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    • 25. 发明申请
    • FORMATION OF A TRENCH SILICIDE
    • 形成硅胶
    • US20130270614A1
    • 2013-10-17
    • US13448513
    • 2012-04-17
    • Hiroyuki Yamasaki
    • Hiroyuki Yamasaki
    • H01L29/78H01L21/28H01L21/336
    • H01L29/0847H01L21/28518H01L21/76814H01L21/76816H01L21/76834H01L21/76897H01L29/665H01L29/78
    • Systems and methods are presented for controlling formation of a silicide region. A selective etch layer is utilized to control formation of a trench opening, and further can be utilized to open up a trench to facilitate correct exposure of an active Si region to subsequently form a silicide. Issues regarding over-dimension, under-dimension, and misalignment of a trench are addressed. The selective etch material is chosen to facilitate control of the trench formation and also to enable removal of the selective etch layer without affecting any adjacent structures/material. The selective etch layer can be an oxide, for example aluminum oxide, Al2O3. The selective etch layer can be utilized to prevent formation of silicide in a channel beneath a raised source/drain.
    • 呈现用于控制硅化物区域的形成的系统和方法。 使用选择性蚀刻层来控制沟槽开口的形成,并且还可以用于打开沟槽以促进有源Si区域的正确曝光以随后形成硅化物。 关于沟槽尺寸过大,尺寸不合格和未对准的问题得到了解决。 选择性蚀刻材料被选择以便于控制沟槽形成,并且还能够去除选择性蚀刻层而不影响任何相邻的结构/材料。 选择性蚀刻层可以是氧化物,例如氧化铝,Al 2 O 3。 选择性蚀刻层可用于防止在升高的源极/漏极下方的沟道中形成硅化物。
    • 30. 发明申请
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US20060071260A1
    • 2006-04-06
    • US11235063
    • 2005-09-27
    • Hiroyuki Yamasaki
    • Hiroyuki Yamasaki
    • H01L21/8242H01L29/94
    • H01L29/945H01L27/10867
    • A semiconductor device includes a semiconductor substrate, an insulating film provided on the semiconductor substrate, the insulating film including an opening portion, a surface strap embedded in the opening portion, the surface strap comprising a semiconductor layer, a reaction preventing film provided on the surface strap, the reaction preventing film comprising a material different from that of the insulating film, a storage electrode of a trench capacitor provided in the semiconductor substrate, the storage electrode connecting electrically with the surface strap, and a source/drain region provided on a surface of the semiconductor substrate, the source/drain region connecting electrically with the storage electrode via the surface strap.
    • 半导体器件包括半导体衬底,设置在半导体衬底上的绝缘膜,绝缘膜包括开口部分,嵌入在开口部分中的表面带,表面带包括半导体层,反应防止膜设置在表面上 带,反应防止膜包括与绝缘膜不同的材料,设置在半导体衬底中的沟槽电容器的存储电极,与表面带电连接的存储电极和设置在表面上的源极/漏极区域 所述源极/漏极区域经由所述表面带与所述存储电极电连接。