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    • 24. 发明申请
    • Methods and tools for controlling the removal of material from microfeature workpieces
    • 用于控制从微型工件移除材料的方法和工具
    • US20080051007A1
    • 2008-02-28
    • US11511689
    • 2006-08-28
    • Nagasubramaniyan ChandrasekaranRajshree KothariGundu M. SabdeJames J. Hofmann
    • Nagasubramaniyan ChandrasekaranRajshree KothariGundu M. SabdeJames J. Hofmann
    • B24B51/00B24B7/30
    • B24B37/013B24B49/12H01L22/26
    • Methods and apparatus for controlling the removal of material from microfeature workpieces in abrasive removal processes. An embodiment of such a method comprises irradiating a periodic structure of the workpiece and obtaining an intensity distribution of radiation returning from the periodic structure. The workpiece can be irradiated with a wide spectrum of wavelengths (e.g., white light), or the workpiece can be irradiated with a laser or lamp at specific wavelengths. The intensity distribution can be an image or other signal from which a dimension or other physical parameter of the periodic structure can be determined. For example, the intensity distribution can be an intensity signal of radiation returning from the workpiece in a selected bandwidth (e.g., 200 nm-900 nm) or an image of a diffraction pattern of radiation that has been scattered by the periodic structure. The method further includes outputting a control signal based on the obtained intensity distribution. For example, the control signal can be an endpoint signal indicating the actual endpoint of the abrasive removal process.
    • 用于控制在磨料去除过程中从微特征工件中去除材料的方法和装置。 这种方法的实施例包括照射工件的周期性结构并获得从周期性结构返回的辐射的强度分布。 可以用宽的波长范围(例如,白光)照射工件,或者可以用特定波长的激光或灯照射工件。 强度分布可以是可以确定周期性结构的尺寸或其他物理参数的图像或其他信号。 例如,强度分布可以是在所选择的带宽(例如,200nm-900nm)中从工件返回的辐射的强度信号或由周期性结构散射的辐射的衍射图案的图像。 该方法还包括基于获得的强度分布输出控制信号。 例如,控制信号可以是指示磨料去除过程的实际终点的端点信号。
    • 26. 发明授权
    • Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
    • 用选择的平面液体进行化学机械平面化的微电子基板的方法和装置
    • US06533893B2
    • 2003-03-18
    • US10102401
    • 2002-03-19
    • Gundu M. SabdeJames J. HofmannMichael J. JoslynWhonchee Lee
    • Gundu M. SabdeJames J. HofmannMichael J. JoslynWhonchee Lee
    • H01L2100
    • B24B37/0056B24B37/042
    • A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a fixed abrasive polishing pad while maintaining the pH of a planarizing liquid adjacent the polishing pad at an approximately constant level by buffering the planarizing liquid. The planarizing liquid can include ammonium hydroxide and ammonium acetate, ammonium citrate, or potassium hydrogen phthalate. In another embodiment, the planarizing liquid can have an initially high pH that has a reduced tendency to decrease during planarization. The planarizing liquid can also include agents, such as isopropyl alcohol, ammonium acetate or polyoxy ethylene ether that can increase the wetted surface area of the microelectronic substrate and/or reduce drag force imparted to the microelectronic substrate by the polishing
    • 一种用于平面化微电子衬底的方法和装置。 在一个实施例中,该方法可以包括用固定的研磨抛光垫平面化微电子衬底,同时通过缓冲平坦化液体将邻近抛光垫的平坦化液体的pH保持在大致恒定的水平。 平面化液体可以包括氢氧化铵和乙酸铵,柠檬酸铵或邻苯二甲酸氢钾。 在另一个实施方案中,平面化液体可以具有初始高的pH,其在平坦化期间具有降低的降低趋势。 平面化液体还可以包括可以增加微电子衬底的润湿表面积和/或通过抛光赋予微电子衬底的拖曳力的试剂,例如异丙醇,乙酸铵或聚氧乙烯醚
    • 28. 发明授权
    • Methods and tools for controlling the removal of material from microfeature workpieces
    • 用于控制从微型工件移除材料的方法和工具
    • US07527545B2
    • 2009-05-05
    • US11511689
    • 2006-08-28
    • Nagasubramaniyan ChandrasekaranRajshree KothariGundu M. SabdeJames J. Hofmann
    • Nagasubramaniyan ChandrasekaranRajshree KothariGundu M. SabdeJames J. Hofmann
    • B24B7/22B24B49/12
    • B24B37/013B24B49/12H01L22/26
    • Methods and apparatus for controlling the removal of material from microfeature workpieces in abrasive removal processes. An embodiment of such a method comprises irradiating a periodic structure of the workpiece and obtaining an intensity distribution of radiation returning from the periodic structure. The workpiece can be irradiated with a wide spectrum of wavelengths (e.g., white light), or the workpiece can be irradiated with a laser or lamp at specific wavelengths. The intensity distribution can be an image or other signal from which a dimension or other physical parameter of the periodic structure can be determined. For example, the intensity distribution can be an intensity signal of radiation returning from the workpiece in a selected bandwidth (e.g., 200 nm-900 nm) or an image of a diffraction pattern of radiation that has been scattered by the periodic structure. The method further includes outputting a control signal based on the obtained intensity distribution. For example, the control signal can be an endpoint signal indicating the actual endpoint of the abrasive removal process.
    • 用于控制在磨料去除过程中从微特征工件中去除材料的方法和装置。 这种方法的实施例包括照射工件的周期性结构并获得从周期性结构返回的辐射的强度分布。 可以用宽的波长范围(例如,白光)照射工件,或者可以用特定波长的激光或灯照射工件。 强度分布可以是可以确定周期性结构的尺寸或其他物理参数的图像或其他信号。 例如,强度分布可以是在所选择的带宽(例如,200nm-900nm)中从工件返回的辐射的强度信号或由周期性结构散射的辐射的衍射图案的图像。 该方法还包括基于获得的强度分布输出控制信号。 例如,控制信号可以是指示磨料去除过程的实际终点的端点信号。