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    • 22. 发明授权
    • Semiconductor laser and method of manufacturing the same
    • 半导体激光器及其制造方法
    • US06512783B1
    • 2003-01-28
    • US09453546
    • 1999-12-03
    • Tsuyoshi YamamotoHajime ShojiTakayuki WatanabeTakuya FujiiHirohiko Kobayashi
    • Tsuyoshi YamamotoHajime ShojiTakayuki WatanabeTakuya FujiiHirohiko Kobayashi
    • H01S500
    • B82Y20/00H01S5/2205H01S5/227H01S5/2275H01S5/34306H01S5/3434H01S2304/04
    • There is provided a semiconductor laser which comprises a first cladding layer formed of compound semiconductor having first conductivity type impurity and having a mesa-shaped projection, an active layer formed on the projection like a stripe and having side surfaces which are inclined at an angle of more than 70 degrees but less than 90 degrees relative to an upper surface of the first cladding layer, buried layers formed on both sides of the projection and having second conductivity type impurity, current blocking layers each having one end which contacts a virtual surface obtained by extending upward a side surface of the active layer and having a first facet which extends downward from the one end and is inclined by about 55 degrees relative to the upper surface of the first cladding layer and formed on each buried layer and having the first conductivity type impurity, and second cladding layers formed on the current blocking layers and the active layer and having the second conductivity type impurity.
    • 提供了一种半导体激光器,其包括由具有第一导电类型杂质并具有台面状突起的化合物半导体形成的第一包层,活性层形成在条状的突出部上,并且具有倾斜角度为 相对于第一包层的上表面大于70度但小于90度,形成在突起的两侧并具有第二导电类型杂质的掩埋层,每个具有一端的虚拟表面的电流阻挡层与虚拟表面接触, 向上延伸有源层的侧表面,并且具有从一端向下延伸的第一小面,并相对于第一包覆层的上表面倾斜约55度并形成在每个掩埋层上并且具有第一导电类型 杂质和形成在电流阻挡层和活性层上并具有第二导管的第二覆层 反射型杂质。
    • 25. 发明授权
    • Complex coupling MQW semiconductor laser
    • 复耦MQW半导体激光器
    • US06850550B2
    • 2005-02-01
    • US09805182
    • 2001-03-14
    • Hirohiko KobayashiTsutomu IshikawaHajime Shoji
    • Hirohiko KobayashiTsutomu IshikawaHajime Shoji
    • H01L29/06H01S5/12H01S5/20H01S3/08H01S5/00
    • H01S5/1228H01S5/1231H01S5/2086H01S5/209
    • A method of manufacturing a distributed feedback semiconductor laser, has the steps of: growing on a semiconductor substrate a lamination of alternately stacked lower barrier layer and lower well layer having a band gap narrower than the lower barrier layer, to form a lower quantum well structure; growing an intermediate layer on an uppermost lower well layer, the intermediate layer having a band gap broader than the lower well and a thickness thicker than the lower barrier layer; growing on the intermediate layer a lamination of alternately stacked upper well layer and upper barrier layer having a band gap broader than the upper well layer and a thickness thinner than the intermediate layer, to form an upper quantum well structure; forming a mask on the upper quantum well structure, the mask having periodical pattern; by using the mask as an etching mask, etching the upper quantum well structure in a periodical shape by using the intermediate layer as an etching margin layer; and removing the mask. Complex coupling DFB lasers with a small variation in characteristics can be provided.
    • 制造分布式反馈半导体激光器的方法具有以下步骤:在半导体衬底上生长具有比下阻挡层窄的带隙的交替堆叠的下阻挡层和下阱层的叠层,以形成较低量子阱结构 ; 在最上面的下阱层上生长中间层,所述中间层具有比下阱更宽的带隙和比下阻挡层厚的厚度; 在中间层上生长具有比上部阱层宽的带隙和比中间层更薄的厚度的交替层叠的上部阱层和上部阻挡层的叠层以形成上部量子阱结构; 在上量子阱结构上形成掩模,掩模具有周期性图案; 通过使用掩模作为蚀刻掩模,通过使用中间层作为蚀刻边缘层来蚀刻周期形状的上量子阱结构; 并取下面罩。 可以提供具有小的特性变化的复耦合DFB激光器。
    • 30. 发明授权
    • Robot path planning method where bending owing to load is taken into
consideration
    • 考虑负载弯曲的机器人路径规划方法
    • US6157155A
    • 2000-12-05
    • US402606
    • 1995-03-13
    • Hirohiko Kobayashi
    • Hirohiko Kobayashi
    • B25J9/10B25J9/16B25J9/18G05B19/18G05B19/404G05B19/4093G05B19/408
    • B25J9/1664B25J9/1674G05B2219/39364G05B2219/40523G05B2219/41167
    • The present invention relates to a robot path planning method for determining the path of a robot, taking into consideration the bending effect of the robot path when heavy tools are load onto the robot. Specifically, straight line P'-Q' to be actually drawn by the distal end of the robot tool is calculated by using the positions P and Q of the distal end of the tool at the start point and at the end point of the straight line recognized by the robot controller. And, the interpolation points H1', H2', H3', . . . are set on this line P'-Q'. Then, the bending amount .DELTA..theta.pj and .DELTA..theta.qj at the start point P' and at the end point Q' of this line P'-Q' are respectively determined. And, the bending amount at each interpolation point H1', H2', . . . are calculated from these bending amounts .DELTA..theta.pj and .DELTA..theta.qj, and the position on the line P'-Q' of each interpolation point. Then, the values obtained by subtracting from each interpolation point H1', H2', . . . corresponding bending amounts are set as the interpolation points H1, H2, H3, . . . to be actually used in the robot controller.
    • 本发明涉及一种用于确定机器人的路径的机器人路径规划方法,考虑到当重型工具被加载到机器人上时机器人路径的弯曲效应。 具体来说,通过使用工具的前端的位置P和Q在直线的起始点和终点处计算由实际上由机器人工具的远端拉出的直线P'-Q' 被机器人控制器识别。 并且,内插点H1',H2',H3',。 。 。 被设置在该线P'-Q'上。 然后,分别确定该线P'-Q'的起始点P'和终点Q'处的弯曲量DELTAθpj和DELTAθqj。 并且,每个内插点H1',H2',...的弯曲量。 。 。 由这些弯曲量DELTAθj和DELTAθqj以及每个内插点的线P'-Q'上的位置计算。 然后,通过从每个内插点H1',H2',...减去获得的值。 。 。 相应的弯曲量被设置为内插点H1,H2,H3。 。 。 实际上用于机器人控制器。