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    • 25. 发明授权
    • Process and heating device for melting semiconductor material
    • 用于熔化半导体材料的工艺和加热装置
    • US06171395B2
    • 2001-01-09
    • US09203266
    • 1998-12-01
    • Wilfried von AmmonErich TomzigPaul Fuchs
    • Wilfried von AmmonErich TomzigPaul Fuchs
    • C30B2814
    • C30B15/14C30B15/00C30B15/02Y10T117/10Y10T117/1016Y10T117/1068
    • The invention relates to a process for melting semiconductor material in a crucible which is located in a container, and is enclosed by a fixed heating device. The invention also relates to a heating device which is suitable for carrying out the process. The process is one wherein a heater of a displaceable heating device is lowered from a lock chamber above the container through an open shut-off valve into the container in the direction of the semiconductor material, and the semiconductor material is melted using the fixed heating device and the lowered heater. The heater is then raised back out of the container into the lock chamber after the semiconductor material has been melted. A door is provided in the lock chamber to allow the displaceable heater to be removed after the semiconductor material has been melted.
    • 本发明涉及一种在坩埚中熔化半导体材料的方法,该方法位于容器中,由固定的加热装置封闭。 本发明还涉及一种适用于进行该加工的加热装置。 该过程是其中可移动加热装置的加热器从容器上方的锁定室通过打开的截止阀沿着半导体材料的方向降入容器中,并且半导体材料使用固定加热装置 和下降的加热器。 然后在半导体材料熔化之后,将加热器从容器中提回到锁定室中。 在锁定室中设置门,以允许可移动的加热器在半导体材料熔化之后被去除。