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    • 21. 发明申请
    • Radiation-sensitive resin composition for optical waveguides, optical waveguide, and method for manufacturing optical waveguide
    • 用于光波导的辐射敏感性树脂组合物,光波导和用于制造光波导的方法
    • US20070081782A1
    • 2007-04-12
    • US11524184
    • 2006-09-21
    • Yukio MaedaYuuichi Eriyama
    • Yukio MaedaYuuichi Eriyama
    • G02B6/00
    • C08F290/12G02B1/046G02B1/048G02B6/1221G03F7/001G03F7/033C08L33/08C08L33/10
    • A radiation-sensitive resin composition for optical waveguides having high dimensional accuracy, good transmission characteristics, and excellent bending resistance is provided. The composition comprises: (A) a poly(meth)acrylate having a repeating unit represented by the following general formula (1) (in the formula, R1 is a hydrogen atom or a methyl group, R3 is a (meth)acryloyl group, X is a bivalent organic group); (B) an urethane (meth)acrylate compound which is a reaction product of a polyester polyol compound, a polyisocyanate compound, and a (meth) acrylate having a hydroxyl group; (C) a compound having at least one ethylenically unsaturated group and having a boiling point of 130 degree C. or higher under 0.1 MPa other than components (A) and (B); and (D) a photo-radical polymerization initiator. The composition was used as the material for the lower clad layer 12 of the optical waveguide 24, and the like.
    • 提供了具有高尺寸精度,良好的透射特性和优异的抗弯曲性的光波导的辐射敏感性树脂组合物。 该组合物包含:(A)具有由以下通式(1)表示的重复单元的聚(甲基)丙烯酸酯(式中,R 1是氢原子或甲基,R 3是(甲基)丙烯酰基,X是二价有机基团); (B)聚酯多元醇化合物,多异氰酸酯化合物和具有羟基的(甲基)丙烯酸酯的反应产物的氨基甲酸酯(甲基)丙烯酸酯化合物; (C)除了组分(A)和(B)之外,在0.1MPa以下具有至少一个烯键式不饱和基团且沸点为130℃以上的化合物; 和(D)光自由基聚合引发剂。 该组合物用作光波导24的下包层12的材料等。
    • 26. 发明授权
    • Diamond tool
    • 钻石工具
    • US5022797A
    • 1991-06-11
    • US343830
    • 1989-04-24
    • Masashi SawaMasami MasudaYukio MaedaRyu Itoh
    • Masashi SawaMasami MasudaYukio MaedaRyu Itoh
    • B23B27/20
    • B23B27/20Y10T407/27Y10T407/28Y10T82/10
    • A diamond tool for the mirror-finish cutting of non-ferrous materials and a method of manufacturing the same are provided. The diamond tool has a main cutting edge and minute side cutting edges formed at the opposite ends of the main cutting edge so as to intersect the main cutting edge at an angle. The dept .DELTA. of chamfer of the side cutting edge is 1.5 to 5 times the depth of tears formed in the machined surface (0.1 .mu.m.ltoreq..DELTA..ltoreq.1 .mu.m) and the length l.sub.2 of the side cutting edged is 1.5 to 10 times the feed of the diamond tool (0.02 mm.ltoreq.l.sub.2 .ltoreq.0.8 mm). The rake face of the diamond tool comprises two rake faces and two side rake faces. A tool grinding surface plate for manufacturing the diamond tool has a flat surface for grinding the rake faces, and a circumferential tapered surface for grinding the side rake faces. The end relief surface and the rake face of the diamond tool is in the (001) zone of the single crystal diamond tip thereof, and the crystal orientation of the end relief surface is in the range of (150) and (010) or a crystallographic equivalent.
    • 提供了一种用于有色金属材料的镜面切割的金刚石工具及其制造方法。 金刚石工具具有形成在主切削刃的相对端处的主切削刃和微小侧切削刃,以与主切削刃成一定角度相交。 侧切削刃的斜切部的DELTA为加工面上形成的撕裂深度的1.5〜5倍(0.1μm×DELTA <1μm),边切边的长度l2为1.5 至金刚石工具的进给量的10倍(0.02mm±12mm)。 金刚石工具的前刀面包括两个前刀面和两个前刀面。 用于制造金刚石工具的工具研磨面板具有用于研磨前刀面的平坦表面和用于研磨侧耙面的圆周锥形表面。 金刚石工具的端部浮雕表面和前刀面在其单晶金刚石尖端的(001)区域中,并且端部浮雕表面的晶体取向在(150)和(010)的范围内,或者 晶体相当。