus
    • 高频加热装置
    • US20070045305A1
    • 2007-03-01
    • US11393778
    • 2006-03-31
    • Takahide YamaguchiKoji Yamamoto
    • Takahide YamaguchiKoji Yamamoto
    • H05B6/64
    • H05B6/642H05B6/72
    • A high frequency heating apparatus of the present invention includes an inverter power supply for driving the high frequency generating device, a holding member for holding the inverter power supply and cooling fan for cooling down the inverter power supply. The holding member is provided with a holding portion for holding the inverter power supply and an air guide portion for guiding cooling air from the cooling fan toward the inverter power supply, and the air guide portion covers the inverter power supply and guides the cooling air in a manner that a semiconductor switching device and a high voltage transformer of the inverter power supply are primarily cooled down.
    • 本发明的高频加热装置包括用于驱动高频产生装置的逆变器电源,用于保持用于冷却逆变器电源的逆变器电源和冷却风扇的保持构件。 保持构件设置有用于保持逆变器电源的保持部和用于将冷却风从冷却风扇朝向逆变器电源引导的引导部,空气引导部覆盖逆变器电源并将冷却空气引导到 逆变器电源的半导体开关器件和高压变压器主要被冷却的方式。
    • 27. 发明授权
    • Surface acoustic wave device
    • 表面声波装置
    • US07034434B2
    • 2006-04-25
    • US10492134
    • 2003-05-28
    • Koji YamamotoMasashi OmuraKatsuhiro Ikada
    • Koji YamamotoMasashi OmuraKatsuhiro Ikada
    • H01L41/053
    • H03H9/059H01L24/97H01L2224/16225H01L2924/181H01L2924/18161H03H9/1085H03H9/6469H01L2924/00012
    • A surface acoustic wave device includes a sealing resin for sealing a gap between a surface acoustic wave element and a mounting board. The sealing resin is prevented from flowing so as to reach a vibrating portion of the surface acoustic wave element. In the surface acoustic wave device, a surface acoustic wave element is connected to a mounting board through bumps, the outer peripheral edge of the surface acoustic wave element is sealed by a sealing resin, and a vibration space is secured between the vibrating portion of the surface acoustic wave element and mounting board. In the surface acoustic wave element, an outer barrier enclosing the bumps and the vibrating portion and an inner barrier enclosing the vibrating portion are provided, the height of the outer barrier is lower than the total height of the height of the bumps and the height of electrode lands formed on the mounting board, and the height of the inner barrier is lower than the height of the bumps.
    • 表面声波装置包括用于密封表面声波元件和安装板之间的间隙的密封树脂。 防止密封树脂流动以到达表面声波元件的振动部分。 在声表面波装置中,表面声波元件通过凸块与安装板连接,弹性表面波元件的外周缘由密封树脂密封,振动空间被固定在 表面声波元件和安装板。 在表面声波元件中,设置包围凸块和振动部的外侧阻挡部以及包围振动部的内侧阻挡部,外侧阻挡部的高度低于突起高度的总高度, 形成在安装板上的电极焊盘,并且内阻挡件的高度低于凸块的高度。