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    • 23. 发明授权
    • Integrated comparator circuit
    • 集成比较电路
    • US5434521A
    • 1995-07-18
    • US978637
    • 1992-11-19
    • Ludwig LeipoldRainald SanderJenoe Tihanyi
    • Ludwig LeipoldRainald SanderJenoe Tihanyi
    • G01R19/165H03K5/08H03K17/30H03K17/687H03K5/153
    • H03K17/6872G01R19/16519H03K17/302
    • An integrated comparator circuit includes two complementary MOSFETs having main current paths being connected together in a series circuit at a connecting point. An inverter stage has two complementary MOSFETs with gate terminals connected to the connecting point. First, second and third terminals are provided. The first and second terminals are for an operating voltage, and the second and third terminals are for a voltage to be compared. The series circuit is connected between the first and third terminals, and the inverter stage is connected between the first and second terminals. One of the MOSFETs of the series circuit connected to the first terminal and one of the MOSFETs of the inverter stage connected to the first terminal are of the same channel type. The other of the MOSFETs of the series circuit connected to the third terminal and the other of the MOSFETs of the inverter stage connected the second terminal are of the same channel type.
    • 集成比较器电路包括两个互补MOSFET,其中主电流路径在连接点处串联在一起连接在一起。 反相器级具有两个互补MOSFET,栅极端子连接到连接点。 首先,提供第二和第三终端。 第一和第二端子用于工作电压,第二和第三端子用于比较电压。 串联电路连接在第一和第三端子之间,变频器级连接在第一和第二端子之间。 连接到第一端子的串联电路的MOSFET之一和连接到第一端子的反相器级的MOSFET之一具有相同的通道类型。 连接到第三端子的串联电路的另一个MOSFET和连接到第二端子的反相器级的另一个MOSFET具有相同的通道类型。
    • 25. 发明授权
    • Circuit limiting the load current of a power MOSFET
    • 电路限制功率MOSFET的负载电流
    • US5272399A
    • 1993-12-21
    • US4970
    • 1993-01-15
    • Jenoe TihanyiLudwig LeipoldRainald Sander
    • Jenoe TihanyiLudwig LeipoldRainald Sander
    • H02H7/20H03K17/08H03K17/082H03K3/01H03K5/08
    • H03K17/0822
    • A circuit configuration for limiting current flowing through a power MOSFET includes a voltage divider being connected between drain and source terminals of the power MOSFET and having a node at which a voltage following a drain-to-source voltage of the power MOSFET drops. A control transistor has a load path connected between the gate terminal and the source terminal of the power MOSFET. The control transistor is made conducting as a function of the voltage at the node of the voltage divider if the drain-to-source voltage of the power MOSFET exceeds a predetermined value. A resistor is connected between the gate terminal of the control transistor and the gate terminal of the power MOSFET. A depletion FET has a drain terminal connected to the gate terminal of the control transistor. The source terminal of the depletion FET is connected to the node of the voltage divider. The gate terminal of the depletion FET is connected to the source terminal of the power MOSFET.
    • 用于限制流过功率MOSFET的电流的电路配置包括分压器,其连接在功率MOSFET的漏极和源极端子之间,并且具有在功率MOSFET的漏极 - 源极电压之后的电压下降的节点。 控制晶体管具有连接在功率MOSFET的栅极端子和源极端子之间的负载路径。 如果功率MOSFET的漏极 - 源极电压超过预定值,则控制晶体管作为分压器节点处的电压的函数导通。 电阻连接在控制晶体管的栅极端子和功率MOSFET的栅极端子之间。 耗尽FET具有连接到控制晶体管的栅极端子的漏极端子。 耗尽FET的源极端子连接到分压器的节点。 耗尽FET的栅极端子连接到功率MOSFET的源极端子。
    • 28. 发明授权
    • Opto-electronic sensing apparatus and method
    • 光电传感装置及方法
    • US4185293A
    • 1980-01-22
    • US725537
    • 1976-09-22
    • Jenoe Tihanyi
    • Jenoe Tihanyi
    • H01L27/146H01L27/14
    • H01L27/14643
    • An opto-electronic sensor has an insulating substrate on which a plurality of x-lines of doped n (p) type conductivity semiconductor material are arranged. A light-permeable insulating layer covers the x-lines. A plurality of y-lines of electrically conductive material are then arranged over the insulating layer transversely to the x-lines. Sensor elements are formed at the crossover points of the x- and y-lines. A partial region of opposite conductivity type light sensitive material is arranged adjacent the x-line and beneath the y-line at the crossover point. This partial region forms a barrier-layer effect at a junction of the partial region with the doped semiconductor material of the x-lines.
    • 光电传感器具有绝缘基板,多个x线的n(p)型导电性半导体材料配置在绝缘基板上。 透光绝缘层覆盖x线。 然后在绝缘层上横向于x线布置多个y线导电材料。 传感器元件形成在x线和y线的交叉点处。 相反导电型感光材料的部分区域被布置在x线附近并且在交叉点处在y线下方。 该部分区域在部分区域与x线的掺杂半导体材料的结处形成阻挡层效应。
    • 29. 发明授权
    • Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor
    • 具有负载晶体管的电路装置和用于驱动负载晶体管的电压限制电路和方法
    • US07453308B2
    • 2008-11-18
    • US11057098
    • 2005-02-11
    • Jenoe Tihanyi
    • Jenoe Tihanyi
    • H03L5/00
    • H03K17/302H03K17/0822
    • The invention relates to a circuit arrangement having connecting terminals (K1, K2) for application of a supply voltage (V+) and having a load transistor (M) for connecting a load (Z) to the supply voltage, said load transistor having a control terminal (G) and a first and second load terminal (D, S), the control terminal (G) of the load transistor (2) being coupled to a drive terminal (IN) for application of a drive signal (Sin). A voltage limiting circuit (10) is connected between one (D) of the load terminals and the drive terminal (G) of the transistor, a deactivation circuit (20) being provided, which is designed to deactivate the voltage limiting circuit (10) in a manner dependent on the supply voltage (V+).
    • 本发明涉及具有用于施加电源电压(V +)并具有用于将负载(Z)连接到电源电压的负载晶体管(M))的连接端子(K 1,K 2)的电路装置,所述负载晶体管具有 控制端子(G)和第一和第二负载端子(D,S),负载晶体管(2)的控制端子(G)耦合到用于施加驱动信号(Sin)的驱动端子(IN) 。 电压限制电路(10)连接在负载端子的一个(D)和晶体管的驱动端子(G)之间,设置有去激活电压限制电路(10)的去激活电路(20) 以取决于电源电压(V +)的方式。
    • 30. 发明授权
    • SOI component with increased dielectric strength and improved heat dissipation
    • SOI元件具有增加的介电强度和改善的散热
    • US07301204B2
    • 2007-11-27
    • US10943491
    • 2004-09-17
    • Jenoe Tihanyi
    • Jenoe Tihanyi
    • H01L29/72
    • H01L29/7824H01L21/84H01L27/1203H01L29/0634H01L29/7393H01L29/78639H01L29/8611
    • A semiconductor component arrangement comprises a semiconductor substrate of a first conduction type, an insulation layer arranged on the substrate, and a semiconductor layer arranged on the insulation layer. A semiconductor component is formed in said semiconductor layer. The semiconductor component includes a first semiconductor zone of a first conduction type, a second semiconductor zone of a second conduction type adjoining the first semiconductor zone, and a third semiconductor zone which is doped more heavily than the second semiconductor zone and positioned at a distance from the first semiconductor zone. The semiconductor zone further comprises a fourth semiconductor zone of the second conduction type. The fourth semiconductor zone has a first section formed in the second semiconductor zone and a second section formed in the underlying substrate. The first section and the second section of the fourth semiconductor zone are electrically conductively connected to one another through the insulation layer.
    • 半导体元件布置包括第一导电类型的半导体衬底,布置在衬底上的绝缘层和布置在绝缘层上的半导体层。 半导体元件形成在所述半导体层中。 半导体部件包括第一导电类型的第一半导体区域,与第一半导体区域邻接的第二导电类型的第二半导体区域,以及比第二半导体区域更重掺杂的第三半导体区域, 第一个半导体区。 半导体区还包括第二导电类型的第四半导体区。 第四半导体区域具有形成在第二半导体区域中的第一部分和形成在下面的基板中的第二部分。 第四半导体区域的第一部分和第二部分通过绝缘层彼此导电连接。