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    • 23. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08653612B2
    • 2014-02-18
    • US12438879
    • 2007-08-22
    • Kazuo OkadaKatsuhiko KitagawaHiroshi Yamada
    • Kazuo OkadaKatsuhiko KitagawaHiroshi Yamada
    • H01L29/84
    • H01L27/14625H01L23/3135H01L27/14618H01L31/0203H01L31/02325H01L2924/0002H01L2924/3025H01L2924/00
    • An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A device element 3 is formed on a front surface of a semiconductor substrate 4, and a sealing body 1 is attached to the semiconductor substrate 4 with an adhesive layer 6 being interposed therebetween. A main surface (a back surface) of the sealing body 1 which faces the semiconductor substrate 4 is curved inward, and there is a given space (a cavity 2) between the sealing body 1 and the semiconductor substrate 4. Since the back surface of the sealing body 1 is curved, the sealing body 1 is used as a planoconcave lens (a reverse direction) as well as a sealing member for the device element 3.
    • 本发明的目的是提供一种较小的半导体器件,其制造过程被简化并且制造成本降低。 此外,本发明的目的是提供一种具有空腔的半导体器件。 器件元件3形成在半导体衬底4的前表面上,并且密封体1被粘附在半导体衬底4上,其间夹有粘合剂层6。 密封体1的面向半导体基板4的主表面(背面)向内弯曲,并且在密封体1和半导体基板4之间具有给定的空间(空腔2)。由于背面 密封体1弯曲,密封体1用作平凸透镜(反方向)以及用于装置元件3的密封构件。
    • 24. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20100065929A1
    • 2010-03-18
    • US12438879
    • 2007-08-22
    • Kazuo OkadaKatsuhiko KitagawaHiroshi Yamada
    • Kazuo OkadaKatsuhiko KitagawaHiroshi Yamada
    • H01L29/84H01L31/0232
    • H01L27/14625H01L23/3135H01L27/14618H01L31/0203H01L31/02325H01L2924/0002H01L2924/3025H01L2924/00
    • An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A device element 3 is formed on a front surface of a semiconductor substrate 4, and a sealing body 1 is attached to the semiconductor substrate 4 with an adhesive layer 6 being interposed therebetween. A main surface (a back surface) of the sealing body 1 which faces the semiconductor substrate 4 is curved inward, and there is a given space (a cavity 2) between the sealing body 1 and the semiconductor substrate 4. Since the back surface of the sealing body 1 is curved, the sealing body 1 is used as a planoconcave lens (a reverse direction) as well as a sealing member for the device element 3.
    • 本发明的目的是提供一种较小的半导体器件,其制造过程被简化并且制造成本降低。 此外,本发明的目的是提供一种具有空腔的半导体器件。 器件元件3形成在半导体衬底4的前表面上,并且密封体1被粘附在半导体衬底4上,其间夹有粘合剂层6。 密封体1的面向半导体基板4的主表面(背面)向内弯曲,并且在密封体1和半导体基板4之间存在给定的空间(空腔2)。由于背面 密封体1弯曲,密封体1用作平凸透镜(反方向)以及用于装置元件3的密封构件。