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21. 发明授权

US5476811A Method of growing epitaxial layers 失效
标题翻译：生长外延层的方法
公开(公告)号：US5476811A
公开(公告)日：1995-12-19
申请号：US409944
申请日：1995-03-23
申请人： Toshio Fujii , Adarsh Sandhu
发明人： Toshio Fujii , Adarsh Sandhu
IPC分类号： H01L21/20 , H01S5/223 , H01S5/32 , H01S5/323 , C36B23/68
CPC分类号： H01S5/32308 , H01L21/02395 , H01L21/02433 , H01L21/02463 , H01L21/02505 , H01L21/02546 , H01L21/0262 , H01L21/02631 , H01S5/2238 , H01S5/3202 , H01S5/3203
摘要： A method of growing a plurality of epitaxial layers each having a property which is different from each other simultaneously on a common substrate comprises steps of forming at least a first crystal surface and a second crystal surface which are crystallographically non-equivalent to each other on the substrate, introducing particles comprising constituent elements of the epitaxial layers into a region in the vicinity of the substrate, the particles including at least metal-organic molecules containing one of the elements constituting the epitaxial layers, decomposing the metal-organic molecules such that the layer constituting element therein is released as a result of the decomposition, and depositing the aforesaid particles including the element released by the decomposition of the metal-organic molecules on the first and second crystal surfaces so that a first epitaxial layer and a second epitaxial layer, respectively differing in properties from each other, are grown on respective the first and second crystal surfaces, the step of deposition being performed such that the growth of the first and second epitaxial layers is controlled by the decomposition of the metal-organic molecule.
摘要翻译：在公共衬底上同时生长具有彼此不同的性质的多个外延层的方法包括以下步骤：至少形成在第一晶体表面和第二晶体表面上的晶体学上彼此不相同的衬底，将包含外延层的构成元素的粒子引入到衬底附近的区域中，所述颗粒至少包含含有构成外延层的元素之一的金属有机分子，分解金属 - 有机分子，使得层作为分解的结果释放其中的构成元素，并且将包含通过金属 - 有机分子分解释放的元素的上述颗粒沉积在第一和第二晶体表面上，使得分别具有第一外延层和第二外延层不同的性质彼此分别生长第一和第二晶体表面，进行沉积步骤使得通过金属 - 有机分子的分解来控制第一和第二外延层的生长。

22. 发明授权

US5273811A Stretched, laminated film 失效
标题翻译：拉伸层压薄膜
公开(公告)号：US5273811A
公开(公告)日：1993-12-28
申请号：US911660
申请日：1992-07-13
申请人： Toshio Fujii , Toyomitsu Kondo , Kazuhiro Kato
发明人： Toshio Fujii , Toyomitsu Kondo , Kazuhiro Kato
IPC分类号： B32B27/08 , B65D65/40 , C08K5/103 , C08L23/10 , C08L23/14 , C08L23/20 , C08L23/22 , B32B27/32
CPC分类号： C08L23/10 , B32B27/08 , C08K5/103 , C08L23/142 , C08L23/20 , C08L23/22 , Y10S428/91 , Y10T428/24967 , Y10T428/2826 , Y10T428/31797 , Y10T428/31913
摘要： Disclosed herein is a stretched, laminated film comprising at least an outer layer, an intermediate layer and an inner layer,said outer layer and inner layer comprising a polypropylenes composition composed of 100 parts by weight of polypropylenes (A), 2 to 30 parts by weight of polybutene and/or polyisobutylene (B) and 0.2 to 5 parts by weight of a polyglycerin fatty acid ester (C), andsaid intermediate layer comprising polyesters (D).

23. 发明授权

US07754529B2 Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method 有权
标题翻译：倒装芯片安装体和安装这种倒装芯片安装体和凸块成型方法
公开(公告)号：US07754529B2
公开(公告)日：2010-07-13
申请号：US11814337
申请日：2006-02-02
申请人： Yoshihiro Tomita , Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Toshio Fujii
发明人： Yoshihiro Tomita , Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Toshio Fujii
IPC分类号： H01L21/00
CPC分类号： H05K3/3436 , H01L21/565 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/13099 , H01L2224/16238 , H01L2224/83205 , H01L2224/83801 , H01L2224/83886 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0285 , Y02P70/613 , H01L2224/05599
摘要： In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.
摘要翻译：在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供包含导电颗粒（12）的树脂（13），导电颗粒（12））和树脂（13）被加热和熔化，并且施加振动以使其流动。允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成用于以均匀的方式在这些端子之间建立电连接的连接器。

24. 发明申请

US20090203169A1 FLIP CHIP MOUNTING BODY AND METHOD FOR MOUNTING SUCH FLIP CHIP MOUNTING BODY AND BUMP FORMING METHOD 有权
标题翻译：滑动芯片安装体和安装这种切片芯片安装体和形成方法的方法
公开(公告)号：US20090203169A1
公开(公告)日：2009-08-13
申请号：US11814337
申请日：2006-02-02
申请人： Yoshihiro Tomita , Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Toshio Fujii
发明人： Yoshihiro Tomita , Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Toshio Fujii
IPC分类号： H01L21/60 , H01L21/768
CPC分类号： H05K3/3436 , H01L21/565 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/13099 , H01L2224/16238 , H01L2224/83205 , H01L2224/83801 , H01L2224/83886 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0285 , Y02P70/613 , H01L2224/05599
摘要： In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.
摘要翻译：在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供含有导电颗粒（12）的树脂（13），导电颗粒（12））和树脂（13）被加热和熔化，并且施加振动以使其流动。允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成用于以均匀的方式在这些端子之间建立电连接的连接器。

25. 发明授权

US07553956B2 Polynucleotide probe and primer for detecting beer-clouding lactic acid bacteria and method of detecting beer-clouding lactic acid bacteria 失效
标题翻译：用于检测啤酒乳酸菌的多核苷酸探针和底物以及啤酒蕴含乳酸菌的检测方法
公开(公告)号：US07553956B2
公开(公告)日：2009-06-30
申请号：US10478404
申请日：2002-05-23
申请人： Toshio Fujii
发明人： Toshio Fujii
IPC分类号： C07H21/04 , C12Q1/68
CPC分类号： C12Q1/689 , G01N2333/335
摘要： An object of the present invention is to provide probes and primers for detecting beer-spoilage lactic acid bacteria with accuracy. The probes and primers for detecting beer-spoilage lactic acid bacteria according to the present invention each comprises a nucleotide sequence consisting of at least 15 nucleotides that hybridizes with the nucleotide sequence of SEQ ID NO: 1 or the complementary sequence thereof.
摘要翻译：本发明的目的是提供用于精确检测啤酒腐败乳酸菌的探针和底物。用于检测根据本发明的啤酒腐败乳酸菌的探针和引物各自包含由与SEQ ID NO：1的核苷酸序列或其互补序列杂交的至少15个核苷酸组成的核苷酸序列。

26. 发明申请

US20090108436A1 SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装
公开(公告)号：US20090108436A1
公开(公告)日：2009-04-30
申请号：US12099986
申请日：2008-04-09
申请人： Toshio Fujii , Masashi Funakoshi , Satoru Atsuta
发明人： Toshio Fujii , Masashi Funakoshi , Satoru Atsuta
IPC分类号： H01L23/485
CPC分类号： H05K3/305 , H01L21/486 , H01L23/3121 , H01L23/3142 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/15183 , H01L2924/181 , H05K3/0094 , H05K3/3452 , H05K2203/1394 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a semiconductor package, a semiconductor chip is adhered with an adhesive member, with a circuit face of the semiconductor chip facing upward, onto a circuit board including a plurality of interconnections, a plurality of through holes, wire bonding pads and a solder resist for protecting the interconnections and the through holes. A plurality of electrodes of the semiconductor chip are electrically connected to the plural wire bonding pads of the circuit board through wires. A concave is formed in the solder resist of the circuit board correspondingly to every through hole of the circuit board, and concaves present in a region opposing a rim portion of the semiconductor chip and a region surrounding the semiconductor chip are buried with a resin so as to attain a flat top face.
摘要翻译：在半导体封装中，半导体芯片用半导体芯片的电路面朝上的粘合部件粘接到包括多个互连的电路板上，多个通孔，引线接合焊盘和阻焊剂保护互连和通孔。半导体芯片的多个电极通过电线电连接到电路板的多个引线接合焊盘。对应于电路板的每个通孔，在电路板的阻焊剂中形成凹部，并且存在于与半导体芯片的边缘部分相对的区域中的凹部和围绕半导体芯片的区域被树脂掩埋，以便以达到平坦的顶面。

27. 发明授权

US07473922B2 Infrared detector 有权
标题翻译：红外探测器
公开(公告)号：US07473922B2
公开(公告)日：2009-01-06
申请号：US11447014
申请日：2006-06-06
申请人： Yasuhito Uchiyama , Toshio Fujii , Nobuyuki Kajihara , Hironori Nishino , Yusuke Matsukura
发明人： Yasuhito Uchiyama , Toshio Fujii , Nobuyuki Kajihara , Hironori Nishino , Yusuke Matsukura
IPC分类号： H01L29/06
CPC分类号： H01L31/035236 , B82Y20/00 , H01L29/155 , H01L31/035281 , H01L31/09 , H01L31/105 , Y02E10/50 , Y10S977/774 , Y10S977/932
摘要： At least one or more dark current reducing layers having a quantum well structure are provided at an end portion in a stacking direction of an infrared detecting section in which quantum dot layers are stacked.
摘要翻译：至少一个或多个具有量子阱结构的暗电流降低层设置在层叠有量子点层的红外线检测部的层叠方向的端部。

28. 发明授权

US07321496B2 Flexible substrate, multilayer flexible substrate and process for producing the same 有权
标题翻译：柔性基板，多层柔性基板及其制造方法
公开(公告)号：US07321496B2
公开(公告)日：2008-01-22
申请号：US11079316
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译：柔性基板包括：膜; 形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; 嵌入到形成在膜的前表面上的绝缘树脂层中的前侧布线图案和嵌入在形成在膜的背面上的绝缘树脂层中的背面布线图案; 以及位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个正面上的绝缘树脂层薄膜的表面和背面比薄膜厚。

29. 发明申请

US20050205294A1 Flexible substrate, Multilayer flexible substrate and process for producing the same 有权
标题翻译：柔性基板，多层柔性基板及其制造方法
公开(公告)号：US20050205294A1
公开(公告)日：2005-09-22
申请号：US11079316
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
IPC分类号： H05K1/03 , H05K1/16 , H05K3/20 , H05K3/38 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprising: (i) a film; (ii) an insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (iv) a via which is located between a front-sided wiring pattern and a rear-sided wiring pattern and serves to electrically connect between said front-sided wiring pattern and said rear-sided wiring pattern; wherein said insulating resin layer formed on each of said front face and said rear face of the said film is thicker than said film.
摘要翻译：一种柔性基板，包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的与所述前表面相对的表面的每一个上的绝缘树脂层; （iii）嵌入在所述膜的所述前表面上形成的绝缘树脂层中的前侧布线图案和嵌入在所述膜的所述背面上形成的绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于电连接在所述前侧布线图案和所述背面布线图案之间; 其中形成在所述膜的所述前表面和所述后表面的每一个上的所述绝缘树脂层比所述膜厚。

30. 发明申请

US20050205291A1 Flexible substrate having interlaminar junctions, and process for producing the same 有权
标题翻译：具有层间结合的柔性基板及其制造方法
公开(公告)号：US20050205291A1
公开(公告)日：2005-09-22
申请号：US11079371
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H01L21/60 , H05K1/00 , H05K1/11 , H05K3/10 , H05K3/20 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face, and (iii) a front-sided wiring pattern embedded in said insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (b) pressing a part of at least one of said front-sided wiring pattern and said rear-sided wiring pattern into the inside of said sheet member so that a part of said front-sided wiring pattern and a part of said rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译：一种制造柔性基材的方法，包括膜，绝缘树脂层和布线图案，所述方法包括以下步骤：（a）制备片状部件，其包括：（i）膜，（ii）绝缘树脂所述膜的前表面上形成的层和所述膜的与所述前表面相对的背面，以及（iii）嵌入在所述绝缘树脂层的所述前表面上形成的所述绝缘树脂层中的前侧布线图案膜和嵌入在形成在所述膜的所述背面上的绝缘树脂层中的背面布线图案; 和（b）将所述前侧布线图案和所述背面布线图案中的至少一个的一部分压入所述片状构件的内部，使得所述前侧布线图案的一部分和所述背面布线图案的一部分，双面布线图案彼此连接以形成结。

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