会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 21. 发明授权
    • Self-bias measuring method, apparatus thereof and electrostatic chucking
apparatus
    • 自偏置测量方法,其设备和静电吸附装置
    • US5557215A
    • 1996-09-17
    • US239982
    • 1994-05-09
    • Hiroaki SaekiMasaki Kondo
    • Hiroaki SaekiMasaki Kondo
    • G01R29/24H01J37/32H01L21/683G01R31/26
    • H01J37/32935H01L21/6833G01R29/24
    • According to the present invention, there are provided a self-bias measurement method of measuring the self-bias voltage of an object when the object is subjected to a plasma process by using a plasma generated between a pair of electrodes, the object being held, by means of electrostatic chucking means having an electrostatic chucking electrode, on one of the pair of electrodes situated in a processing chamber, the method including the steps of detecting a leak current between the object and the electrostatic chucking electrode while varying the DC voltage applied to the electrostatic chucking electrode, and calculating the self-bias voltage of the object on the basis of the leak current detected, an apparatus for measuring the self-bias, and an electrostatic chucking apparatus having means capable of measuring the self-bias.
    • 根据本发明,提供了一种自偏置测量方法,其通过使用在一对电极之间产生的等离子体处理对物体进行等离子体处理时,测量物体的自偏压,被保持物体, 通过具有静电夹持电极的静电吸附装置,位于处理室中的一对电极中的一个电极上,该方法包括以下步骤:检测物体和静电吸持电极之间的漏电流,同时改变施加到 静电吸附电极,并且基于检测到的泄漏电流来计算物体的自偏压,用于测量自偏压的装置,以及具有能够测量自偏压的装置的静电夹持装置。
    • 22. 发明申请
    • FUEL INJECTOR HOLDER
    • 燃油喷射器支架
    • US20120031996A1
    • 2012-02-09
    • US12852905
    • 2010-08-09
    • William T. HarveySteven J. MillerHiroaki Saeki
    • William T. HarveySteven J. MillerHiroaki Saeki
    • B05B15/00B23P19/00
    • F02M55/005F02M69/465F02M2200/852F02M2200/853Y10T29/53
    • A fuel injector for an internal combustion engine having an elongated body with a fuel inlet end and a fuel discharge end. The injector body includes an outwardly extending plate attached at a position between its ends and this plate includes at least one radially outwardly extending tab so that the cross-sectional shape of the plate is noncircular. A fuel cup receives the fuel inlet end of the fuel injector and includes a radially inwardly extending ledge at a mid position of the cavity. This ledge includes a through bore complementary in shape to the shape of the plate so that, with the fuel injector and plate aligned at a predetermined angular assembly position, the plate passes through the ledge upon insertion of the fuel injector into the cavity. Thereafter, rotation of the fuel injector and attached plate to a locking position positions the tabs above the ledge thus locking the fuel injector to the fuel cup.
    • 一种用于内燃机的燃料喷射器,具有具有燃料入口端和燃料排出端的细长主体。 喷射器主体包括附接在其端部之间的位置处的向外延伸的板,并且该板包括至少一个径向向外延伸的突片,使得板的横截面形状是非圆形的。 燃料杯接收燃料喷射器的燃料入口端,并且在空腔的中间位置包括径向向内延伸的凸缘。 该凸缘包括与板的形状互补的通孔,使得当燃料喷射器和板在预定的角度组装位置对准时,板将燃料喷射器插入空腔中时通过凸缘。 此后,燃料喷射器和附接板旋转到锁定位置将突出部定位在突出部上方,从而将燃料喷射器锁定到燃料杯。
    • 23. 发明授权
    • Semiconductor processing system
    • 半导体处理系统
    • US07857569B2
    • 2010-12-28
    • US11774335
    • 2007-07-06
    • Tsutomu HirokiHiroaki Saeki
    • Tsutomu HirokiHiroaki Saeki
    • H01L21/677
    • H01L21/68742H01L21/68H01L21/68714H01L21/6875Y10S414/139
    • A supporting mechanism (12A) is used for transfer-ring a target substrate (W) in cooperation with a transfer arm (32), in a semiconductor processing system. The supporting mechanism includes first and second holding portions (38A to 38C, 40A to 40C) each configured to be moved up and down and transfer a substrate to and from the transfer arm. The first and second holding portions are configured to be moved relative to each other in a vertical direction without spatially interfering with each other, and support substrates at substantially the same horizontal coordinate position. The supporting mechanism further includes first and second drives (46, 48) configured to move the first and second holding portions up and down, and a controller (68) configured to control the first and second drives. The controller is arranged to control the first and second drives to alternatively support a substrate by the first and second holding portions.
    • 在半导体处理系统中,支撑机构(12A)用于与传送臂(32)协作传送环目标衬底(W)。 支撑机构包括每个被配置为上下移动并将基板传送到传送臂和从传送臂传送基板的第一和第二保持部分(38A至38C,40A至40C)。 第一保持部和第二保持部被配置为在垂直方向上相对于彼此移动而没有彼此空间干涉,并且将基板支撑在基本上相同的水平坐标位置。 支撑机构还包括构造成使第一和第二保持部分上下移动的第一和第二驱动器(46,48)以及被配置为控制第一和第二驱动器的控制器(68)。 控制器被布置成控制第一和第二驱动器以由第一和第二保持部分交替地支撑衬底。
    • 27. 发明申请
    • SEMICONDUCTOR PROCESSING SYSTEM
    • 半导体加工系统
    • US20080187416A1
    • 2008-08-07
    • US11774335
    • 2007-07-06
    • Tsutomu HirokiHiroaki Saeki
    • Tsutomu HirokiHiroaki Saeki
    • H01L21/67
    • H01L21/68742H01L21/68H01L21/68714H01L21/6875Y10S414/139
    • A supporting mechanism (12A) is used for transfer-ring a target substrate (W) in cooperation with a transfer arm (32), in a semiconductor processing system. The supporting mechanism includes first and second holding portions (38A to 38C, 40A to 40C) each configured to be moved up and down and transfer a substrate to and from the transfer arm. The first and second holding portions are configured to be moved relative to each other in a vertical direction without spatially interfering with each other, and support substrates at substantially the same horizontal coordinate position. The supporting mechanism further includes first and second drives (46, 48) configured to move the first and second holding portions up and down, and a controller (68) configured to control the first and second drives. The controller is arranged to control the first and second drives to alternatively support a substrate by the first and second holding portions.
    • 在半导体处理系统中,支撑机构(12A)用于与传送臂(32)协作传送环目标衬底(W)。 支撑机构包括构造成上下移动的第一和第二保持部分(38A至38C,40A至40C),并将基板传送到传送臂和从传送臂传送。 第一保持部和第二保持部被配置为在垂直方向上相对于彼此移动而没有彼此空间干涉,并且将基板支撑在基本上相同的水平坐标位置。 支撑机构还包括构造成使第一和第二保持部分上下移动的第一和第二驱动器(46,48)以及被配置为控制第一和第二驱动器的控制器(68)。 控制器被布置成控制第一和第二驱动器以由第一和第二保持部分交替地支撑衬底。
    • 28. 发明授权
    • Fuel supply system for internal combustion engine
    • 内燃机燃油供应系统
    • US07013869B2
    • 2006-03-21
    • US10681245
    • 2003-10-09
    • Masami NaganoTakanobu IchiharaHiroaki Saeki
    • Masami NaganoTakanobu IchiharaHiroaki Saeki
    • F02D41/00
    • F02M69/32F02D41/3094F02M31/135F02M31/18F02M53/02F02M69/325Y02T10/126
    • The present invention provides an electronically-controlled fuel injector, for an internal combustion engine, comprising a downstream fuel injection valve located near an air intake port of each cylinder or inside a cylinder, an air intake passage which bypasses the throttle valve located upstream of a downstream fuel injection valve, and a fuel vaporizing section including an upstream fuel injection valve, and a heater which vaporizes fuel injected from the upstream fuel injection valve; and further having an air intake port located upstream of the throttle valve, air flow control section for controlling an amount of air, said fuel vaporizing section, vaporized-fuel branch section for supplying vaporized fuel to each cylinder, and a vaporized-fuel distribution passage which extends from the vaporized-fuel branch section to an opening located in each air intake pipe located downstream of the throttle valve.
    • 本发明提供了一种用于内燃机的电子控制燃料喷射器,包括位于每个气缸的进气口附近或气缸内的下游燃料喷射阀,绕过位于气缸的上游的节流阀的进气通道 下游燃料喷射阀和包括上游燃料喷射阀的燃料蒸发部和使从上游燃料喷射阀喷射的燃料蒸发的加热器; 并且还具有位于节流阀上游的进气口,用于控制空气量的空气流量控制部分,所述燃料蒸发部分,用于向每个气缸供应蒸发燃料的蒸发燃料分支部分,以及蒸发燃料分配通道 其从蒸发燃料分支部分延伸到位于节流阀下游的每个进气管中的开口。
    • 29. 发明授权
    • Positioning substrate for semiconductor process
    • 半导体工艺定位基板
    • US06950721B2
    • 2005-09-27
    • US10391574
    • 2003-03-20
    • Makoto TashiroKeisuke KondohHiroaki Saeki
    • Makoto TashiroKeisuke KondohHiroaki Saeki
    • H01L21/027H01L21/02H01L21/68G06F7/00
    • H01L21/68Y10S414/135
    • A positioning substrate is used for performing a teaching operation on a transfer mechanism for transferring a target substrate in a semiconductor processing system. The positioning substrate includes a substrate body made of a material selected from the group consisting of the same material as the target substrate, semiconductor, compound semiconductor, and ceramic. The substrate body has an outer contour sized to be handled by the transfer mechanism as an alternative to the target substrate. The positioning substrate also includes a positioning assistant having a combination of a positioning hole and a positioning reference line formed in the substrate body. The positioning hole is formed to penetrate the substrate body in a thickness direction. The positioning reference line is formed on a surface of the substrate body to extend across an opening of the positioning hole and have a predetermined width.
    • 定位基板用于对在半导体处理系统中传送目标基板的转印机构进行示教操作。 定位基板包括由与靶基板,半导体,化合物半导体和陶瓷相同的材料组成的组中选择的材料制成的基板主体。 基板主体具有外形轮廓,其尺寸设置成由作为目标基板的替代的传送机构来处理。 定位基板还包括具有定位孔和形成在基板主体中的定位基准线的组合的定位辅助件。 定位孔形成为在厚度方向上穿透基体。 定位参考线形成在基体的表面上,以延伸穿过定位孔的开口并具有预定的宽度。