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    • 30. 发明授权
    • Method of manufacturing DNA chip
    • 制造DNA芯片的方法
    • US07700290B2
    • 2010-04-20
    • US11479306
    • 2006-06-30
    • Jeo-young ShimSoo-suk LeeChin-sung ParkKyu-youn Hwang
    • Jeo-young ShimSoo-suk LeeChin-sung ParkKyu-youn Hwang
    • C12Q1/68C12M1/00C12M3/00
    • B01L3/50857B01L2200/12B01L2300/0636B01L2300/0819B82Y10/00G01N27/4145H01L21/823828H01L51/0093H01L51/0545Y10T436/2575
    • A method of manufacturing a DNA (deoxyribonucleic acid) chip is provided. The DNA chip has a plurality of transistors formed on a substrate and an organic layer and a DNA probe sequentially stacked on a gate of the transistor. The method includes forming an inter-layer insulation layer on the substrate to cover the transistors, planarizing the inter-layer insulation layer, forming at least two contact holes exposing gate electrodes of the transistors in the inter-layer insulation layer, selectively forming organic layers on the exposed gate electrodes, attaching a first DFR (dry film resist) layer to the upper surface of the inter-layer insulation layer to cover the contact holes, removing a portion of the first DFR layer covering a first contact hole among the contact holes, attaching a first DNA probe to the organic layers in the first contact hole, and removing a remaining portion of the first DFR layer.
    • 提供了DNA(脱氧核糖核酸)芯片的制造方法。 DNA芯片具有形成在基板上的多个晶体管,并且顺序层叠在晶体管的栅极上的有机层和DNA探针。 该方法包括在衬底上形成层间绝缘层以覆盖晶体管,平坦化层间绝缘层,形成暴露在层间绝缘层中的晶体管的栅电极的至少两个接触孔,选择性地形成有机层 在暴露的栅电极上,将第一DFR(干膜抗蚀剂)层附着到层间绝缘层的上表面以覆盖接触孔,去除覆盖接触孔中的第一接触孔的第一DFR层的一部分 将第一DNA探针连接到第一接触孔中的有机层,以及去除第一DFR层的剩余部分。