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21. 发明申请

US20060027452A1 Substrate processing apparatus and substrate plating apparatus 审中-公开
标题翻译：基板处理装置和基板电镀装置
公开(公告)号：US20060027452A1
公开(公告)日：2006-02-09
申请号：US11235335
申请日：2005-09-27
申请人： Koji Mishima , Junji Kunisawa , Natsuki Makino , Norio Kimura , Hiroaki Inoue , Kenji Nakamura , Moriji Matsumoto , Takahiro Nanjo , Mitsuko Odagaki
发明人： Koji Mishima , Junji Kunisawa , Natsuki Makino , Norio Kimura , Hiroaki Inoue , Kenji Nakamura , Moriji Matsumoto , Takahiro Nanjo , Mitsuko Odagaki
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： H01L21/67109 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67778 , H01L21/681
摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.
摘要翻译：基板处理装置以限定在半导体基板中的精细互连图案或沟槽中填充诸如铜等的金属。基板处理装置具有用于放置基板盒以装载和卸载基板的装载/卸载单元，用于处理基板的基板处理单元，以及用于在装载/卸载单元和卸载单元之间传送基板的传送机器人底物处理单元。装载/卸载单元，基板处理单元和传送机器人安装在单个设施中。装载/卸载单元具有可水平旋转的旋转台，用于将基板盒定位在检测装载/卸载单元中的基板盒的位置，并用传送机器人从基板盒移除基板。

22. 再颁专利

USRE38826E1 Apparatus for and method for polishing workpiece 有权
标题翻译：用于抛光工件的设备和方法
公开(公告)号：USRE38826E1
公开(公告)日：2005-10-11
申请号：US09589388
申请日：2000-06-08
申请人： Masamichi Nakashiba , Norio Kimura , Isamu Watanabe , Kaori Yoshida
发明人： Masamichi Nakashiba , Norio Kimura , Isamu Watanabe , Kaori Yoshida
IPC分类号： B24B37/30 , B24B49/16 , B24B1/00
CPC分类号： B24B37/30 , B24B49/16
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
摘要翻译：用于抛光诸如半导体晶片的工件的抛光装置具有带有抛光表面的转台和用于保持工件的顶环，并且在第一次压制下将工件压靠在抛光表面上。抛光装置具有用于供应加压流体的加压流体源和设置在顶环的保持表面中的多个开口，用于喷射从加压流体源供应的加压流体。每个具有开口的多个区域被限定在保持表面上，使得加压流体可以选择性地从相应区域中的开口排出。

23. 发明授权

US06626736B2 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06626736B2
公开(公告)日：2003-09-30
申请号：US09893625
申请日：2001-06-29
申请人： Manabu Tsujimura , Norio Kimura
发明人： Manabu Tsujimura , Norio Kimura
IPC分类号： B24B100
CPC分类号： B24B37/04 , B24B21/04 , B24B37/005 , B24B49/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面，并且允许抛光垫被自动更换，而不会停止抛光台的旋转或循环运动。抛光装置包括用于进行旋转或循环运动的抛光台，可垂直移动地设置在抛光台上方的用于可移除地保持待抛光工件的顶环，可绕其自身轴线旋转并可与抛光台一起移动的一对辊以及抛光垫，其被卷绕在其中一个辊上并且被供给到抛光台的上表面朝向另一个辊。

24. 再颁专利

USRE38228E1 Polishing apparatus 失效
标题翻译：抛光设备和方法
公开(公告)号：USRE38228E1
公开(公告)日：2003-08-19
申请号：US08789304
申请日：1997-01-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

25. 发明授权

US06558229B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06558229B2
公开(公告)日：2003-05-06
申请号：US09760823
申请日：2001-01-17
申请人： Norio Kimura , Hideji Isobe , Kazuo Shimizu , Hiroyuki Osawa
发明人： Norio Kimura , Hideji Isobe , Kazuo Shimizu , Hiroyuki Osawa
IPC分类号： B24B4910
CPC分类号： B24B37/013 , B24B49/04 , B24B49/10 , H01L21/30625
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
摘要翻译：抛光装置用于抛光诸如半导体晶片的基板，并且具有能够连续地检测导电层的厚度的传感器。抛光装置包括具有抛光表面的抛光台和用于将基板保持并压靠在抛光表面上以抛光基板的表面的顶环。诸如涡电流传感器的传感器设置在抛光台的抛光表面下方，用于测量在基板表面上形成的导电层的厚度。

26. 发明授权

US06544111B1 Polishing apparatus and polishing table therefor 有权
标题翻译：抛光设备及抛光台
公开(公告)号：US06544111B1
公开(公告)日：2003-04-08
申请号：US09485862
申请日：2000-02-17
申请人： Norio Kimura , Yu Ishii
发明人： Norio Kimura , Yu Ishii
IPC分类号： B24B722
CPC分类号： B24B37/11 , B24B37/015
摘要： A polishing apparatus can strictly control the degree of material removal by providing close control over the operating temperature in the polishing table (12). The polishing apparatus has a polishing table (12) and a workpiece holder (14) for pressing a workpiece (W) towards the polishing table (12). The polishing table (12) has a polishing section (30) or a polishing tool attachment section at a surface thereof and a thermal medium passage (32) formed along the surface. The thermal medium passage (32) has a plurality of temperature adjustment passages provided respectively in a plurality of temperature adjustment regions which are formed by radially dividing a surface area of the polishing table (12).
摘要翻译：抛光装置可以通过对抛光台（12）中的工作温度进行紧密控制来严格控制材料去除的程度。抛光装置具有用于将工件（W）朝向抛光台（12）按压的研磨台（12）和工件保持器（14）。抛光台（12）的表面具有抛光部（30）或抛光工具安装部，沿着表面形成有热介质通路（32）。热介质通道（32）具有多个温度调节通道，分别设置在通过径向分割抛光台（12）的表面积而形成的多个温度调节区域中。

27. 发明授权

US06439980B1 Workpiece carrier and polishing apparatus having workpiece carrier 失效
标题翻译：具有工件载体的工件载体和抛光装置
公开(公告)号：US06439980B1
公开(公告)日：2002-08-27
申请号：US09679307
申请日：2000-10-06
申请人： Norio Kimura
发明人： Norio Kimura
IPC分类号： B24B500
CPC分类号： B24B37/30 , B24B41/042
摘要： A workpiece carrier has a top ring body for holding a workpiece, a drive shaft for rotating the top ring body and moving the top ring body toward a turntable to press the workpiece against a polishing surface, and a universal joint for transmitting a pressing force from the drive shaft to the top ring body while allowing the drive shaft and the top ring body to be tilted relative to each other. The universal joint includes two members having curved surfaces formed along arcs having a predetermined radius of curvature from a center positioned on a surface of the workpiece which is held in contact with the polishing surface on the turntable, and four rollers held in rolling contact with the curved surfaces. Two of the rollers held in rolling contact with each respective two of the curved surfaces to allow the top ring body to be tilted relative to the drive shaft about a point positioned on the surface which is held in contact with the polishing surface on the turntable.
摘要翻译：工件托架具有用于保持工件的顶环体，用于使顶环体旋转的驱动轴，并将顶环体朝向转盘移动，以将工件压靠在研磨面上;以及万向节，用于将压力从驱动轴到顶环体，同时允许驱动轴和顶环体相对于彼此倾斜。万向接头包括两个构件，其具有沿着弧形形成的弯曲表面，该弧形表面具有预定的曲率半径，该中心位于工件的与转台上的抛光表面保持接触的表面上的中心，并且保持与滚子接触的四个辊曲面。两个辊保持与每个相应的两个弯曲表面滚动接触，以允许顶环体相对于驱动轴倾斜，位于与转台上的抛光表面保持接触的表面上的点上。

28. 发明授权

US06364752B1 Method and apparatus for dressing polishing cloth 失效
标题翻译：抛光布修整方法和装置
公开(公告)号：US06364752B1
公开(公告)日：2002-04-02
申请号：US08881616
申请日：1997-06-25
申请人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
发明人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
IPC分类号： B24B722
CPC分类号： B24B53/017 , B24B37/005 , B24B49/00
摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.
摘要翻译：通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。通过在抛光布的径向方向的径向位置处测量抛光布的表面的高度来进行修整，根据测量的高度确定修整器相对于转盘的旋转速度的转速并且在转台和修整器旋转的同时通过将修整器压靠抛光布来修整抛光布。修整器具有环形金刚石颗粒层或环形SiC层。

29. 发明授权

US06328629B1 Method and apparatus for polishing workpiece 失效
标题翻译：抛光工件的方法和设备
公开(公告)号：US06328629B1
公开(公告)日：2001-12-11
申请号：US09026122
申请日：1998-02-19
申请人： Tetsuji Togawa , Norio Kimura , Koji Ono
发明人： Tetsuji Togawa , Norio Kimura , Koji Ono
IPC分类号： B24B4908
CPC分类号： B24B37/30 , B24B37/0053 , B24B37/013 , B24B49/08 , B24B49/16
摘要： A workpiece such as a semiconductor wafer is held by a top ring, and a lower surface of the workpiece is polished to a flat mirror finish by being pressed against a polishing surface of the turntable while the top ring and the turntable are rotated. While the workpiece is being polished, at least one of the pressure and the flow rate of a fluid which is supplied to an upper surface of the workpiece is detected. When at least one of the detected pressure and the detected flow rate changes, the polishing of the workpiece is stopped.
摘要翻译：诸如半导体晶片的工件由顶环保持，并且当顶环和转盘旋转时，通过被压靠在转盘的抛光表面上而将工件的下表面抛光成平坦的镜面。当工件被抛光时，检测供给到工件的上表面的流体的压力和流速中的至少一个。当检测到的压力和检测到的流量中的至少一个改变时，停止对工件的抛光。

30. 发明授权

US06196903B1 Workpiece carrier and polishing apparatus having workpiece carrier 失效
标题翻译：具有工件载体的工件载体和抛光装置
公开(公告)号：US06196903B1
公开(公告)日：2001-03-06
申请号：US09210899
申请日：1998-12-16
申请人： Norio Kimura
发明人： Norio Kimura
IPC分类号： B24B2900
CPC分类号： B24B37/30 , B24B41/042
摘要： A workpiece carrier has a top ring body for holding a workpiece, a drive shaft for rotating the top ring body and moving the top ring body toward a turntable to press the workpiece against a polishing surface, and a universal joint for transmitting a pressing force from the drive shaft to the top ring body while allowing the drive shaft and the top ring body to be tilted relatively to each other. The universal joint includes two members having curved surfaces formed along arcs having a predetermined radius of curvature from a center positioned on a surface of the workpiece which is held in contact with the polishing surface on the turntable, and four rollers held in rolling contact with the curved surfaces. Two of the rollers are held in rolling contact with each respective two of the curved surfaces to allow the top ring body to be tilted relatively to the drive shaft about a point positioned on the surface which is held in contact with the polishing surface on the turntable.
摘要翻译：工件托架具有用于保持工件的顶环体，用于使顶环体旋转的驱动轴，并将顶环体朝向转盘移动，以将工件压靠在研磨面上;以及万向节，用于将压力从驱动轴到顶环体，同时允许驱动轴和顶环体相对于彼此倾斜。万向接头包括两个构件，其具有沿着弧形形成的弯曲表面，该弧形表面具有预定的曲率半径，该中心位于工件的与转台上的抛光表面相接触的表面上的中心，以及与滚子接触的四个辊曲面。两个辊子与每个相应的两个弯曲表面保持滚动接触，以允许顶环体相对于驱动轴倾斜，位于与转台上的抛光表面保持接触的表面上的点上。

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