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    • 24. 发明授权
    • Semiconductor structure and method for forming the same
    • 半导体结构及其形成方法
    • US08860086B2
    • 2014-10-14
    • US13376765
    • 2011-11-11
    • Jing WangLei Guo
    • Jing WangLei Guo
    • H01L29/66H01L21/764H01L29/778H01L21/8234
    • H01L29/778H01L21/764H01L21/823412H01L21/823418H01L21/823481H01L29/66431
    • A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises: a Si substrate (1100); a plurality of convex structures (1200) formed on the Si substrate (1100), in which every two adjacent convex structures (1200) are separated by a cavity in a predetermined pattern, and the cavity between every two adjacent convex structures (1200) is less than 50 nm in width; a first semiconductor film (1300), in which the first semiconductor film (1300) is formed between the every two adjacent convex structures (1200) and connected with tops of the every two adjacent convex structures (1200); a buffer layer (2100) formed on the first semiconductor film (1300); and a high-mobility III-V compound semiconductor layer (2000) formed on the buffer layer (2100).
    • 提供半导体结构及其形成方法。 半导体结构包括:Si衬底(1100); 形成在Si衬底(1100)上的多个凸起结构(1200),其中每两个相邻凸起结构(1200)以预定图案被空腔隔开,并且每两个相邻凸起结构(1200)之间的空腔是 宽度小于50nm; 第一半导体膜(1300),其中第一半导体膜(1300)形成在每两个相邻的凸起结构(1200)之间并与每两个相邻凸起结构(1200)的顶部连接; 形成在所述第一半导体膜(1300)上的缓冲层(2100); 和形成在缓冲层(2100)上的高迁移率III-V族化合物半导体层(2000)。
    • 26. 发明授权
    • Semiconductor structure and method for forming the same
    • 半导体结构及其形成方法
    • US08587029B2
    • 2013-11-19
    • US13376429
    • 2011-11-11
    • Jing WangLei Guo
    • Jing WangLei Guo
    • H01L29/78
    • H01L21/764H01L21/823412H01L21/823418H01L21/823481
    • A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate; a plurality of convex structures formed on the substrate, in which every two adjacent convex structures are separated by a cavity; a plurality of floated films, in which each floated film is formed between the every two adjacent convex structures and connected with tops of the every two adjacent convex structures, the floated films are partitioned into a plurality of sets, a channel layer is formed on a convex structure between the floated films in each set, a source region and a drain region are formed on two sides of the channel layer respectively, and an isolation portion is set between two adjacent sets of floated films; and a gate stack formed on each channel layer.
    • 提供半导体结构及其形成方法。 半导体结构包括基板; 形成在基板上的多个凸起结构,其中每两个相邻的凸起结构被空腔分开; 多个浮动膜,其中每个浮动膜形成在每两个相邻凸起结构之间并且与每两个相邻的凸起结构的顶部连接,浮动膜被分割成多个组,沟道层形成在 每个组中的浮动膜之间的凸起结构,源极区和漏极区分别形成在沟道层的两侧上,并且隔离部分被设置在两个相邻的浮动膜组之间; 以及形成在每个沟道层上的栅极叠层。
    • 27. 发明申请
    • SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
    • 半导体结构及其形成方法
    • US20140138741A1
    • 2014-05-22
    • US13376765
    • 2011-11-11
    • Jing WangLei Guo
    • Jing WangLei Guo
    • H01L29/778H01L29/66
    • H01L29/778H01L21/764H01L21/823412H01L21/823418H01L21/823481H01L29/66431
    • A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises: a Si substrate (1100); a plurality of convex structures (1200) formed on the Si substrate (1100), in which every two adjacent convex structures (1200) are separated by a cavity in a predetermined pattern, and the cavity between every two adjacent convex structures (1200) is less than 50 nm in width; a first semiconductor film (1300), in which the first semiconductor film (1300) is formed between the every two adjacent convex structures (1200) and connected with tops of the every two adjacent convex structures (1200); a buffer layer (2100) formed on the first semiconductor film (1300); and a high-mobility III-V compound semiconductor layer (2000) formed on the buffer layer (2100).
    • 提供半导体结构及其形成方法。 半导体结构包括:Si衬底(1100); 形成在Si衬底(1100)上的多个凸起结构(1200),其中每两个相邻凸起结构(1200)以预定图案被空腔隔开,并且每两个相邻凸起结构(1200)之间的空腔是 宽度小于50nm; 第一半导体膜(1300),其中第一半导体膜(1300)形成在每两个相邻的凸起结构(1200)之间并与每两个相邻凸起结构(1200)的顶部连接; 形成在所述第一半导体膜(1300)上的缓冲层(2100); 和形成在缓冲层(2100)上的高迁移率III-V族化合物半导体层(2000)。
    • 30. 发明授权
    • Semiconductor structure and method for forming the same
    • 半导体结构及其形成方法
    • US08546857B1
    • 2013-10-01
    • US13576937
    • 2012-07-16
    • Jing WangLei GuoWei Wang
    • Jing WangLei GuoWei Wang
    • H01L29/08H01L29/417H01L21/336
    • H01L29/0847H01L29/0653H01L29/66636H01L29/7848
    • A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises: a semiconductor substrate; a source region and a drain region defined in the semiconductor substrate respectively, and a trench formed in the source region and/or the drain region, in which a rare earth oxide layer is formed in the trench; a source and/or a drain formed on the rare earth oxide layer; and a channel region formed between the source and the drain. A relationship between a lattice constant a of the rare earth oxide layer and a lattice constant b of a semiconductor material of the source and/or the drain and/or the channel region is a=(n±c)b, where n is an integer, c is a mismatch ratio of lattice constants, and 0
    • 提供半导体结构及其形成方法。 半导体结构包括:半导体衬底; 限定在半导体衬底中的源极区和漏极区,以及在沟道中形成有稀土氧化物层的源极区和/或漏极区中形成的沟槽; 在稀土氧化物层上形成的源极和/或漏极; 以及形成在源极和漏极之间的沟道区域。 源极和/或漏极和/或沟道区的半导体材料的稀土氧化物层的晶格常数a与晶格常数b之间的关系为a =(n±c)b,其中n为 整数,c是晶格常数的失配比,0