专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20100176112A1 HEATING APPLIANCE FOR COOKING 有权
标题翻译：加热器具烹饪
公开(公告)号：US20100176112A1
公开(公告)日：2010-07-15
申请号：US12663305
申请日：2008-06-06
申请人： Tamotsu Izutani , Keiko Isoda , Hiroshi Tominaga , Fumitaka Ogasawara
发明人： Tamotsu Izutani , Keiko Isoda , Hiroshi Tominaga , Fumitaka Ogasawara
IPC分类号： H05B1/00
CPC分类号： H05B6/062 , H03K2217/96042
摘要： A rear surface of an operating region 47 disposed forwardly of a top plate 43 and colored is coated with conductor detecting units 49a to 51a, each slotted to define a command display 49c to 51c and a frame display 49b to 51b therein and having a light shielding property, and associated conductor connectors 55 to 57, while a light shielding film having an insulating property is formed around them. A planar light emitting member 60 is arranged below the conductor detecting units 49a to 51a so as to confront them so that each of the conductor detecting units can be recognized as an operating button when the planar light emitting member 60 emits light, but when the light emitting member 60 is blacked out, such operating button can be made hard for the user to look at, thereby increasing the operability and the design feature of the outer appearance of a cooking appliance.
摘要翻译：设置在顶板43的前方并着色的操作区域47的后表面涂覆有导体检测单元49a至51a，每个开槽部分限定了指令显示器49c至51c和其中的框架显示器49b至51b，并具有遮光性能和相关的导体连接器55至57，同时在其周围形成具有绝缘性能的遮光膜。在导体检测单元49a〜51a的下方配置有平面状的发光部件60，以便面对它们，使得当面状发光部件60发光时，各导体检测部件能够识别为操作按钮，但是当光发光构件60被黑化，这样的操作按钮可以变得难以供用户观看，从而增加烹饪器具的外观的可操作性和设计特征。

22. 发明申请

US20100187216A1 COOKING DEVICE 有权
标题翻译：烹饪器具
公开(公告)号：US20100187216A1
公开(公告)日：2010-07-29
申请号：US12666078
申请日：2008-06-23
申请人： Masamichi Komada , Hiroshi Tominaga , Keiko Isoda
发明人： Masamichi Komada , Hiroshi Tominaga , Keiko Isoda
IPC分类号： H05B3/68
CPC分类号： H05B6/062 , H03K17/962 , H03K2017/9613 , H03K2217/960705 , H03K2217/960755
摘要： There is provided a cooking device capable of preventing heating operations from being unintentionally turned on and off and the setting of heating operations from being changed even when water droplets are scattered around touch switches or the vicinity of the touch switches is wiped with a damp cloth or the like. Left and right cancel electrodes (5a, 5b) are provided near the key electrodes between the positions of left and right heating coils (3a, 3b) and the positions of the key electrodes (4a1, 4a2, 4a3, 4b1, 4b2, 4b3). A control unit (6) changes over between validity and invalidity of inputting through the key electrodes based on whether or not a change of capacitances of the left and right cancel electrodes (5a, 5b) is equal to or more than a predetermined amount.
摘要翻译：提供了一种烹饪装置，其能够防止加热操作被无意地打开和关闭，并且即使当水滴散布在触摸开关附近或者触摸开关附近时，加热操作的设置也会被改变，或者用湿布擦拭类似。在左右加热线圈（3a，3b）的位置和键电极（4a1,4a2,4a3,4b1,4b2,4b3）的位置之间，在键电极附近设置左右取向电极（5a，5b）。控制单元（6）基于左，右取消电极（5a，5b）的电容变化是否等于或大于预定量，通过键电极输入的有效性和无效性之间变化。

23. 发明申请

US20100176115A1 COOKING DEVICE 有权
标题翻译：烹饪器具
公开(公告)号：US20100176115A1
公开(公告)日：2010-07-15
申请号：US12666086
申请日：2008-06-23
申请人： Hiroshi Tominaga , Keiko Isoda , Masamichi Komada , Fumitaka Ogasawara , Kuniaki Sakakibara
发明人： Hiroshi Tominaga , Keiko Isoda , Masamichi Komada , Fumitaka Ogasawara , Kuniaki Sakakibara
IPC分类号： H05B3/68
CPC分类号： H05B6/062 , F24C7/082
摘要： A cooking device that is easy to use in terms of key operation is provided. A cooking device includes an operation unit (7a, 8a) and a display unit (7b, 8b) provided on an upper surface of the cooking device. The operation unit (7a, 8a) includes a mode selection key (21) for selecting any one of a plurality of control modes, output increasing/decreasing keys (22, 23) for increasing and decreasing a set output and a set temperature, and time increasing/decreasing keys (24, 25) for increasing and decreasing time for heating according to a timer. The mode selection key (21) is separated from the time increasing/decreasing keys (24, 25) on the opposite side of the output increasing/decreasing keys (22, 23). The display unit (7b, 8b) includes a numerical value display section (26) for displaying a numerical value of a set value in the selected control mode, an output display section (27) for displaying the set value for heating output, and a mode display section (28) for displaying a cooking mode selected by using the mode selection key. The numerical value display section (26) is separated from the mode display section (28) on the opposite side of the output display section (27).
摘要翻译：提供了一种在按键操作方面易于使用的烹饪设备。烹饪装置包括设置在烹饪装置的上表面上的操作单元（7a，8a）和显示单元（7b，8b）。操作单元（7a，8a）包括用于选择多个控制模式中的任何一个的模式选择键（21），用于增加和减少设定输出和设定温度的输出增减键（22,23），以及时间增加/减小键（24,25），用于根据定时器增加和减少加热时间。模式选择键（21）与输出增减键（22,23）相对的时间增减键（24,25）分离。显示单元（7b，8b）包括用于显示所选择的控制模式中的设定值的数值的数值显示部（26），显示加热输出的设定值的输出显示部（27），以及模式显示部（28），用于显示通过使用模式选择键选择的烹饪模式。数值显示部（26）与输出显示部（27）的相反侧的模式显示部（28）分离。

24. 发明申请

US20110315675A1 INDUCTION HEATING COOKER 审中-公开
标题翻译：感应加热烹饪机
公开(公告)号：US20110315675A1
公开(公告)日：2011-12-29
申请号：US13256126
申请日：2010-03-08
申请人： Kuniaki Sakakibara , Kenji Watanabe , Keiko Isoda , Taizo Ogata
发明人： Kuniaki Sakakibara , Kenji Watanabe , Keiko Isoda , Taizo Ogata
IPC分类号： H05B6/12
CPC分类号： H05B6/062 , H05B2213/07
摘要： There are provided amplifying part (5) for amplifying an output signal of infrared detecting part (4), gain switching part (6) for switching a gain of amplifying part (5) to one of a plurality of gains according to magnitude of the output signal of amplifying part (5), and measuring part (12) for calculating a temperature based on an increase in the output signal of amplifying part (5) relative to an initial reference value, and after writing command input part (11) input a writing command, the output signal of amplifying part (5) is written as the initial reference value for each of the plurality of gains in storage medium (13). Since measuring part (12) uses the initial reference value corresponding to the gain as the initial reference value, temperature of object to be heated (1) can be accurately measured over a wide range.
摘要翻译：提供用于放大红外线检测部分（4）的输出信号的放大部分（5），用于根据输出的幅度将放大部分（5）的增益切换到多个增益中的一个增益的增益切换部分（6）放大部分（5）的信号和用于基于放大部分（5）的输出信号相对于初始参考值的增加来计算温度的测量部分（12），并且在写入命令输入部分（11）之后输入写入命令，将放大部分（5）的输出信号写入存储介质（13）中的多个增益中的每一个的初始参考值。由于测量部件（12）使用与增益对应的初始参考值作为初始参考值，所以可以在宽范围内精确地测量被加热物体（1）的温度。

25. 发明授权

US08338757B2 Cooking device 有权
标题翻译：烹饪设备
公开(公告)号：US08338757B2
公开(公告)日：2012-12-25
申请号：US12669614
申请日：2008-07-18
申请人： Keiko Isoda , Hideaki Kobayashi , Yoshiaki Ishio , Hidekazu Suzuki , Taihei Oguri
发明人： Keiko Isoda , Hideaki Kobayashi , Yoshiaki Ishio , Hidekazu Suzuki , Taihei Oguri
IPC分类号： H05B3/68 , H05B3/02
CPC分类号： H05B6/062 , F24C7/082
摘要： A cooking device includes a control mode switch selecting a control mode for controlling a heating operation; a setting switch for selecting a set value in each control mode; a heating control unit for controlling a heating unit based on the control mode and the set value inputted through the control mode switch and the setting switch; and a selection switch for selecting the operation mode. The operation modes include a first operation mode in which all of the plurality of control modes are set to be selectable and a second operation mode in which only part of the control modes are set to be selectable. The heating control unit disables at least one control mode switch when the second operation mode is selected by the selection switch.
摘要翻译：烹调装置包括控制模式开关，其选择用于控制加热操作的控制模式; 用于在每个控制模式中选择设定值的设定开关; 加热控制单元，用于基于通过控制模式开关和设定开关输入的控制模式和设定值来控制加热单元; 以及用于选择操作模式的选择开关。操作模式包括其中所有多个控制模式被设置为可选择的第一操作模式和仅将部分控制模式设置为可选择的第二操作模式。当通过选择开关选择第二操作模式时，加热控制单元禁用至少一个控制模式开关。

26. 发明授权

US06657245B2 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
公开(公告)号：US06657245B2
公开(公告)日：2003-12-02
申请号：US10179214
申请日：2002-06-26
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： H01L2976
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

27. 发明授权

US06617630B2 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
公开(公告)号：US06617630B2
公开(公告)日：2003-09-09
申请号：US10179218
申请日：2002-06-26
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： H01L2576
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

28. 发明授权

US06441416B1 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
公开(公告)号：US06441416B1
公开(公告)日：2002-08-27
申请号：US09689802
申请日：2000-10-13
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： H01L2976
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

29. 发明申请

US20050248014A1 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
标题翻译：树脂封装的半导体装置及其制造方法
公开(公告)号：US20050248014A1
公开(公告)日：2005-11-10
申请号：US11182857
申请日：2005-07-18
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： C08L79/08 , H01L23/29 , H01L23/31 , H01L23/495 , H01L29/76 , H01L31/0203
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.
摘要翻译：本发明提供一种包含具有铁电体膜和表面保护膜的半导体器件的树脂封装半导体装置和包含树脂的密封剂构件; 表面保护膜由聚酰亚胺形成。本发明还提供一种制造树脂封装的半导体装置的方法，包括以下步骤：在具有铁电体膜的半导体器件的表面上形成聚酰亚胺前体组合物的膜; 热固化聚酰亚胺前体组合物膜以形成由聚酰亚胺形成的表面保护膜; 并用密封树脂封装形成有表面保护膜的半导体器件。聚酰亚胺的玻璃化转变温度优选为240℃〜400℃，杨氏模量为2600MPa〜6GPa。固化可优选在230℃至300℃的温度下进行。

30. 发明授权

US06319656B1 Photosensitive polyimide precursor and its use for pattern formation 失效
标题翻译：光敏聚酰亚胺前体及其用于图案形成
公开(公告)号：US06319656B1
公开(公告)日：2001-11-20
申请号：US09455929
申请日：1999-12-07
申请人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
发明人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
IPC分类号： G03F730
CPC分类号： C08G73/1025 , C08G73/10 , G03F7/0387
摘要： A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group having 4 or more carbon atoms; R2 is a trivalent or tetravalent organic group having one or more aromatic rings; R3 is a monovalent organic group; A is a monovalent group showing acidity; and n is an integer of 1 or 2, is effective for preparing a highly sensitive negative-working photosensitive material developable with an alkaline aqueous solution in a short time with high resolution.
摘要翻译：一种具有下式重复单元的聚酰亚胺前体：其中R1是具有4个或更多个碳原子的四价有机基团; R2是具有一个或多个芳环的三价或四价有机基团; R3是一价有机基团; A是显示酸度的一价基团; n为1或2的整数，能够以高分辨率在短时间内制备用碱性水溶液显影的高敏感性负性感光性物质。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式