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21. 发明专利

JP2011165242A Pattern inspection method, and device thereof 有权
标题翻译：模式检验方法及其装置
公开(公告)号：JP2011165242A
公开(公告)日：2011-08-25
申请号：JP2010024350
申请日：2010-02-05
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： SASAZAWA HIDEAKI , HIROSE TAKESHI , SERIKAWA SHIGERU , HORIE KIYOTAKE
IPC分类号： G11B5/84 , G01B11/24 , G01N21/95
CPC分类号： G11B5/855 , G01B11/0641 , G01N21/95607
摘要： PROBLEM TO BE SOLVED: To inspect a pattern without being affected by variation in the film thickness and film quality of a base film in the optical inspection of a patterned medium for a hard disk.
SOLUTION: A pattern inspection device includes: a turntable means rotatable with a sample 20 placed thereon; an illumination means which irradiates the sample with illumination light; a spectral analysis and detection means which performs spectral analysis and detection of reflected light incoming from an area which has been irradiated with light by the illumination means; an optical property detection means which detects the optical properties of a multilayer film by processing a reflected light detection signal incoming from an area in which the pattern of the substrate detected by spectral analysis using the spectral analysis and detection means is not formed and which detects the optical properties of the reflected light incoming from the pattern including the multilayer film by processing the reflected light detection signal incoming from the pattern including the multilayer film; and a pattern inspection means which inspects the pattern formed on the multilayer film by processing information on the optical properties of the reflected light incoming from the pattern including the multilayer film using the information on the optical properties of the reflected light incoming from the multilayer film detected by the optical property detection means.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：在用于硬盘的图案化介质的光学检查中，检查图案而不受基膜的膜厚度和膜质量的变化的影响。解决方案：图案检查装置包括：转盘，其可放置在其上的样品20可旋转; 用照明光照射样品的照明装置; 光谱分析和检测装置，其对由照明装置照射光的区域进入的反射光进行光谱分析和检测; 光学特性检测装置，其通过处理从通过光谱分析和检测装置检测的基板检测到的基板的图案的区域进入的反射光检测信号，检测多层膜的光学特性，通过处理从包括多层膜的图案进入的反射光检测信号，从包括多层膜的图案进入的反射光的光学性质; 以及图案检查装置，其使用从检测到的多层膜入射的反射光的光学性质的信息来处理从多层膜的图案进入的反射光的光学性质的信息，来检查形成在多层膜上的图案通过光学特性检测装置。版权所有（C）2011，JPO＆INPIT

22. 发明专利

JP2011065726A Method of inspecting patterned media and device therefor 审中-公开
标题翻译：检查图形媒体的方法及其设备
公开(公告)号：JP2011065726A
公开(公告)日：2011-03-31
申请号：JP2009216813
申请日：2009-09-18
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HIROSE TAKESHI , SASAZAWA HIDEAKI , SERIKAWA SHIGERU
IPC分类号： G11B5/84 , G01B11/06 , G01B11/24 , G01N21/27 , G01N21/95
摘要： PROBLEM TO BE SOLVED: To solve the problems that it is difficult to display all widths, heights, and so forth of a pattern obtained by inspecting and measuring the entire disk surface for each region of several micrometers and it is not necessarily effective to display all of them, although it is possible to inspect and measure the entire disk surface for each region of several micrometers, about a cross-sectional shape of the pattern having a line width of several 100 nm or less formed on a substrate by using scatterometry.
SOLUTION: The distributions of widths and heights of the pattern, particularly the distribution of the cross-sectional areas (volume per unit length) or the like of a magnetic body part of a pattern cross section directly affecting the device performance are displayed independently or in a combined manner. Fatures of results are enhanced and displayed. Further, by evaluating correlation with read-write test results in advance, a final failure part may be specified upon the inspection and measurement of the pattern cross sectional shape to prevent the generation of failure in advance.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了解决难以显示通过检查和测量几个微米的每个区域的整个盘表面而获得的图案的所有宽度，高度等的问题，并且不一定是有效的为了显示所有这些，虽然可以通过使用在基板上形成的线宽为几百nm或更小的图案的横截面形状，对每个几微米的区域来检查和测量整个盘表面散射。解决方案：显示图案的宽度和高度的分布，特别是直接影响设备性能的图形横截面的磁体部分的横截面积（单位长度的体积）等的分布独立地或以组合的方式。结果的特征得到增强和显示。此外，通过预先通过与读写测试结果的相关性来评估最终的故障部分，以便在检查和测量图形横截面形状时预先防止发生故障。版权所有（C）2011，JPO＆INPIT

23. 发明专利

JP2009257993A Pattern shape inspection device, and method therefor 有权
标题翻译：图案形状检查装置及其方法
公开(公告)号：JP2009257993A
公开(公告)日：2009-11-05
申请号：JP2008108875
申请日：2008-04-18
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： SAITO HIROYA , HIROSE TAKESHI , SASAZAWA HIDEAKI
IPC分类号： G01N21/95 , G11B5/84
CPC分类号： G11B27/36 , B82Y10/00 , G01N21/9506 , G01N21/95607 , G01N2021/945 , G11B5/743 , G11B5/746 , G11B5/82 , G11B5/855 , G11B5/865 , G11B2220/2516
摘要： PROBLEM TO BE SOLVED: To provide a pattern shape inspection device capable of inspecting quickly and highly sensitively a magnetic recording medium including a patterned medium, a bit patterned medium or the like of an object to be inspected, or a pattern shape of a stamper thereof or the like, and a method therefor. SOLUTION: This pattern shape inspection device is provided with: a moving mechanism for moving radial-directionally the object to be inspected, while mounting and rotating the object; an irradiation optical system for irradiating the object to be inspected moving radial-directionally while rotating the object by the moving mechanism, with an illumination light of wide band including a far ultraviolet ray, from a diagonal direction, under a polarized state suitable for the object to be inspected; a detecting optical system for detecting a zero-order reflected light generated from the object to be inspected irradiated by the irradiating optical system; and a shape inspection means for inspecting the pattern shape formed on the object to be inspected, based on a spectral reflectance waveform obtained by dispersing spectrally the detected zero-order reflected light. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够快速且高灵敏地检查包括待检查对象的图案化介质，位图案化介质等的磁记录介质的图案形状检查装置或者图形形状其压模等，及其方法。解决方案：该图案形状检查装置设置有用于在安装和旋转物体的同时径向地移动被检查物体的移动机构; 照射光学系统，用于照射被检查物体，在被偏振状态适应于物体的情况下，通过移动机构旋转被检体的物体，从具有远紫外线的宽带的宽带的对角线方向照射光被检查用于检测由所述照射光学系统照射的待检查对象产生的零级反射光的检测光学系统; 以及形状检查装置，用于基于通过对检测到的零级反射光进行光谱分散而获得的光谱反射率波形来检查形成在待检查对象上的图案形状。版权所有（C）2010，JPO＆INPIT

24. 发明专利

JP2006153784A Inspection method 审中-公开
标题翻译：检查方法
公开(公告)号：JP2006153784A
公开(公告)日：2006-06-15
申请号：JP2004347976
申请日：2004-12-01
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： MORISAWA TOSHIHIRO , HIROSE TAKESHI
IPC分类号： G01B11/06 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein in a conventional method, in which an area occupancy rate is determined using mask data a measurement position cannot be determined by reflecting the influence of the simplicity of a pattern, the shape and fineness of the pattern, since the same area is obtained, even if, for example, there are a large number of fine elements or there is one large element and that a measurement position cannot be determined by reflecting the characteristic of the pattern, since the processing process of processes is represented on the basis of the area occupancy rate, even if the method determines a measurement position through process simulation results.
SOLUTION: Measurement feasibility, depending on a pattern, can be decided by acquiring the shape of the pattern in a measurement area by using mask data and evaluating the shape of the pattern and the features of fineness on the basis of the shape. Since the measurement feasibility can be decided only by using the mask data, measurement position can be automatically determined, before performing measurement.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题为了解决以往的方法中，使用掩模数据确定面积占有率的问题，不能通过反映图案的简单性，形状和细度的影响来确定测量位置的图案，由于获得相同的面积，即使例如存在大量的细小元素或者存在一个大的元素，并且通过反映图案的特性不能确定测量位置，因为处理即使该方法通过过程模拟结果确定测量位置，也可以基于面积占有率来表示处理过程。解决方案：可以通过使用掩模数据获取测量区域中的图案的形状并基于形状来评估图案的形状和细度特征来决定取决于图案的测量可行性。由于只能通过使用掩模数据来决定测量可行性，所以可以在进行测量之前自动确定测量位置。版权所有（C）2006，JPO＆NCIPI

25. 发明专利

JP2006112884A Film thickness measuring method and device of thin film device 有权
标题翻译：薄膜厚度测量方法和薄膜装置的装置
公开(公告)号：JP2006112884A
公开(公告)日：2006-04-27
申请号：JP2004299564
申请日：2004-10-14
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HIROSE TAKESHI , YOSHITAKE YASUHIRO
IPC分类号： G01B11/06 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To perform easily film thickness measurement on a pattern even if a device pattern becomes very fine after 45 nm node, in consideration of the tendency that the need of the film thickness measurement at various parts in a chip is being heightened especially as film thickness management after CMP (Chemical Mechanical Polishing).
SOLUTION: When determining the film thickness optically by using visible light, since an object pattern has the size of about one-tenth of a detection wavelength after 45 nm node to be below a resolution, the measuring object can be assumed as a uniform layer structure, and the film thickness measurement in a short time can be realized by using an assumed model. A film thickness measurement algorithm is selected according to the size of the measuring object pattern.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使在45nm节点之后器件图案变得非常细的情况下，也可以在图案上进行薄膜厚度测量，考虑到芯片各部分的膜厚度测量的需要是特别是CMP（化学机械抛光）后的薄膜厚度管理得到提高。解决方案：当通过使用可见光光学地确定膜厚度时，由于物体图案具有在45nm节点之后的检测波长的大约十分之一的尺寸低于分辨率，所以测量对象可以被假定为均匀的层结构，并且可以通过使用假设模型来实现短时间内的膜厚度测量。根据测量对象图案的尺寸选择膜厚度测量算法。版权所有（C）2006，JPO＆NCIPI

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