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    • 24. 发明申请
    • Curing agent for epoxy resins and epoxy resin composition
    • 环氧树脂固化剂和环氧树脂组合物
    • US20070179258A1
    • 2007-08-02
    • US11656968
    • 2007-01-24
    • Shun OgawaHisayuki Kuwahara
    • Shun OgawaHisayuki Kuwahara
    • C08L63/00
    • C08G59/5026C08G59/184C08L63/00
    • The present invention relates to a curing agent for epoxy resins comprising (A) an epoxy adduct of isophoronediamine, (B) an epoxy adduct of 1,3-bis(aminomethyl) cyclohexane, (C) isophoronediamine and (D) 1,3-bis (aminomethyl) cyclohexane wherein the weight ratio of (D) to (C) (=(D)/(C)) in said curing agent is in the range of 0.04 to 0.22, which can provide an epoxy resin composition with excellent curing performances such as curability under the condition of low temperature, excellent performances of epoxy resin cured coating films, excellent chemical resistance of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products.
    • 本发明涉及环氧树脂固化剂,其包含(A)异佛尔酮二胺的环氧加合物,(B)1,3-双(氨基甲基)环己烷的环氧加合物,(C)异佛尔酮二胺和(D) 双(氨基甲基)环己烷,其中所述固化剂中(D)与(C)(=(D)/(C))的重量比在0.04至0.22的范围内,这可提供具有优异固化性的环氧树脂组合物 在低温条件下的固化性能优异,环氧树脂固化涂膜性能优异,环氧树脂固化涂膜具有优异的耐化学性和环氧树脂固化产物的优异物理性能。
    • 25. 发明申请
    • Curing agent composition for epoxy resins and epoxy resin composition
    • 环氧树脂固化剂组合物和环氧树脂组合物
    • US20070142572A1
    • 2007-06-21
    • US11637117
    • 2006-12-12
    • Shun OgawaHisayuki Kuwahara
    • Shun OgawaHisayuki Kuwahara
    • C08L63/00C08L83/00B32B27/38
    • C08G59/50C08G59/184C08L63/00
    • The present invention relates to a curing agent composition for epoxy resins comprising (A) a polyamine compound which is a reaction product of a compound having at least one glycidyl group in a molecule with a diamine having a specific structure, (B) a polyether-modified polysiloxane having a surface tension in the range of 19 dyne/cm to 25 dyne/cm and (C) an amino group-modified polysiloxane having a total amine value in the range of 150 mgKOH/g to 650 mgKOH/g which can provide excellent curing performances, excellent performances of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products, an epoxy resin composition comprising said curing agent composition for epoxy resins and an epoxy resin cured product obtained by curing said epoxy resin composition.
    • 本发明涉及用于环氧树脂的固化剂组合物,其包含(A)分子中具有至少一个缩水甘油基的化合物与具有特定结构的二胺的反应产物的多胺化合物,(B)聚醚 - 具有19达因/厘米2至25达因/厘米范围内的表面张力的改性聚硅氧烷和(C)总胺值在150mgKOH / g至650mgKOH / g范围内的氨基改性聚硅氧烷,其可以提供 优异的固化性能,环氧树脂固化涂膜的优异性能和环氧树脂固化产物的优异物理性能,包含所述环氧树脂固化剂组合物的环氧树脂组合物和通过固化所述环氧树脂组合物获得的环氧树脂固化产物。
    • 26. 发明申请
    • POLYAMIDE RESINS AND PROCESSES FOR MOLDING THEM
    • 聚酰胺树脂及其成型工艺
    • US20130184431A1
    • 2013-07-18
    • US13824695
    • 2011-11-08
    • Hatsuki OguroJun MitaderaHisayuki Kuwahara
    • Hatsuki OguroJun MitaderaHisayuki Kuwahara
    • C08G69/26
    • C08G69/265C08G69/26C08L77/06
    • Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. The polyamide resin comprises a diamine unit containing 70 mol % or more of a xylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a straight chain aliphatic dicarboxylic acid unit, wherein the xylylenediamine unit is composed of 50 to 95 mol % of p-xylylenediamine and 50 to 5 mol % of m-xylylenediamine; the straight chain aliphatic dicarboxylic acid unit is composed of 50 to 100 mol % of adipic acid and 0 to less than 50 mol % of sebacic acid or other straight chain aliphatic dicarboxylic acids; the molar ratio of reacted diamine units to reacted dicarboxylic acid units (the number of moles of reacted diamine units/the number of moles of reacted dicarboxylic acid units) is less than 0.994; and the polyamide resin has a number average molecular weight of 10,000 to 25,000 and a melting point of 285° C. or more.
    • 提供耐热性高,成型性优异,机械特性优异的聚酰胺树脂。 聚酰胺树脂包含含有70摩尔%以上的苯二甲胺单元的二胺单元和含有70摩尔%以上的直链脂肪族二羧酸单元的二羧酸单元,其中,所述苯二甲胺单元为50〜95摩尔% 对苯二甲胺和50〜5摩尔间苯二甲胺; 直链脂肪族二羧酸单元由50〜100摩尔%的己二酸和0〜小于50摩尔%的癸二酸或其它直链脂肪族二羧酸组成, 反应的二胺单元与反应的二羧酸单元的摩尔比(反应的二胺单元的摩尔数/反应的二羧酸单元的摩尔数)小于0.994; 聚酰胺树脂的数均分子量为10,000〜25,000,熔点为285℃以上。