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    • 23. 发明申请
    • Molding composition and method, and molded article
    • 成型组合物和成型品
    • US20070004819A1
    • 2007-01-04
    • US11172308
    • 2005-06-30
    • Qiwei LuMichael O'BrienMichael Vallance
    • Qiwei LuMichael O'BrienMichael Vallance
    • C08F2/46C08L63/00C08L71/02
    • C08G59/68H01L2224/32245H01L2224/45144H01L2224/48091H01L2224/48247H01L2224/48257H01L2224/73265Y10T428/31511H01L2924/00014H01L2924/00
    • A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.
    • 用于封装固态器件的可固化方法包括(A)环氧树脂; (B)有效量的固化催化剂,其包含(B1)包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; (B2)包含(B2a)二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和(B2b)选自高氯酸盐,亚氨基二硫基氟化物阴离子,未取代和取代的(C 1 -C 12) 全氟链烷酸酯,四氟硼酸酯,未取代和取代的四 - (C 1 -C 12 - )烷基磺酸酯,(C 2 -C 12 -C 12 - 六氟磷酸盐,六氟砷酸盐,三(三氟甲基磺酰基)甲基阴离子,双(三氟甲基磺酰基)甲基阴离子,双(三氟甲基磺酰基)亚胺阴离子及其组合; 和(B3)选自自由基产生芳族化合物,过氧化合物,脂族羧酸的铜(II)盐,芳族羧酸的铜(II)盐,乙酰丙酮化的铜(II)及其组合)的固化助催化剂 ; 和(C)约70至约95重量%的无机填料,基于可固化组合物的总重量。 组合物的固化催化剂允许使用增加的填料负载,这进而降低固化的组合物的吸湿和热膨胀。