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21. 发明授权

US4970107A Composite article comprising a copper element and a process for producing it 失效
标题翻译：包含铜元素的复合制品及其制造方法
公开(公告)号：US4970107A
公开(公告)日：1990-11-13
申请号：US383074
申请日：1989-07-21
申请人： Haruo Akahoshi , Kanji Murakami , Yoshihiro Suzuki , Akira Nagai , Kiyonori Kogawa , Akio Takahashi
发明人： Haruo Akahoshi , Kanji Murakami , Yoshihiro Suzuki , Akira Nagai , Kiyonori Kogawa , Akio Takahashi
IPC分类号： H01L21/3205 , H01L23/52 , H05K1/09 , H05K3/38 , H05K3/46
CPC分类号： H05K3/385 , H05K3/384 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1157 , H05K3/4611 , Y10S428/901 , Y10T156/10 , Y10T428/24917 , Y10T428/31 , Y10T428/31678
摘要： To make a composite article comprising a copper element and an adhesive material adhesively bonded to a surface thereof, the surface of the copper element is provided with knife-shaped elongate projections whose opposite flanks are at an average angle of less than 60.degree. to each other. The knife-shaped elongate projections may include rod-shaped projections much smaller than the knife-shaped projections projecting outwardly from the surface of the knife-shaped projections. The knife-shaped projections may be formed by electroless plating and the rod-shaped projections by oxidation and optionally reduction. Bonding strength is improved.

22. 发明授权

US5098971A Fluorine-containing thermosetting resin 失效
标题翻译：含氟热固性树脂
公开(公告)号：US5098971A
公开(公告)日：1992-03-24
申请号：US589605
申请日：1990-09-28
申请人： Akira Nagai , Shin Nishimura , Akio Takahashi , Masamichi Maruta , Akihiro Fukui
发明人： Akira Nagai , Shin Nishimura , Akio Takahashi , Masamichi Maruta , Akihiro Fukui
IPC分类号： C08F22/40 , C08F20/52 , C08F22/36 , C08F122/40 , C08G73/12
CPC分类号： C08G73/123 , C08F122/40
摘要： A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF.sub.3, C.sub.2 F.sub.5 or C.sub.3 F.sub.7. The resin is excellent in moldability, thermal resistance and electric properties, has a low dielectric constant, is hence suitable as a molding material and can be used for molding materials, wiring boards, layer insulation films of LSI, etc.
摘要翻译：通过使具有下式的双马来酰亚胺化合物（其中Rf是氟，CF 3，C 2 F 5或C 3 F 7）聚合得到具有三维交联结构的含氟热固性树脂。该树脂的成型性，耐热性和电性能优异，介电常数低，因此适合作为成型材料，可用于成型材料，线路板，LSI等的绝缘膜等。

23. 发明授权

US06423571B1 Method of making a semiconductor device having a stress relieving mechanism 有权
公开(公告)号：US06423571B1
公开(公告)日：2002-07-23
申请号：US09884378
申请日：2001-06-20
申请人： Masahiko Ogino , Akira Nagai , Shuji Eguchi , Toshiaki Ishii , Masanori Segawa , Haruo Akahoshi , Akio Takahashi , Takao Miwa , Naotaka Tanaka , Ichirou Anjou
发明人： Masahiko Ogino , Akira Nagai , Shuji Eguchi , Toshiaki Ishii , Masanori Segawa , Haruo Akahoshi , Akio Takahashi , Takao Miwa , Naotaka Tanaka , Ichirou Anjou
IPC分类号： H01L2144
摘要： A method of forming a semiconductor device having a multi-layered wiring structure that includes a conductor layer to be electrically connected to a packaging substrate, with the multi-layered wiring structure being provided on a circuit formation surface of a semiconductor chip. Ball-like terminals are formed, disposed in a grid array on the surface of the multi-layered wiring structure on the packaging substrate side. The multi-layered wiring structure is formed to include a buffer layer for relieving a thermal stress provided between the semiconductor chip and the packaging substrate, due to the packaging procedure. In the semiconductor device formed, the wiring distance is shorter than that of a conventional semiconductor device, so that an inductance component becomes smaller, to thereby increase signal speed. The distance between a ground layer and a power supply layer is shortened, to reduce noise produced upon operation, and also a thermal stress upon packaging is relieved by the buffer layer of the multi-layered wiring structure, resulting in improved connection reliability, and the number of terminals per unit can be increased, because of elimination of wire bonding. The buffer layer can be made of an elastomer, and can have a modulus of elasticity of 10 kg/mm2 or less.

24. 发明授权

US5565536A Polymerizable compouund, process for producing same and setting composition containing polymerizable compound 失效
标题翻译：可聚合组合物，其制备方法和含可聚合化合物的组合物
公开(公告)号：US5565536A
公开(公告)日：1996-10-15
申请号：US423344
申请日：1995-04-18
申请人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
发明人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
IPC分类号： C07D207/44 , C07D207/444 , C07D207/452 , C07D207/456 , C08F12/26 , C08F22/36 , C08F22/40 , C08L33/24 , C08L35/00 , C08F122/40 , C08F114/18 , C08F128/02 , C08F130/08
CPC分类号： C07D207/452 , C07D207/444 , C07D207/456 , C08F12/26 , C08F22/40
摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is an unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.
摘要翻译：由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R 2和R 3的不饱和酰亚胺基，或其中R 2和R 3选自氢，低级烷基基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

25. 发明授权

US5410069A Polymerizable compound, process for producing same and setting composition containing polymerizable compound 失效
标题翻译：可聚合化合物，其制备方法和含可聚合化合物的组合物
公开(公告)号：US5410069A
公开(公告)日：1995-04-25
申请号：US986758
申请日：1992-12-08
申请人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
发明人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
IPC分类号： C07D207/44 , C07D207/444 , C07D207/452 , C07D207/456 , C08F12/26 , C08F22/36 , C08F22/40 , C08L33/24 , C08L35/00
CPC分类号： C07D207/452 , C07D207/444 , C07D207/456 , C08F12/26 , C08F22/40
摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is un unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.
摘要翻译：由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R2和R3的不饱和酰亚胺基，或其中R2和R3选自氢，低级烷基基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

26. 发明授权

US5352762A Multilayer printed circuit board and production thereof 失效
标题翻译：多层印刷电路板及其生产
公开(公告)号：US5352762A
公开(公告)日：1994-10-04
申请号：US676383
申请日：1991-03-28
申请人： Akira Nagai , Shin Nishimura , Masahiro Suzuki , Masao Suzuki , Junichi Katagiri , Akio Takahashi , Akio Mukoh
发明人： Akira Nagai , Shin Nishimura , Masahiro Suzuki , Masao Suzuki , Junichi Katagiri , Akio Takahashi , Akio Mukoh
IPC分类号： C08G12/32 , C08G18/30 , C08G18/38 , C08G59/40 , C08G73/06 , H01B3/30 , H01B3/44 , H01L23/12 , H05K1/03 , H05K3/46 , C08G83/00 , C08G73/12
CPC分类号： H05K3/4626 , H05K1/0346 , H05K1/034 , H05K2201/015 , Y10S428/901 , Y10T428/31504 , Y10T428/31551 , Y10T442/2213 , Y10T442/2713 , Y10T442/2738
摘要： A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.
摘要翻译：包括绝缘层的多个交替层叠层和具有6.0ns / m以下的信号传输延迟时间的电路导体层的多层印刷电路板，耐热性，粘合剂，阻燃性等优异，可以通过形成使用含氟热固性树脂组合物的绝缘层。

27. 发明授权

US08578592B2 Method of manufacturing laminated rotor core 有权
标题翻译：层叠转子铁心的制造方法
公开(公告)号：US08578592B2
公开(公告)日：2013-11-12
申请号：US13509190
申请日：2011-04-01
申请人： Akira Nagai , Mei Arazoe , Go Kato
发明人： Akira Nagai , Mei Arazoe , Go Kato
IPC分类号： H02K15/03 , H02K1/27
CPC分类号： H02K15/03 , H02K1/276
摘要： A method of manufacturing a laminated rotor core, includes a first process of placing segment dummy plates between an iron core and a die, each of each segment dummy plates covering one or more of plural magnet insertion portions and including a resin injection hole communicating to the one or more of the magnet insertion portions; a second process of injecting a resin from resin reservoir parts formed in any one of an upper die and a lower die holding the iron core through the resin injection hole of each segment dummy plate to the corresponding one or more of the magnet insertion portions; and a third process of detaching the segment dummy plates together with excess resin after the resin injected to the one or more of the magnet insertion portions is cured.
摘要翻译：一种叠层转子铁芯的制造方法，其特征在于，包括：在铁芯和模具之间配置分段虚拟板的第一工序，各个虚拟板各自覆盖多个磁体插入部的一个或多个，一个或多个磁体插入部分; 将形成在保持铁芯的上模和下模中的任一个中的树脂储存部分注入树脂的第二过程通过每个段虚拟板的树脂注入孔到相应的一个或多个磁体插入部分; 以及在注入到所述一个或多个所述磁体插入部分中的树脂被固化之后，将多个模板与多余的树脂一起分离的第三过程。

28. 发明授权

US08273457B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
公开(公告)号：US08273457B2
公开(公告)日：2012-09-25
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

29. 发明授权

US08044524B2 Adhesive for connection of circuit member and semiconductor device using the same 失效
标题翻译：用于连接电路元件和使用其的半导体器件的粘合剂
公开(公告)号：US08044524B2
公开(公告)日：2011-10-25
申请号：US12500114
申请日：2009-07-09
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L29/40 , H01L23/29
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

30. 发明申请

US20110247873A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION 有权
公开(公告)号：US20110247873A1
公开(公告)日：2011-10-13
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： H05K1/11 , H05K13/04 , B32B37/14 , B32B37/10 , B32B37/12
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

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